Aluminum electrolytic capacitor and assembly thereof

Patent metadata

Field	Value
Publication number	US-10163577-B2
Application number	US-201615221891-A
Country	US
Kind code	B2
Filing date	Jul 28, 2016
Priority date	Jul 28, 2016
Publication date	Dec 25, 2018
Grant date	Dec 25, 2018

Abstract

Designs of a capacitor housing and method of assembly are presented. A case for an electrolytic capacitor includes a non-conducting cover, a non-conducting ring component, and a non-conducting plate. The non-conducting cover has a patterned groove on a surface of the non-conducting cover. The non-conducting ring component has a shape that is substantially the same as a shape of the non-conducting cover, and is coupled to the non-conducting cover via the patterned groove of the non-conducting cover. The non-conducting plate has a shape that is substantially the same as the shape of the non-conducting cover, and has a patterned groove on a surface of the non-conducting plate. The non-conducting ring component is coupled to the non-conducting plate via the groove of the non-conducting plate.

First claim

What is claimed is:

1. A case for an electrolytic capacitor, comprising:
a first housing defining a first space for enclosing a capacitor, the first housing including
a first non-conducting cover;
a first non-conducting ring component having a shape that is substantially the same as a shape of the first non-conducting cover, wherein the first non-conducting ring component is coupled to the first non-conducting cover;
a non-conducting plate having a shape that is substantially the same as the shape of the first non-conducting cover, wherein the first non-conducting ring component is coupled to the non-conducting plate; and
a single capacitor arranged in the first space; and

a second housing defining a second space for enclosing a capacitor, the second housing including
a second non-conducting ring component having a shape that is substantially the same as the shape of the first non-conducting cover, wherein the second non-conducting ring component is coupled to the non-conducting plate on an opposite surface from the first non-conducting ring component;
a second non-conducting cover coupled to the second non-conducting ring component; and
another single capacitor arranged in the second space,

wherein the non-conducting plate is positioned between the first space and the second space.

2. The case of claim 1 ,
wherein the first non-conducting ring component is coupled to the non-conducting plate via a first patterned groove on a first surface of the non-conducting plate; and
wherein the second non-conducting ring component is coupled to the non-conducting plate via a second patterned groove on a second surface of the non-conducting plate opposite the first surface.

3. The case of claim 1 , wherein the first non-conducting ring component includes at least three separate openings through a thickness of the first non-conducting ring component.

4. The case of claim 3 , wherein the second non-conducting ring component includes at least three separate openings through a thickness thereof.

5. The case of claim 1 , wherein the first non-conducting cover has a patterned groove on a surface thereof and the non-conducting plate has a patterned groove on a surface thereof, and the patterned groove of the first non-conducting cover and the patterned groove of the non-conducting plate are designed such that the first non-conducting ring component snaps into each of the first non-conducting cover and the non-conducting plate.

6. The case of claim 5 , wherein the first non-conducting ring component includes a first patterned groove along a first edge thereof that snaps into the patterned groove of the first non-conducting cover, and the first non-conducting ring component includes a second patterned groove along a second edge thereof opposite the first edge that snaps into the patterned groove of the non-conducting plate.

7. The case of claim 1 , wherein seams between each of the first non-conducting cover, the first non-conducting ring component, and the non-conducting plate are sealed with an adhesive.

8. The case of claim 7 , wherein the adhesive does not include any halides or chlorides.

9. The case of claim 1 , where each of the first non-conducting cover, the first non-conducting ring component, the non-conducting plate, the second non-conducting ring component and the second non-conducting cover are molded from a thermoplastic resin.

10. The case of claim 1 , wherein the first housing and the second housing are molded using polyether ether ketone.

11. The case of claim 1 , wherein the non-conducting first cover has a patterned groove on a surface thereof.

12. An electrolytic capacitor, comprising:
a case comprising:
a first non-conducting cover having a patterned groove on a surface thereof;
a first non-conducting ring component having a shape that is substantially the same as a shape of the first non-conducting cover, wherein the first non-conducting ring component is coupled to the first non-conducting cover via the patterned groove of the first non-conducting cover;
a non-conducting plate having a first patterned groove on a first surface thereof and a second patterned groove on a second surface thereof opposite the first surface, the non-conducting plate having a shape that is substantially the same as the shape of the first non-conducting cover, wherein the first non-conducting ring component is coupled to a first side of the non-conducting plate via the first patterned groove of the non-conducting plate;
a second non-conducting cover having a patterned groove on a surface thereof; and
a second non-conducting ring component coupled to the second non-conducting cover and having a shape that is substantially the same as a shape of the second non-conducting cover, wherein the second non-conducting ring component is coupled to a second side of the non-conducting plate via the second patterned groove of the non-conducting plate;

an electrolyte; and
two material stacks, each comprising:
at least one anode foil;
at least one cathode foil; and
at least one separator disposed between the anode foil and the cathode foils;

wherein one portion of the electrolyte and a single one of the material stacks are disposed within the first non-conducting ring component and another portion of the electrolyte and another single one of the material stacks are disposed within the second non-conducting ring component.

13. The electrolytic capacitor of claim 12 , wherein the first non-conducting ring component and the second non-conducting ring component each includes at least three separate openings through a thickness thereof.

14. The electrolytic capacitor of claim 13 , wherein one of the at least three separate openings is configured to introduce the electrolyte into the case.

15. The electrolytic capacitor of claim 13 , wherein two of the at least three separate openings are configured to provide electrical connection with the at least one anode foil and the at least one cathode foil.

16. A method of assembling an electrolytic capacitor, comprising:
coupling a first non-conducting ring component to a first side of a non-conducting plate;
disposing a first single material stack within the first ring component, wherein the first single material stack is disposed against the non-conducting plate;
attaching a non-conducting first cover to the first ring component to enclose the first material stack within a first space;
coupling a second non-conducting ring component to a second side of the non-conducting plate opposite the first side;
disposing a second single material stack within the second ring component, wherein the second single material stack is disposed against the non-conducting plate;
attaching a non-conducting second cover to the second ring component to enclose the second material stack within a second space to form a capacitor assembly;
sealing seams in the capacitor assembly; and
adding electrolyte to the first space and the second space through the first and second ring components.

17. The method of claim 16 , wherein the non-conducting plate is formed by molding polyether ether ketone.

18. The method of claim 16 , wherein the attaching of the first cover to the first ring component comprises snapping one into a groove of the other.

19. The method of claim 16 , wherein the sealing comprises sealing seams between each of the non-conducting first cover, the first non-conducting ring component, the non-conducting plate, the non-conducting second cover, and the second non-conducting ring component using an adhesive.

Assignees

• Pacesetter Inc

Inventors

• Mccurry Troy L
• Hemphill Ralph Jason
• Bowen David R
• Fernstrom Peter J

Classifications

• H01G9/045

  based on aluminium · CPC title

• H01G9/02

  Diaphragms; Separators · CPC title

• H01G9/10 Primary

  Sealing, e.g. of lead-in wires · CPC title

• H01G9/0029

  Processes of manufacture · CPC title

• H01G9/08

  Housing; Encapsulation · CPC title