Methods for chemical mechanical polishing and forming interconnect structure
US-2024290629-A1 · Aug 29, 2024 · US
US10160884B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10160884-B2 |
| Application number | US-201615070590-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 15, 2016 |
| Priority date | Mar 23, 2015 |
| Publication date | Dec 25, 2018 |
| Grant date | Dec 25, 2018 |
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Metal compound chemically anchored colloidal particles wherein the metal compound is in molecular form are disclosed. A facile and fast process to chemically anchor metal compounds uniformly onto colloidal particle surfaces via chemical bonding has been developed. Metal compounds are chemically anchored to the surface of colloidal particles via an organic linking agent. Uniformly distributed metal compounds remain in molecular form after the process. The metal compound chemically anchored colloidal particles can be used as solid catalyst in metal chemical-mechanical planarization process.
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The invention claimed is: 1. Metal compound chemically anchored colloidal particles comprising: colloidal particles; metal compounds uniformly anchored on surfaces of the colloidal particles via an organic linking agent with chemical bonding; wherein the metal compounds are in molecular form; the colloidal particles are selected from silica particles, lattice doped silica particles, germania particles, alumina particles, lattice doped alumina particles, titania particles, zirconium oxide particles, ceria particles, organic polymeric particles, and combinations thereof; and size of the colloidal particles is in the range of 5-1000 nm; and the metal compounds are selected from Fe compounds, Cu compounds, Ag compounds, Cr compounds, Mn compounds, Co compounds, Ni compounds, Ga compounds, and combinations thereof. 2. The metal compound chemically anchored colloidal particles of claim 1 , wherein the colloidal particles are silica particles; the metal compounds are iron compounds; and the metal compound chemically anchored colloidal particles are iron compound chemically anchored silica particles. 3. The metal compound chemically anchored colloidal particles of claim 2 , wherein the iron compound is derived from a water soluble metal compound precursor selected from the group consisting of ammonium iron citrate; iron oxalate; iron acetate; iron tartrate; iron compound having chelating agent selected form the group consisting of nitriloacetic acid, ethylenediamine tetraacetic acid, phosphonic acid, phosphone acid, glycolic acid, lactic acid, malic acid, tartaric acid, α-hydroxy carboxylic acid, siderophores dihydroxyphenylalanine (DOPA), ω-N-hydroxy amino acid, and combinations thereof. 4. The metal compound chemically anchored colloidal particles of claim 1 , wherein the metal compound is derived from a water soluble metal compound precursor containing a carboxylic functional group, 1-amino-ω-(hydroxyamino)alkane chelating agent, or combinations thereof. 5. The metal compound chemically anchored colloidal particles of claim 1 , wherein the organic linking agent has a general molecular structure selected from the group consisting of and combinations thereof; wherein n, m, p, q are the numbers of methylene (—CH 2 —) groups, and each is independently selected from a number from 1 to 12. 6. metal compound chemically anchored colloidal particles of claim 5 , wherein the organic linking agent is selected from the group consisting of (3-Aminopropyl)triethoxysilane (APTES), octadecyl dimethyl ethoxysilane, (3-aminopropyl)-diethoxy-methylsilane, (3-aminopropyl)-dimethyl-ethoxysilane, (3-aminopropyl)-trimethoxysilane, Ethyl(dimethyl)ethoxysilane, 3-(Carboethoxy)propyl dimethyl ethoxysilane , glycidoxypropyltrialkoxysilane, isocyanatopropyltrialkoxysilane, ureidopropyltrialkoxysilane, mercaptopropyltrialkoxysilane, cyanoethyltrialkoxysilane, 4,5-dihydro-1-(3-trialkoxysilylpropyl)imidazole, 3-(trialkoxysilyl)-methyl ester propenoic acid, trialkoxy[3-(oxiranylalkoxy)propyl]-silane, 2-methyl, 3-trialkoxysilyl)propyl ester 2-propenoic acid, [3-(trialkoxysilyl)propyl]urea, N-[(3-Trimethoxysilyl)propyl]ethylenediamine triacetic acid, trimethoxysilylpropyldiethylenetriamine and combinations thereof.
of conductive or resistive materials · CPC title
Aqueous liquid suspensions · CPC title
covalent linkages via silicon containing groups · CPC title
At least two oxygen atoms present in one at least bidentate or bridging ligand · CPC title
Iron compounds · CPC title
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