Bi-directional MOSFET cooling for an electric machine

Patent metadata

Field	Value
Publication number	US-10164504-B2
Application number	US-201514876823-A
Country	US
Kind code	B2
Filing date	Oct 7, 2015
Priority date	Oct 8, 2014
Publication date	Dec 25, 2018
Grant date	Dec 25, 2018

Abstract

A power module for an electric machine. The power module includes a thermally conductive base having opposite first and second surfaces. The first surface is adapted for mounting the power module in conductive thermal communication with a heat sink. A MOSFET superposes the base second surface and is in conductive thermal communication with the base. A MOSFET driver superposes the base second surface and is operatively connected to the MOSFET. The transference from the power module of heat generated by the MOSFET and the MOSFET driver from the power module is directed along a primary cooling path to the heat sink through the base and a secondary cooling path to ambient air. The primary and secondary cooling paths are separate from each other. An electronics package and an electric machine including a power module are also disclosed.

First claim

What is claimed is:

1. An electric machine comprising a stator, a rotor rotatable relative to the stator about a machine central axis, a fan rotatable with the rotor, a rear frame member fixed relative to the stator and an electronic package connected to the rear frame member, the electronic package comprising:
a cooling tower having opposite first and second axial ends spaced along a package central axis, the cooling tower comprising a metallic wall extending about the package central axis to define a radially outer wall surface; and
a plurality of power modules, each of the power modules including a thermally conductive base having opposite first and second surfaces, the first surface adapted for mounting the power module in conductive thermal communication with a heat sink; a MOSFET superposing the base second surface and in conductive thermal communication with the base; and a MOSFET driver superposing the base second surface and operatively connected to the MOSFET; wherein the transference from the power module of heat generated by the MOSFET and the MOSFET driver from the power module is directed along a primary cooling path to the heat sink through the base and a secondary cooling path to ambient air, and the primary and secondary cooling paths are separate from each other, the plurality of power modules being mounted in conductive thermal communication to the cooling tower at circumferentially distributed positions on the radially outer wall surface;
wherein the cooling tower defines a heat sink to which heat transference from each power module occurs along the respective primary cooling path;
wherein heat transference from the plurality of power modules collectively occurs, relative to the package central axis, along the respective primary cooling paths and along the respective secondary cooling paths;
wherein the metallic wall of the cooling tower defines a radially inner wall surface, the radially inner wall surface defining an axially extending air passage through the cooling tower, the air passage having an inlet proximate the first axial end, and the cooling tower comprises a plurality of spaced metallic ribs in conductive thermal communication with the radially inner wall surface, the ribs traversing the air passage and wherein the fan generates air flow through the air passage whereby the plurality of spaced metallic ribs are cooled by the air flow generated by the fan;
wherein each power module respectively comprises a thermally conductive cover plate having an interior surface superposing the base second surface and an exterior surface exposed to ambient air, wherein heat transference directed along the secondary path is through the cover plate whereby the ambient air cools the cover plate by natural convection.

2. The electric machine of claim 1 , wherein respective to each power module the cover plate is provided with a thermally conductive boss extending from the cover plate interior surface into spaced proximity with the MOSFET driver, and heat transference along the secondary cooling path includes thermal conduction through the boss.

3. The electric machine of claim 1 , wherein respective to each power module the cover plate is provided with a plurality of thermally conductive bosses extending from the cover plate interior surface into respective spaced proximity with one of the MOSFET and the MOSFET driver, and heat transference along the secondary cooling path includes thermal conduction through the plurality of bosses.

4. The electric machine of claim 1 , wherein respective to each power module the cover plate exterior surface defines a plurality of fins, and heat transference along the secondary cooling path includes thermal convection from the fins to ambient air.

5. The electric machine of claim 4 wherein the plurality of spaced metallic ribs defined by the cooling tower project radially inwardly and the plurality of fins defined by the cover plate project radially outwardly and wherein the plurality of spaced metallic ribs project by a greater distance than the plurality of fins.

6. An electric machine comprising a stator defining a machine central axis, a rotor surrounded by and rotatable relative to the stator about the machine central axis, a rear frame member rotatably fixed relative to the stator and through which the machine central axis extends, and an electronic package adapted for connection to the rear frame member;
the electronic package comprising:
a cooling tower having opposite first and second axial ends spaced along a package central axis, the cooling tower comprising a metallic wall extending about the package central axis to define a radially outer wall surface;
a plurality of power modules, each of the power modules including a thermally conductive base having opposite first and second surfaces, the first surface adapted for mounting the power module in conductive thermal communication with a heat sink; a MOSFET superposing the base second surface and in conductive thermal communication with the base; and a MOSFET driver superposing the base second surface and operatively connected to the MOSFET; wherein the transference from the power module of heat generated by the MOSFET and the MOSFET driver from the power module is directed along a primary cooling path to the heat sink through the base and a secondary cooling path to ambient air, and the primary and secondary cooling paths are separate from each other, the plurality of power modules being mounted in conductive thermal communication to the cooling tower at circumferentially distributed positions on the radially outer wall surface;
wherein the cooling tower defines a heat sink to which heat transference from each power module occurs along the respective primary cooling path;
wherein the metallic wall of the cooling tower defines a radially inner wall surface, the radially inner wall surface defining an axially extending air passage through the cooling tower, the air passage having an inlet proximate the first axial end, and the cooling tower comprises a plurality of spaced metallic ribs in conductive thermal communication with the radially inner wall surface, the ribs traversing the air passage;
wherein the machine central axis extends through the electronic package and the cooling tower is connected to the rear frame member;

wherein the electric machine is liquid-cooled and the rear frame member defines a metallic wall extending substantially perpendicularly relative to the machine central axis, the rear frame member wall having an inner axial side in contact with liquid coolant and an opposite outer axial side in conductive thermal communication with the cooling tower, and
wherein conductive heat transfer occurs between the cooling tower and the rear frame member wall, and convective heat transfer occurs between the rear frame member wall and the liquid coolant.

7. The electric machine of claim 6 , wherein the machine central axis and the package central axis coincide.

8. The electric machine of claim 6 , wherein each power module respectively comprises a thermally conductive cover plate having an interior surface superposing the base second surface and an exterior surface exposed to ambient air, wherein heat transference directed along the secondary path is through the cover plate.

9. The electric machine of claim 8 , wherein respective to each power module the cover plate is provided with a thermally conductive boss extending from the cover plate interior surface into spaced proximity with the MOSFET driver, and heat transference along the secondary cooling path includes thermal conduction through the boss.

10. The electric machine of claim 8 , wherein respective to each power module the cover plate is provided wi

Assignees

• Remy Tech Llc
• Borgwarner Inc

Inventors

• Bradfield Michael D

Classifications

• H02K9/22

  by solid heat conducting material embedded in, or arranged in contact with, the stator or rotor, e.g. heat bridges · CPC title

• H05K7/20127

  Natural convection · CPC title

• H05K7/209

  Heat transfer by conduction from internal heat source to heat radiating structure (H05K7/20909 takes precedence) · CPC title

• H02K11/33

  Drive circuits, e.g. power electronics (H02K11/38 takes precedence) · CPC title

• H05K7/20409

  Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing · CPC title