Metal compound chemically anchored colloidal particles and methods of production and use thereof

US10160884B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10160884-B2
Application numberUS-201615070590-A
CountryUS
Kind codeB2
Filing dateMar 15, 2016
Priority dateMar 23, 2015
Publication dateDec 25, 2018
Grant dateDec 25, 2018

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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Abstract

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Metal compound chemically anchored colloidal particles wherein the metal compound is in molecular form are disclosed. A facile and fast process to chemically anchor metal compounds uniformly onto colloidal particle surfaces via chemical bonding has been developed. Metal compounds are chemically anchored to the surface of colloidal particles via an organic linking agent. Uniformly distributed metal compounds remain in molecular form after the process. The metal compound chemically anchored colloidal particles can be used as solid catalyst in metal chemical-mechanical planarization process.

First claim

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The invention claimed is: 1. Metal compound chemically anchored colloidal particles comprising: colloidal particles; metal compounds uniformly anchored on surfaces of the colloidal particles via an organic linking agent with chemical bonding; wherein the metal compounds are in molecular form; the colloidal particles are selected from silica particles, lattice doped silica particles, germania particles, alumina particles, lattice doped alumina particles, titania particles, zirconium oxide particles, ceria particles, organic polymeric particles, and combinations thereof; and size of the colloidal particles is in the range of 5-1000 nm; and the metal compounds are selected from Fe compounds, Cu compounds, Ag compounds, Cr compounds, Mn compounds, Co compounds, Ni compounds, Ga compounds, and combinations thereof. 2. The metal compound chemically anchored colloidal particles of claim 1 , wherein the colloidal particles are silica particles; the metal compounds are iron compounds; and the metal compound chemically anchored colloidal particles are iron compound chemically anchored silica particles. 3. The metal compound chemically anchored colloidal particles of claim 2 , wherein the iron compound is derived from a water soluble metal compound precursor selected from the group consisting of ammonium iron citrate; iron oxalate; iron acetate; iron tartrate; iron compound having chelating agent selected form the group consisting of nitriloacetic acid, ethylenediamine tetraacetic acid, phosphonic acid, phosphone acid, glycolic acid, lactic acid, malic acid, tartaric acid, α-hydroxy carboxylic acid, siderophores dihydroxyphenylalanine (DOPA), ω-N-hydroxy amino acid, and combinations thereof. 4. The metal compound chemically anchored colloidal particles of claim 1 , wherein the metal compound is derived from a water soluble metal compound precursor containing a carboxylic functional group, 1-amino-ω-(hydroxyamino)alkane chelating agent, or combinations thereof. 5. The metal compound chemically anchored colloidal particles of claim 1 , wherein the organic linking agent has a general molecular structure selected from the group consisting of and combinations thereof; wherein n, m, p, q are the numbers of methylene (—CH 2 —) groups, and each is independently selected from a number from 1 to 12. 6. metal compound chemically anchored colloidal particles of claim 5 , wherein the organic linking agent is selected from the group consisting of (3-Aminopropyl)triethoxysilane (APTES), octadecyl dimethyl ethoxysilane, (3-aminopropyl)-diethoxy-methylsilane, (3-aminopropyl)-dimethyl-ethoxysilane, (3-aminopropyl)-trimethoxysilane, Ethyl(dimethyl)ethoxysilane, 3-(Carboethoxy)propyl dimethyl ethoxysilane , glycidoxypropyltrialkoxysilane, isocyanatopropyltrialkoxysilane, ureidopropyltrialkoxysilane, mercaptopropyltrialkoxysilane, cyanoethyltrialkoxysilane, 4,5-dihydro-1-(3-trialkoxysilylpropyl)imidazole, 3-(trialkoxysilyl)-methyl ester propenoic acid, trialkoxy[3-(oxiranylalkoxy)propyl]-silane, 2-methyl, 3-trialkoxysilyl)propyl ester 2-propenoic acid, [3-(trialkoxysilyl)propyl]urea, N-[(3-Trimethoxysilyl)propyl]ethylenediamine triacetic acid, trimethoxysilylpropyldiethylenetriamine and combinations thereof.

Assignees

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Classifications

  • of conductive or resistive materials · CPC title

  • Aqueous liquid suspensions · CPC title

  • covalent linkages via silicon containing groups · CPC title

  • At least two oxygen atoms present in one at least bidentate or bridging ligand · CPC title

  • Iron compounds · CPC title

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What does patent US10160884B2 cover?
Metal compound chemically anchored colloidal particles wherein the metal compound is in molecular form are disclosed. A facile and fast process to chemically anchor metal compounds uniformly onto colloidal particle surfaces via chemical bonding has been developed. Metal compounds are chemically anchored to the surface of colloidal particles via an organic linking agent. Uniformly distributed me…
Who is the assignee on this patent?
Air Prod & Chem, Versum Mat Us Llc
What technology area does this patent fall under?
Primary CPC classification C09G1/02. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Dec 25 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).