Thermoplastic composition comprising a polyamide and a polysiloxane

Patent metadata

Field	Value
Publication number	US-10160859-B2
Application number	US-201715613782-A
Country	US
Kind code	B2
Filing date	Jun 5, 2017
Priority date	Dec 18, 2014
Publication date	Dec 25, 2018
Grant date	Dec 25, 2018

Abstract

A thermoplastic composition which comprises at least one polyamide, which preferably has a melting point of less than 185° C., and at least one liquid polysiloxane compound which preferably has a viscosity of 750 to 100,000 mPas at 25° C. and is OH terminated, wherein the thermoplastic composition is obtainable by a process comprising the steps:
1 a ) heating the at least one polyamide to a temperature above the melting point of the at least one polyamide and preferably below 185° C.; 2 a ) adding under stirring
the at least one liquid polysiloxane compound to the heated compound(s) of step 1 a ), wherein the temperature is kept above the melting point of the at least one polyamide and preferably below 185° C.; and
3 a ) mixing the obtained mixture of step 2 a ) preferably at 80° to 180° C., more preferably 110 to 140° C.

Use of this the thermoplastic composition according to the present invention in sealants, adhesives, or as rheological modifier or surface modifier. Furthermore, to a hot melt adhesive comprising the thermoplastic composition according to the present invention. And use of this hot melt in vehicle parts, constructions, windows, glazing, sanitary applications, fittings, roofing, plumbing, appliance application and bonding of panes.

First claim

The invention claimed is:

1. A solid at room temperature thermoplastic composition prepared from components comprising at least one polyamide having a melting point of less than 185° C., and at least one liquid, OH terminated polysiloxane compound which has a viscosity of 750 to 100,000 mPas at 25° C.

2. A solid at room temperature thermoplastic composition prepared from components comprising at least one polyamide having a melting point of less than 185° C., and at least one liquid, OH terminated polysiloxane compound which has a viscosity of 750 to 100,000 mPas at 25° C., wherein the solid thermoplastic composition is obtained by a process comprising:
1a) heating the at least one polyamide to a temperature above the melting point of the at least one polyamide and below 185° C.;
2a) adding under stirring the at least one liquid polysiloxane compound to the heated compound(s) of step 1a), wherein the temperature is kept above the melting point of the at least one polyamide and below 185° C.; and
3a) mixing the obtained mixture of step 2a) at 80° to 180° C.

3. The thermoplastic composition according to claim 2 , wherein in step 2a) at least one stabilizing agent is further added.

4. The thermoplastic composition according to claim 2 , wherein the at least one polyamide is present in 25 to 70 wt.-%, based on the total weight of the thermoplastic composition.

5. The thermoplastic composition according to claim 2 , wherein in step 2a) 0.1 to 15 wt.-%, based on the total weight of the thermoplastic composition of at least one stabilizing agent is further added and the stabilizing agent is an amino functional siloxane, different from the at least one liquid polysiloxane.

6. A sealant, adhesive, rheological modifier or surface modifier comprising the thermoplastic composition according to claim 2 .

7. A hot melt adhesive comprising the thermoplastic composition according to claim 2 .

8. The hot melt adhesive according to claim 7 , comprising a filler and optionally comprises an additive.

9. The hot melt adhesive according to claim 7 , comprising a cross-linker.

10. The hot melt adhesive according to claim 7 , comprising a cross-linker selected from methyltris(dimethylketoxime)silane, vinyltris(methylethylketoxime)silane, methyltris(methylethylketoxime)silane and combinations thereof.

11. The hot melt adhesive according to claim 7 , comprising the thermoplastic composition according to claim 2 in an amount of 20 to 80 wt.-%, based on the total weight of the hot melt adhesive.

12. The hot melt adhesive according to claim 7 , comprising filler in an amount of 10 to 60 wt.-%, based on the total weight of the hot melt adhesive.

13. The hot melt adhesive according to claim 7 , comprising silicate filler.

14. The hot melt adhesive according to claim 7 , comprising at least one additive selected from the group consisting of adhesion promoter, stabilizer, tackifier, further thermoplastic polymer, plasticizer, catalyst, moisture scavenger and combinations thereof.

15. The hot melt adhesive according to claim 14 , wherein the at least one additive is present from 0.1 to 30 wt.-%, based on the total weight of the hot melt adhesive.

16. An article comprising the hot melt adhesive according to claim 7 .

17. The article of claim 16 selected from a vehicle part, a construction, a window, glazing, a sanitary application, a fitting, roofing, plumbing, an appliance and glass panes.

Assignees

• Henkel Ag & Co Kgaa

Inventors

• Lanau Sebastien
• Zaffaroni Giorgio
• Marchese Luca
• Moscardin Sebastiano

Classifications

• C09J177/00

  Adhesives based on polyamides obtained by reactions forming a carboxylic amide link in the main chain (based on polyhydrazides C09J179/06; based on polyamide-imides C09J179/08); Adhesives based on derivatives of such polymers · CPC title

• C08L77/06

  Polyamides derived from polyamines and polycarboxylic acids (C08L77/10 takes precedence) · CPC title

• C08K5/5419

  containing at least one Si—C bond · CPC title

• C08L83/06 Primary

  containing silicon bound to oxygen-containing groups (C08L83/12 takes precedence) · CPC title

• C09J183/06

  containing silicon bound to oxygen-containing groups (C09J183/12 takes precedence) · CPC title