Liquid-cooled, composite heat sink assemblies

Patent metadata

Field	Value
Publication number	US-10160072-B2
Application number	US-201514922338-A
Country	US
Kind code	B2
Filing date	Oct 26, 2015
Priority date	Aug 12, 2015
Publication date	Dec 25, 2018
Grant date	Dec 25, 2018

Abstract

A method of fabricating a liquid-cooled heat sink assembly, including: providing a heat transfer element including a heat transfer base having opposite first and second sides, and a plurality of thermally conductive fins extending from the first side of the heat transfer base, the second side of the heat transfer base to couple to a component(s) to be cooled; providing a coolant-carrying structure including a coolant-carrying base and a coolant-carrying compartment through which liquid coolant flows, the coolant-carrying base including a plurality of fin-receiving openings sized and positioned for the plurality of thermally conductive fins of the heat sink base to extend through; and attaching the heat transfer element and coolant-carrying structure together with the plurality of thermally conductive fins extending through the fin-receiving openings in the coolant-carrying base into the coolant-carrying compartment.

First claim

What is claimed is:

1. A fabrication method comprising:
fabricating a liquid-cooled heat sink assembly to cool at least one electronic component, the fabricating of the liquid-cooled heat sink assembly comprising:
providing a heat transfer element comprising a heat transfer base having opposite first and second sides, and a plurality of thermally conductive fins extending from the first side of the heat transfer base, the second side of the heat transfer base to couple to the at least one electronic component to be cooled;
providing a coolant-carrying structure, the coolant-carrying structure including:
a coolant-carrying base, the coolant-carrying base comprising a base surface with a plurality of fin-receiving openings sized and positioned for the plurality of thermally conductive fins of the heat transfer base to extend therethrough, and a base side wall extending from the base surface, the base side wall and the base surface defining, in part, a coolant-carrying compartment through which liquid coolant flows:
a manifold structure attached to the base side wall of the coolant-carrying base and facilitating defining, in part, the coolant-carrying compartment through which the liquid coolant flows, the manifold structure being an injection-molded structure comprising:
a manifold base sized to cover the coolant-carrying base and attach at a first side to the base side wall extending from the base surface of the coolant-carrying base, the manifold base including a second side with a manifold side wall extending therefrom that facilitates defining a coolant outlet manifold region, in part, over the manifold base, the first side and the second side of the manifold base being opposite sides of the manifold base; and
wherein the manifold structure further includes a coolant inlet manifold region defined over the manifold base and within, in part, an area of the base manifold encircled by the manifold side wall;

a manifold cover overlying the manifold base, including over the coolant inlet manifold region and the coolant outlet manifold region defined within the manifold base;

attaching the heat transfer element and coolant-carrying structure together with the plurality of thermally conductive fins extending through the plurality of fin-receiving openings in the coolant-carrying base into the coolant-carrying compartment of the coolant-carrying structure; and
wherein the liquid coolant is received into and flows from the coolant inlet manifold region of the manifold structure into the coolant-carrying compartment with the plurality of thermally conductive fins, and from the coolant-carrying compartment into the coolant outlet manifold region of the manifold structure before exhausting from the liquid-cooled heat sink.

2. The method of claim 1 , wherein fabricating the liquid-cooled heat sink assembly further comprises providing a fluid-tight seal between the heat transfer element and the coolant-carrying structure and providing the plurality of fin-receiving openings to be sized and configured to provide an interference fit with the plurality of thermally conductive fins therein, the interference fit facilitating providing the fluid-tight seal between the heat transfer base and the coolant-carrying structure.

3. The method of claim 1 , wherein the liquid-cooled heat sink assembly comprises a fluid-tight seal between the heat transfer element and the coolant-carrying structure, and fabricating the liquid-cooled heat sink assembly further comprises providing an adhesive sealant between the first side of the heat transfer base of the heat transfer element and the coolant-carrying base of the coolant-carrying structure, the adhesive sealant facilitating providing the fluid-tight seal between the heat transfer element and the coolant-carrying structure.

4. The method of claim 1 , wherein the liquid-cooled heat sink assembly is a composite liquid-cooled heat sink assembly, with the heat transfer element being a metal structure, and the coolant-carrying structure being a plastic structure.

5. The method of claim 4 , wherein the plurality of thermally conductive fins of the heat transfer element comprise an array of thermally conductive pin fins extending from the heat transfer base.

6. The method of claim 1 , wherein the manifold structure further comprises:
a coolant inlet and a coolant outlet; and
at least one inlet orifice in fluid communication with the coolant inlet and the coolant-carrying compartment, and at least one outlet orifice in fluid communication with the coolant outlet and the coolant-carrying compartment, wherein the liquid coolant flows through the coolant inlet, the at least one inlet orifice, the coolant inlet manifold region, the coolant-carrying compartment, the coolant outlet manifold region, and the at least one outlet orifice, to the coolant outlet.

7. The method of claim 6 , wherein the at least one inlet orifice of the manifold structure comprises at least one inlet slot positioned over a central region of the coolant-carrying compartment and facilitating the liquid coolant flow into the coolant-carrying compartment in the central region thereof.

8. The method of claim 1 , wherein fabricating the liquid-cooled heat sink assembly further comprises providing a plurality of heat transfer elements, the heat transfer element being one heat transfer element of the plurality of heat transfer elements, and wherein each heat transfer element of the plurality of heat transfer elements comprises a respective heat transfer base having opposite first and second sides, and a respective plurality of thermally conductive fins extending from the first side thereof, and wherein the plurality of heat transfer elements of the liquid-cooled heat sink assembly are attached to the coolant-carrying structure and spaced apart with a gap therebetween, with the respective pluralities of thermally conductive fins extending through respective pluralities of fin-receiving openings in the coolant-carrying base into the coolant-carrying compartment.

9. The method of claim 8 , wherein the respective pluralities of thermally conductive fins extending from the first side of at least one heat transfer base of at least one heat transfer element of the plurality of heat transfer elements comprise a respective array of thermally conductive pin fins extending from the heat transfer base.

10. The method of claim 8 , wherein the liquid-cooled heat sink assembly is a composite liquid-cooled heat sink assembly, with the plurality of heat transfer elements being a plurality of metal structures, and the coolant-carrying structure being a plastic structure.

Assignees

• IBM

Inventors

• Boday Dylan J
• Campbell Levi A
• David Milnes P
• Demetriou Dustin W
• Ellsworth Jr Michael J
• Schmidt Roger R
• Simons Robert E
• Singh Prabjit
• Wertz Jason T

Classifications

• H05K7/20772 Primary

  within server blades for removing heat from heat source · CPC title

• B23P15/26 Primary

  heat exchangers {or the like (making heat exchangers by methods covered by other subclasses B21D53/02)} · CPC title

• F28F3/12

  Elements constructed in the shape of a hollow panel, e.g. with channels {(F28D1/02, F28D1/03 take precedence)} · CPC title

• F28F3/02

  Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations (F28F3/08 takes precedence) · CPC title

• H05K7/20254

  Cold plates transferring heat from heat source to coolant · CPC title