Flexible sensor apparatus

US10161737B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10161737-B2
Application numberUS-201515311990-A
CountryUS
Kind codeB2
Filing dateMay 18, 2015
Priority dateMay 19, 2014
Publication dateDec 25, 2018
Grant dateDec 25, 2018

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A sensor apparatus including a flexible substrate and a wrinkled conductor disposed on the flexible substrate. In some embodiments, the conductor includes micro-scale invaginations. Also disclosed are methods of making a sensor apparatus, including: placing a mask over a polymeric sheet, wherein the mask is configured to block regions of the polymeric sheet, depositing a conductive structure on the polymeric sheet at regions exposed through the mask, shrinking the polymeric sheet with conductive structure patterned on its surface by heating, and transferring the conductive structure to a flexible substrate. Also disclosed are methods of sensing a health condition of a user or patient. The methods include coupling a sensor apparatus to a surface of a user or patient overlying structures to be monitored. The sensor apparatus may include a crumpled conductor capable of detecting strain. Strain is detected by directing current through the sensor apparatus during flexing of the surface and measuring a characteristic of the sensor apparatus based on the strain to generate an output for a user, indicative of the condition of the user or patient.

First claim

Opening claim text (preview).

What is claimed is: 1. A sensor apparatus comprising: a flexible substrate comprising an elastomeric polymer, and a wrinkled conductor comprising one or more of a metal film, a semiconductor structure, an array of one-dimensional structures and/or carbon black disposed on the flexible substrate, wherein the flexible substrate is covalently bonded to the metal film, the semiconductor structure, the array of one-dimensional structures and/or the carbon black, and wherein conductor comprises secondary folding. 2. The sensor apparatus of claim 1 , wherein the conductor is capable of repeatable variation in resistance when subject to a strain of up to about 300%. 3. The sensor apparatus of claim 1 , wherein the secondary folding comprises micron-scaled invaginations in the surface of the conductor. 4. The sensor apparatus of claim 1 , wherein the metal film comprises a gold layer. 5. The sensor apparatus of claim 1 , wherein the metal film comprises a platinum layer. 6. The sensor apparatus of claim 1 , wherein said elastomeric polymer is an elastomeric silicone film. 7. The sensor apparatus of claim 6 , wherein said elastomeric silicone film comprises polydimethylsiloxane. 8. A sensor apparatus comprising: a flexible substrate comprising an elastomeric silicon film, and a wrinkled conductor disposed on the flexible substrate, wherein said conductor comprises gold and wherein said elastomeric silicone film is covalently bonded to the gold by (3-mercaptopropyl) trimethoxysilane (MPTMS), as a self-assembled monolayer. 9. The sensor apparatus of claim 8 , wherein said conductor further comprises platinum and wherein said platinum is bonded to said gold by metallic bonds. 10. The sensor apparatus of claim 1 , wherein the one-dimensional structure is selected from the group consisting of a nanotube, a nanofiber, a nanowire and a rod. 11. The sensor apparatus of claim 10 , wherein the nanotube is a carbon nanotube (CNT). 12. The sensor apparatus of claim 10 , wherein the nanowire is a silicon nanowire. 13. The sensor apparatus of claim 1 , wherein the array of one-dimensional structures has a light transmittance value of about 40%. 14. A gauge, device comprising: a strain gauge, wherein the strain gauge comprises: a flexible substrate, and a conductor deposited on the flexible substrate, wherein the conductor comprises micron-scale invaginations. 15. The strain gauge of claim 14 , wherein the micron-scale invaginations comprise a heterogeneous topographical portion. 16. The strain gauge of claim 14 , wherein the flexible substrate is configured to be mounted to the skin of a user or patient. 17. A method of sensing a health condition of a user or patient, comprising: coupling a sensor apparatus to a surface of a user or patient overlying structures to be monitored, wherein the sensor apparatus comprises a flexible substrate and a wrinkled conductor disposed on the flexible substrate, the wrinkled conductor being capable of detecting strain; directing current through the sensor apparatus during flexing of the surface; and measuring a characteristic of the sensor apparatus based on the strain to generate an output for a user indicative of the condition of the structures to be monitored. 18. The method of claim 17 , wherein the characteristic of the sensor is a change in the resistance of a conductor thereof. 19. The method of claim 17 , wherein movement of the surface is in response to breathing of the patient or user and the output indicates respiration of the user or patient. 20. The method of claim 17 , wherein movement of the surface is in response to motion of the underlying structure.

Assignees

Inventors

Classifications

  • G01L1/2287Primary

    constructional details of the strain gauges (adjustable resistors H01C10/00) · CPC title

  • G01B7/20Primary

    formed by printed-circuit technique · CPC title

  • Strain gauges · CPC title

  • Nanoscale sensors · CPC title

  • occurring during breathing · CPC title

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Frequently asked questions

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What does patent US10161737B2 cover?
A sensor apparatus including a flexible substrate and a wrinkled conductor disposed on the flexible substrate. In some embodiments, the conductor includes micro-scale invaginations. Also disclosed are methods of making a sensor apparatus, including: placing a mask over a polymeric sheet, wherein the mask is configured to block regions of the polymeric sheet, depositing a conductive structure on…
Who is the assignee on this patent?
Univ California
What technology area does this patent fall under?
Primary CPC classification G01L1/2287. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Dec 25 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).