Integrated package containing mems acoustic sensor and environmental sensor and methodology for fabricating same
US-2015321906-A1 · Nov 12, 2015 · US
US10161908B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10161908-B2 |
| Application number | US-201615079889-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 24, 2016 |
| Priority date | Mar 24, 2016 |
| Publication date | Dec 25, 2018 |
| Grant date | Dec 25, 2018 |
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Embodiments of the present disclosure provide an apparatus for determining a characteristic of a fluid. The apparatus may include a device configured to determine a hydrodynamic pressure of the fluid. The apparatus may further include a sensor configured to determine a hydrostatic pressure of the fluid or at least one component of the fluid. The apparatus may also include a common substrate on which the sensor and the device configured to determine a hydrodynamic pressure of the fluid may be commonly arranged, and an ASIC (Application Specific Integrated Circuit) which may be electrically coupled with at least one of the device or the sensor. The ASIC may be at least partially embedded in the common substrate.
Opening claim text (preview).
What is claimed is: 1. An apparatus for determining a characteristic of a fluid, the apparatus comprising: a device configured to determine a hydrodynamic pressure of the fluid; a sensor configured to determine a hydrostatic pressure of the fluid or at least one component of the fluid; a common substrate on which the sensor and the device configured to determine the hydrodynamic pressure of the fluid are arranged; and a first ASIC (Application Specific Integrated Circuit) being electrically coupled with at least one of the sensor and the device to determine the hydrodynamic pressure of the fluid, wherein the first ASIC is at least partly embedded in the common substrate. 2. The apparatus according to claim 1 , wherein the first ASIC is entirely embedded in the common substrate. 3. The apparatus according to claim 1 , wherein the device configured to determine the hydrodynamic pressure of the fluid is at least one of a mechanical device, an electrical device or an electromechanical device. 4. The apparatus according to claim 1 , wherein the device configured to determine the hydrodynamic pressure of the fluid is a microphone. 5. The apparatus according to claim 1 , wherein the sensor is a pressure sensor. 6. The apparatus according to claim 1 , wherein the sensor is configured to generate electrical signals in response to pressure variations of the fluid, wherein the apparatus further comprises a low-pass filter or a bandpass-filter configured to attenuate electrical signals from the sensor which electrical signals are generated in response to pressure variations with a frequency of more than 20 Hz or with a frequency of more than 10 Hz. 7. The apparatus according to claim 1 , wherein the sensor is a gas sensor configured to determine a concentration of the at least one component of the fluid or to determine at least one of a composition and a type of the fluid. 8. The apparatus according to claim 1 , wherein at least one of the sensor and the device configured to determine the hydrodynamic pressure of the fluid is a MEMS (Micro-Electro-Mechanical-System). 9. The apparatus according to claim 1 , wherein the first ASIC is electrically coupled with the sensor and with the device configured to determine the hydrodynamic pressure of the fluid. 10. The apparatus according to claim 1 further comprising a second ASIC that is at least partly embedded in the common substrate, wherein the device configured to determine the hydrodynamic pressure of the fluid is electrically coupled with the first ASIC and the sensor is electrically coupled with the second ASIC. 11. The apparatus according to claim 1 further comprising a cover that is mechanically coupled with the common substrate and which surrounds the sensor and the device configured to determine the hydrodynamic pressure of the fluid. 12. The apparatus according to claim 11 , wherein the cover is mechanically bonded with the common substrate by a bonding means that comprises at least one of solder, a conductive adhesive or a non-conductive adhesive. 13. The apparatus according to claim 11 , further comprising a fluid port that is provided in at least one of the cover and the common substrate, which fluid port provides a fluidic connection between an inside and an outside of the apparatus for determining the characteristic of a fluid. 14. The apparatus according to claim 13 , wherein the device configured to determine the hydrodynamic pressure of the fluid is a microphone and wherein the fluid port is arranged in the vicinity of the microphone such that sound waves travelling through the fluid port are directed onto a membrane of the microphone. 15. A method of making an apparatus for determining a characteristic of a fluid, the method comprising: providing a device configured to determine a hydrodynamic pressure of the fluid; providing a sensor configured to determine a hydrostatic pressure of the fluid or at least one component of the fluid; providing a common substrate; arranging the sensor and the device configured to determine the hydrodynamic pressure of the fluid on the common substrate; electrically coupling a first ASIC (Application Specific Integrated Circuit) with at least one of the sensor and the device to determine the hydrodynamic pressure of the fluid; and at least partially embedding the first ASIC in the common substrate. 16. The method of claim 15 , wherein at least partially embedding the first ASIC in the common substrate comprises entirely embedding the first ASIC in the common substrate. 17. The method of claim 15 , further comprising mechanically coupling a cover with the common substrate, wherein the cover and the common substrate surrounds the sensor and the device configured to determine the hydrodynamic pressure of the fluid. 18. The method according to claim 17 , wherein mechanically coupling the cover comprises mechanically bonding the cover to the common substrate using at least one of solder, a conductive adhesive or a non-conductive adhesive. 19. A method of operating an apparatus for determining a characteristic of a fluid comprising a device, a sensor, a common substrate on which the sensor and the device are arranged, a first ASIC (Application Specific Integrated Circuit) being electrically coupled with at least one of the sensor and the device, wherein the first ASIC is at least partly embedded in the common substrate, the method comprising: determining, by the device, a hydrodynamic pressure of the fluid; and determining, by the sensor, a hydrostatic pressure of the fluid or at least one component of the fluid. 20. The method of claim 19 , further comprising generating, by the sensor, electrical signals in response to pressure variations of the fluid.
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