Coupling structure for inductive device

Patent metadata

Field	Value
Publication number	US-10164570-B2
Application number	US-201815866182-A
Country	US
Kind code	B2
Filing date	Jan 9, 2018
Priority date	Nov 8, 2013
Publication date	Dec 25, 2018
Grant date	Dec 25, 2018

Abstract

A circuit includes a coupling structure and a first inductive device. The coupling structure includes two or more conductive loops and a set of conductive paths electrically connecting the two or more conductive loops. The first inductive device is magnetically coupled with a first conductive loop of the two or more conductive loops.

First claim

What is claimed is:

1. An integrated circuit device comprising:
a first oscillator comprising a first inductive device;
a second oscillator being electrically separated from the first oscillator, the second oscillator comprising a second inductive device, the second inductive device and the first inductive device being separated by a first distance; and
a first continuous conductive material surrounding but electrically separated from both the first inductive device and the second inductive device, wherein the first continuous conductive material renders a mutual inductance between the first inductive device and the second inductive device independent of the first distance.

2. The integrated circuit device of claim 1 , wherein the first continuous conductive material comprises:
a first conductive loop;
a second conductive loop; and
a set of conductive paths electrically connecting the first conductive loop and the second conductive loop.

3. The integrated circuit device of claim 2 , wherein the first conductive loop is an octagon loop.

4. The integrated circuit device of claim 1 , wherein the first continuous conductive material is located in multiple interconnection layers.

5. The integrated circuit device of claim 1 , wherein the first continuous conductive material is located in at least two chips.

6. The integrated circuit device of claim 1 , wherein the first inductive device has a first signal port with a first port direction, the second inductive device has a second signal port with a second port direction different from the first port direction.

7. The integrated circuit device of claim 1 , wherein the first inductive device has a first signal port with a first port direction and the second inductive device has a second signal port with the first port direction.

8. An integrated circuit device comprising:
a first inductive device and a second inductive device separated by a first space located directly between the first inductive device and the second inductive device, the first inductive device being part of a first oscillator, the second inductive device being part of a second oscillator, the second oscillator being electrically separated from the first oscillator; and
a first conductive material encircling but not touching both the first inductive device and the second inductive device, the first conductive material extending into the first space.

9. The integrated circuit device of claim 8 , wherein the first conductive material comprises:
a first loop;
a second loop;
a first conductive path connecting the first loop to the second loop; and
a second conductive path connecting the first loop to the second loop.

10. The integrated circuit device of claim 9 , wherein the first conductive path crosses over the second conductive path.

11. The integrated circuit device of claim 9 , wherein the first conductive path has a first angled corner.

12. The integrated circuit device of claim 11 , wherein the second conductive path has a second angled corner.

13. The integrated circuit device of claim 12 , wherein the first conductive path crosses over the second conductive path.

14. An integrated circuit device comprising:
a first oscillator comprising a first inductive device;
a second oscillator comprising a second inductive device, the second oscillator being electrically separated from the first oscillator; and
a first continuous conductive material electrically separated from both the first inductive device and the second inductive device, the first continuous conductive material comprising:
a first loop encircling the first inductive device;
a second loop encircling the second inductive device; and
a connecting piece, the connecting piece being disposed directly between the first loop and the second loop.

15. The integrated circuit device of claim 14 , wherein the first continuous conductive material is located in multiple interconnection layers.

16. The integrated circuit device of claim 14 , wherein the first continuous conductive material is located in at least two chips.

17. The integrated circuit device of claim 14 , wherein the first inductive device has a first signal port with a first port direction and the second inductive device has a second signal port with a second port direction different from the first port direction.

18. The integrated circuit device of claim 14 , wherein the first loop is octagonal.

19. The integrated circuit device of claim 14 , wherein the first loop is circular.

20. The integrated circuit device of claim 14 , wherein the first inductive device has a first signal port with a first port direction and the second inductive device has a second signal port with the first port direction.

Assignees

• Taiwan Semiconductor Mfg Co Ltd

Inventors

• Chen Huan-Neng
• Jou Chewn-Pu

Classifications

• H01F38/14

  Inductive couplings {(for wireless supply or distribution of electric power using inductive coupling H02J50/10)} · CPC title

• H01F19/04

  Transformers or mutual inductances suitable for handling frequencies considerably beyond the audio range (resonant circuits H03H) · CPC title

• H03B5/1243 Primary

  the means comprising voltage variable capacitance diodes · CPC title

• H03B5/08

  with frequency-determining element comprising lumped inductance and capacitance · CPC title

• H03B5/1228

  the amplifier comprising one or more field effect transistors · CPC title