Device and method for heat treating an object

US10163670B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10163670-B2
Application numberUS-201314413562-A
CountryUS
Kind codeB2
Filing dateJul 9, 2013
Priority dateJul 9, 2012
Publication dateDec 25, 2018
Grant dateDec 25, 2018

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

The present invention relates to a device for heat treating an object, in particular a coated substrate, with an in particular gas-tightly sealable housing that encloses a hollow space, wherein the hollow space has a separating wall, by which the hollow space is divided into a process space for accommodating the object and an intermediate space, wherein the separating wall has one or a plurality of openings, which are implemented such that the separating wall acts as a barrier for the diffusion out of the process space into the intermediate space of a gaseous substance generated in the process space by the heat treatment of the object. The housing has at least one housing section coupled to a cooling device for its active cooling, wherein the separating wall is arranged between the object and the coolable housing section. The invention further relates to the use of a separating wall as a diffusion barrier in a device for heat treating an object as well as a corresponding method for heat treating an object.

First claim

Opening claim text (preview).

The invention claimed is: 1. Device for heat treating an object, such as a coated substrate, comprising one housing that encloses a hollow space, wherein the hollow space has a separating wall, by means of which the hollow space is divided into a process space for accommodating the object and an intermediate space, wherein the separating wall has one or a plurality of openings, which are implemented such that the separating wall acts as a diffusion barrier for a gas exchange between the process space and the intermediate space during the heat treating of the object and enables a gas exchange between the process space and the intermediate space through the separating wall before and after the heat treating of the object, wherein the housing has at least one coolable first housing section coupled with a cooling device for its active cooling, wherein the separating wall is arranged between the object and the coolable first housing section, and wherein the housing further comprises at least one second housing section which is implemented such that the object is heat treatable by means of electromagnetic thermal radiation impinging on the housing, or at least one second housing section coupled to a heating device for heating the process space, with the second housing section being different from the first housing section, wherein the first housing section has a sealable gas passage opening into the intermediate space for removing or feeding or both of at least one gaseous substance. 2. Device according to claim 1 , wherein the separating wall is implemented such that a mass loss of the gaseous substance during the heat treatment is less than 50%, wherein an area ratio, formed from a total opening area of the one or a plurality of openings divided by an inner surface of the process space, is in the range from 5×10 −5 to 5×10 −4 . 3. Device according to claim 1 , wherein the separating wall contains a material, which has such a coefficient of thermal expansion that a total opening area of the one or a plurality of openings is reduced by heating the separating wall during the heat treatment to a maximum of 50% of a total opening area before the heat treatment. 4. Device according to claim 3 , wherein the separating wall contains a material, whose coefficient of thermal expansion is greater than 5×10 −6 K −1 . 5. Device according to claim 1 , wherein the housing is made of a material, whose coefficient of thermal expansion is less than 5×10 −≢ K −1 . 6. Device according to claim 1 , wherein the separating wall is arranged between a warmer zone and at least one colder zone of the hollow space. 7. Device according to claim 1 , wherein the housing section coupled to a cooling device is a side wall section of the housing, which includes a seal for sealing a housing opening. 8. Device according to claim 1 , wherein the separating wall does not reach a housing wall, wherein an opening remains between the separating wall and the housing wall. 9. Device according to claim 1 , wherein the housing is made of quartz glass. 10. Device according to claim 2 , wherein a mass loss of the gaseous substance duringthe heat treatment is less than 20%. 11. Device according to claim 2 , wherein a mass loss of the gaseous substance during the heat treatment is less than 10%. 12. Device according to claim 3 , wherein a total opening area of the one or a plurality of openings is reduced by heating the separating wall during the heat treatment to a maximum of 30% of a total opening area before the heat treatment. 13. Device according to claim 3 , wherein a total opening area of the one or a plurality of openings is reduced by heating the separating wall during the heat treatment to a maximum of 10% of a total opening area before the heat treatment. 14. Method for heat treating an object, such as a coated substrate, the method comprising: introducing an object into a hollow space of one housing, wherein the hollow space is divided by a separating wall, which has one or a plurality of openings, into a process space accommodating the object and an intermediate space, heat treating the object, wherein the separating wall acts as a barrier for the diffusion out of the process space into the intermediate space of a gaseous substance generated in the process space by the heat treatment of the object, cooling at least one housing section delimiting the intermediate space during the heat treatment of the object. 15. The method of claim 14 , wherein the separating wall has such a coefficient of thermal expansion, that a total opening area of the one or a plurality of openings is reduced by heating the separating wall during the heat treatment of the object to a maximum of 50% of a total opening area before the heat treatment, wherein the separating wall contains in particular a material with a coefficient of thermal expansion of more than 5×10 −6 K −1 . 16. Method according to claim 14 , wherein the process space is pumped out by removal of at least one gaseous substance from the intermediate space and/or at least one gaseous substance is fed to the process space by introduction into the intermediate space.

Assignees

Inventors

Classifications

  • specially adapted for a single substrate · CPC title

  • characterised by the presence of atmosphere modifying elements inside or attached to the closed carrier · CPC title

  • Forming or maintaining special atmospheres or vacuum within heating chambers (supplying steam, vapour, gases or liquids F27D7/02) · CPC title

  • Electricity · mapped topic

  • through closable or non-closable openings of the chamber walls · CPC title

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What does patent US10163670B2 cover?
The present invention relates to a device for heat treating an object, in particular a coated substrate, with an in particular gas-tightly sealable housing that encloses a hollow space, wherein the hollow space has a separating wall, by which the hollow space is divided into a process space for accommodating the object and an intermediate space, wherein the separating wall has one or a pluralit…
Who is the assignee on this patent?
Saint Gobain, Bengbu Design & Res Inst Glass Ind
What technology area does this patent fall under?
Primary CPC classification H10P72/1902. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Dec 25 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).