Adaptive processes for improving integrity of surfaces

US10162343B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10162343-B2
Application numberUS-201414339125-A
CountryUS
Kind codeB2
Filing dateJul 23, 2014
Priority dateJul 23, 2014
Publication dateDec 25, 2018
Grant dateDec 25, 2018

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A process for performing localized corrective actions to structure of an electronic device is described. The structure may include a mating surface configured to receive another structure such that the two structures may be, for example, adhesively bonded together. The localized corrective actions are configured not to improve the mating surface but to also prevent light within the electronic device from escaping in undesired areas of the electronic device. In some embodiments, the corrective action includes using a removal tool to remove identified portions of the surface. In other embodiments, the corrective action includes using a different tool to add material identified portions of the surface. The identified means may include an automated inspection system.

First claim

Opening claim text (preview).

What is claimed is: 1. A method for assembling a housing of an electronic device, the electronic device having a first component that includes a mating surface having a first surface portion and a second surface portion separated by a recess having a dimension within an acceptable tolerance range, the method comprising: measuring, relative to an internal reference datum, a first height of the first surface portion; measuring, relative to the internal reference datum, a second height of the second surface portion; when the second height is greater than the first height: adding a printed material to the first surface portion to form a planarized mating surface such that (i) the first height is within a predetermined tolerance value of the second height, and (ii) the dimension of the recess remains generally unchanged; placing an adhesive layer on the planarized mating surface; and attaching a second component to the first component via the adhesive layer. 2. The method as recited in claim 1 , wherein, prior to adding the printed material to the first surface portion, a difference between the first and second heights exceeds the predetermined tolerance value. 3. The method as recited in claim 1 , wherein, subsequent to adding the printed material to the first surface portion, the first height is generally coplanar with the second height. 4. The method as recited in claim 1 , wherein the printed material is comprised of at least one of elastomeric resin. 5. The method as recited in claim 1 , wherein the printed material is added to the first surface portion in a controlled manner. 6. The method as recited in claim 5 , wherein a geometry of the printed material is based on the first surface portion. 7. The method as recited in claim 1 , wherein a geometry of the printed material is further based on a surface profile of a corresponding mating surface of the second component. 8. The method as recited in claim 1 , wherein the recess corresponds to the internal reference datum, and the recess has a height that is less than the first and second heights. 9. The method as recited in claim 8 , wherein an automated inspection system utilizes the internal reference datum to determine that the second height is greater than the first height. 10. The method as recited in claim 1 , wherein the second surface portion receives a hinge assembly that pivotally connects to the housing. 11. The method as recited in claim 9 , wherein the internal reference datum is characterized as having a height that is lower than the first and second heights. 12. A non-transitory computer-readable storage medium containing instructions that, when executed by one or more processors of a corrective system, cause the corrective system to assemble a housing for a portable electronic device that includes a mating surface that is defined by (i) a first component having a first surface portion, and (ii) a second component having a second surface portion: measure, relative to an internal reference datum, a first height of the first surface portion; measure, relative to the internal reference datum, a second height of the second surface portion; in response to determining that the second height is greater than the first height, wherein the first and second surface portions are separated by a recess having a dimension within an acceptable tolerance range: add a printed material to the first surface portion to form a planarized mating surface such that (i) the first height is within a predetermined tolerance value of the second height, and (ii) the dimension of the recess remains generally unchanged; apply an adhesive layer on the planarized mating surface; and attach the second component to the first component using the adhesive layer. 13. The non-transitory computer-readable storage medium of claim 12 , wherein, prior to adding the printed material to the first surface portion, a difference between the first and second heights exceeds the predetermined tolerance value. 14. The non-transitory computer-readable storage medium of claim 13 , wherein, subsequent to adding the printed material to the first surface portion, the first height is generally coplanar with the second height. 15. The non-transitory computer-readable storage medium of claim 12 , wherein the recess corresponds to the internal reference datum, and the recess has a height that is less than the first and second heights. 16. The non-transitory computer-readable storage medium of claim 15 , wherein a geometry of the printed material is based on the first surface portion and a surface profile of a corresponding mating surface of the second component. 17. A system for providing corrective adjustment for a component of a housing for an electronic device, the component including (i) a first surface portion having a first height, and (ii) a second surface portion having a second height, the system comprising: an inspection system for determining that the component includes an uneven mating surface, wherein the second height is greater than the first height, and the first and second surface portions are separated by a recess having a dimension within an acceptable tolerance range; and a corrective system in communication with the inspection system, the corrective system configured to: add a printed material to the first surface portion to form a planarized mating surface while preventing the recess from receiving the printed material such that the first height is within a predetermined tolerance value of the second height, place an adhesive layer on the planarized mating surface, and attach an additional component to the component via the adhesive layer. 18. The system of claim 17 , wherein a geometry of the printed material is based on the first surface portion. 19. The system of claim 17 , wherein the recess corresponds to an internal reference datum, and the first and second heights are measured relative to the internal reference datum. 20. The system of claim 17 , wherein, prior to adding the printed material to the first surface portion, a difference in respective dimensions between the first and second heights exceeds the predetermined tolerance value.

Assignees

Inventors

Classifications

  • Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components · CPC title

  • Cross-Sectional Technologies · mapped topic

  • G06F1/1613Primary

    for portable computers (cooling arrangements therefor G06F1/203; constructional details or arrangements for pocket calculators, electronic agendas or books G06F15/0216; constructional details of portable telephone sets: with several bodies H04M1/0202) · CPC title

  • characterised by quality surveillance of production · CPC title

  • Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS] · CPC title

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What does patent US10162343B2 cover?
A process for performing localized corrective actions to structure of an electronic device is described. The structure may include a mating surface configured to receive another structure such that the two structures may be, for example, adhesively bonded together. The localized corrective actions are configured not to improve the mating surface but to also prevent light within the electronic d…
Who is the assignee on this patent?
Apple Inc
What technology area does this patent fall under?
Primary CPC classification G06F1/1613. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Dec 25 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 12 related publications on this page (citations in our corpus or others sharing the same primary CPC).