Electrical feed-through and connector configuration

Patent metadata

Field	Value
Publication number	US-10164358-B2
Application number	US-201615282783-A
Country	US
Kind code	B2
Filing date	Sep 30, 2016
Priority date	Sep 30, 2016
Publication date	Dec 25, 2018
Grant date	Dec 25, 2018

Abstract

An electrical feed-through assembly includes electrically conductive pins having a top apex and a bottom apex, where the pins extend through at least a majority of an electrically non-conductive material. The top apexes, the bottom apexes, or both the top and bottom apexes of the pins have an electrically conductive connection pad material, such as a solder pad, coupled thereto. In variations, the top and/or bottom apexes may be slightly recessed from a corresponding surface of the non-conductive material, such that the connection pads fill the respective recesses; and/or the top and/or bottom apexes barely extend from a corresponding surface, such that the connection pads bulge out from the corresponding surface. Such a feed-through configuration may inhibit pin bending, in addition to enabling use of more types of connectors beyond pin-and-socket type connectors.

First claim

What is claimed is:

1. An electrical feed-through assembly component comprising:
an electrically non-conductive material having a top surface and a bottom surface of a main body;
a plurality of electrically conductive pins having a top apex and a bottom apex and extending through at least a majority of said main body; and
solder pads coupled to said top and said bottom apexes of said pins;
wherein one of said top and bottom apexes of said pins are recessed from a corresponding said top or bottom surface of said main body of said non-conductive material, such that said solder pads coupled to said apexes that are recessed fill a respective recess created by recession of said pins from said corresponding surface;
wherein the other of said top and bottom apexes of said pins marginally extend from a corresponding said top or bottom surface of said main body of said non-conductive material, such that said solder pads coupled to said apexes that extend bulge out from said corresponding surface.

2. The electrical feed-through assembly of claim 1 , wherein said pins comprise gold plating or palladium plating.

3. The electrical feed-through assembly of claim 1 , wherein said non-conductive material comprises a ceramic or a resin.

4. A data storage device comprising:
a disk medium rotatably mounted on a spindle;
a read-write head slider comprising a read-write transducer configured to read from and to write to said disk medium;
a voice coil actuator configured to move said head slider to access portions of said disk medium;
an electrical feed-through assembly component comprising:
an electrically non-conductive material having a top surface and a bottom surface of a main body,
a plurality of electrically conductive pins having a top apex and a bottom apex and extending through at least a majority of said main body, and
solder pads coupled to at least one of said top and said bottom apexes of said pins; and

an enclosure comprising a base with which said electrical feed-through is coupled,
wherein said base includes an aperture encompassed by said electrical feed-through;

wherein:
at least one of said top and bottom apexes of said pins are recessed from respective said top and bottom surfaces of said main body of said non-conductive material of said feed-through assembly, such that any said solder pads coupled to said apexes that are recessed fills a respective recess created by recession of said pins from said top and/or bottom surfaces; or
at least one of said top and bottom apexes of said pins marginally extend from respective said top and bottom surfaces of said main body of said non-conductive material of said feed-through assembly, such that any said solder pads coupled to said apexes that extend bulges out from said top and/or bottom surfaces.

5. The data storage device of claim 4 , further comprising:
an electrical connector part electrically connected to said pins through said solder pads.

6. The data storage device of claim 5 , further comprising:
a printed circuit board coupled with said base;
wherein said connector part is electrically connected on one side to said pins via compression-type terminals and electrically connected on another side to said printed circuit board.

7. The data storage device of claim 4 , wherein said solder pads are coupled to both of said top and said bottom apexes of said pins.

8. The data storage device of claim 7 , further comprising:
a first electrical connector part electrically connected to said bottom apexes of said pins through said corresponding solder pads;
a second electrical connector part electrically connected to said top apexes of said pins through said corresponding solder pads;
a printed circuit board coupled with said base; and
a flexible electrical cable assembly within said enclosure;
wherein said first connector part is electrically connected to said bottom apexes of said pins via compression-type terminals and electrically connected to said printed circuit board;
wherein said second connector part is electrically connected to said top apexes of said pins via compression-type terminals and electrically connected to said flexible cable assembly.

9. The data storage device of claim 4 ,
wherein at least one of said top and bottom apexes of said pins are recessed from respective said top and bottom surfaces of said main body of said non-conductive material of said feed-through assembly, such that each said solder pad fills a respective recess created by recession of said pins from said top and/or bottom surfaces.

10. The data storage device of claim 4 ,
wherein at least one of said top and bottom apexes of said pins marginally extend from respective said top and bottom surfaces of said main body of said non-conductive material of said feed-through assembly, such that each said solder pad bulges out from said top and/or bottom surfaces.

11. The data storage device of claim 4 ,
wherein one of said top and bottom apexes of said pins are recessed from a corresponding said top or bottom surface of said main body of said non-conductive material of said feed-through assembly, such that each said solder pad coupled to said one of said top and bottom apexes fills a respective recess created by recession of said pins from said corresponding surface;
wherein the other of said top and bottom apexes of said pins marginally extend from a corresponding said top or bottom surface of said main body of said non-conductive material of said feed-through assembly, such that each said solder pad coupled to said other of said top and bottom apexes bulges out from said corresponding surface.

12. A method of assembling a data storage device, the method comprising:
affixing a pre-assembled electrical feed-through assembly component to a data storage device enclosure comprising a base comprising an aperture encompassed by said electrical feed-through assembly, wherein said feed-through assembly comprises:
an electrically non-conductive material having a top surface and a bottom surface of a main body,
a plurality of electrically conductive pins having a top apex and a bottom apex and extending through at least a majority of said main body,
wherein:
at least one of said top and bottom apexes of said pins are recessed from respective said top and bottom surfaces of said main body of said non-conductive material of said feed-through assembly, such that each said solder pad fills a respective recess created by recession of said pins from said top and/or bottom surfaces; or
at least one of said top and bottom apexes of said pins marginally extend from respective said top and bottom surfaces of said main body of said non-conductive material of said feed-through assembly, such that each said solder pad bulges out from said top and/or bottom surfaces, and

solder pads coupled to at least one of said top and said bottom apexes of said pins;

electrically connecting an electrical connector part to said electrical feed-through assembly, wherein compression-type terminals of said connector part are electrically connected to said pins of said feed-through through said solder pads.

13. The method of claim 12 , wherein said electrical connector part is electrically connected to a printed circuit board, and wherein said feed-through assembly further comprises solder pads coupled to said top apexes of said pins, the method further comprising:
electrically connecting a flexible electrical cable assembly, which is within said enclosure, to said electrical feed-through assembly through said solder pads coupled to said top apexes of said pins.

14. A method of manufacturing an electrical

Assignees

• Western Digital Tech Inc

Inventors

• Yoshida Kyosuke
• Sudo Kimihiko
• Hayakawa Takako
• Eguchi Hajime
• Onobu Yuta

Classifications

• H05K5/069

  Other details of the casing, e.g. wall structure, passage for a connector, a cable, a shaft · CPC title

• H01R2201/06

  for computer periphery · CPC title

• H01R13/2485

  for contacting a ball · CPC title

• H01R12/777

  Coupling parts carrying pins, blades or analogous contacts (H01R12/78, H01R12/79 take precedence) · CPC title

• G11B33/148

  Reducing friction, adhesion, drag · CPC title