Connector and electronic device including the same

US10159162B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10159162-B2
Application numberUS-201715430281-A
CountryUS
Kind codeB2
Filing dateFeb 10, 2017
Priority dateMar 10, 2016
Publication dateDec 18, 2018
Grant dateDec 18, 2018

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

A connector and an electronic device having the connector are disclosed. The connector includes: a housing formed with an insulator and mounted at a substrate in order to process a digital signal; a pair of sockets that process a Radio Frequency (RF) signal; a pair of terminals formed at a sub PCB in order to process the RF signal; and a signal processor that processes the RF signal and the digital signal. Various embodiments of the present disclosure are possible.

First claim

Opening claim text (preview).

What is claimed is: 1. A connector, comprising: a housing formed with an insulator and mounted at a substrate configured to process a digital signal; a pair of sockets configured to process a radio frequency (RF) signal; a pair of terminals formed at a sub printed circuit board (PCB) configured to process the RF signal; and a signal processor configured to transmit and receive the RF signal and the digital signal between the substrate and the sub PCB, wherein the housing comprises a plurality of contact portions disposed at an equal gap to process digital signal and an extension portion enclosed from an inside toward an outside of the housing. 2. The connector of claim 1 , wherein the signal processor comprises: RF signal wiring portions that process the RF signal; and a digital signal wiring portion that processes the digital signal, wherein the RF signal wiring portions are located at both sides of the digital signal wiring portion. 3. The connector of claim 2 , wherein one of the RF signal wiring portions is connected between at least one socket of the pair of sockets and a terminal, and wherein another one of the RF signal wiring portions is connected between at least another socket of the pair of sockets and the terminal. 4. The connector of claim 2 , wherein, the plurality of contact portions are disposed at one side of the housing, and wherein the extension portion enclosed from the inside toward the outside at each of upper and lower side walls of the housing and bent at the substrate to be horizontally extended. 5. The connector of claim 1 , wherein the pair of sockets comprise at least one of a coupler, a connection plate installed at the substrate, or a contact pin vertically protruded at a center of the coupler to process the RF signal. 6. The connector of claim 5 , wherein the coupler of the pair of sockets is formed in at least one of a circular shape, a rhombus shape, or a quadrangular shape. 7. The connector of claim 1 , wherein the connector is coupled in a vertical direction to a housing and header mounted in another party connector, when the another party connector corresponding to the connector is inserted into the connector. 8. The connector of claim 7 , wherein the connector is inserted and coupled to the another party connector in which the housing and header are mounted. 9. The connector of claim 1 , wherein the connector is mounted in a printed circuit board (PCB), and wherein a digital signal wiring portion and an RF signal wiring portion of the signal processor are embedded in the PCB. 10. The connector of claim 9 , wherein at a periphery of the RF signal wiring portion, a plurality of via holes are formed at an equal gap. 11. The connector of claim 1 , wherein the RF signal and the digital signal are connected to a transceiver through the connector, and wherein a portion of the digital signal connected to the transceiver is connected to the signal processor through the transceiver. 12. The connector of claim 1 , wherein the RF signal and the digital signal are connected to a transceiver through the connector, and wherein the RF signals each connected to the transceiver are connected between a first antenna and the connector and between a second antenna and the connector, and are connected to the signal processor through at least one of the connector, an RF line switch, or the transceiver. 13. The connector of claim 12 , wherein the RF line switch is an antenna switch at least one of a front end module with integrated duplexer (FEMiD) or a power amp module with integrated duplexer (PAMiD). 14. The connector of claim 1 , wherein the housing is installed at a center of the substrate, and wherein the pair of sockets each are disposed at both sides of the housing. 15. The connector of claim 1 , wherein the pair of sockets each are disposed at one side of a left and right sides of the housing, and an RF signal wiring portions of the signal processor is located at one side of a digital signal wiring portion according to disposition of the pair of sockets. 16. The connector of claim 1 , wherein at a center of the housing, the pair of sockets are disposed, wherein an RF signal wiring portion of the signal processor is located at a center according to disposition of the pair of sockets, and wherein a digital signal wiring portion is located at both sides of the RF signal wiring portion. 17. The connector of claim 1 , wherein the pair of sockets are at least one of horizontally or vertically mounted at the substrate. 18. The connector of claim 1 , wherein at one side and a center of the housing, the pair of sockets are mounted at the substrate, and wherein a digital signal wiring portion and a pair of RF signal wiring portions of the signal processor are alternately located according to disposition of the pair of sockets. 19. An electronic device, comprising: a connector including a housing formed with an insulator and mounted at a substrate configured to process a digital signal; a pair of sockets configured to process a radio frequency (RF) signal; a pair of terminals formed at a sub printed circuit board (PCB) configured to process the RF signal; a signal processor configured to process a digital signal wiring portion and a pair of RF signal wiring portions that are configured to process the RF signal and the digital signal, respectively; and another party connector that mounts a housing and header formed to correspond to at least one of the connector to insert the connector, or inserted and coupled in a vertical direction to the connector, wherein the housing comprises a plurality of contact portions disposed at an equal gap to process the digital signal and an extension portion enclosed from an inside toward an outside of the housing. 20. The electronic device of claim 19 , wherein the connector is mounted in a PCB, wherein the digital signal wiring portion and the pair of RF signal wiring portions of the signal processor are embedded in the PCB, and wherein at a periphery of the RF signal wiring portion, a plurality of via holes is formed at an equal gap.

Assignees

Inventors

Classifications

  • Contacts spaced along planar side wall transverse to longitudinal axis of engagement · CPC title

  • High frequency adaptations (H05K1/0216 takes precedence) · CPC title

  • co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit (H01R12/72 takes precedence) · CPC title

  • Via connections; Lands around holes or via connections (H05K1/112 takes precedence) · CPC title

  • H05K7/1427Primary

    Housings · CPC title

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Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US10159162B2 cover?
A connector and an electronic device having the connector are disclosed. The connector includes: a housing formed with an insulator and mounted at a substrate in order to process a digital signal; a pair of sockets that process a Radio Frequency (RF) signal; a pair of terminals formed at a sub PCB in order to process the RF signal; and a signal processor that processes the RF signal and the dig…
Who is the assignee on this patent?
Samsung Electronics Co Ltd, Samsung Electronics Co Ltd
What technology area does this patent fall under?
Primary CPC classification H05K7/1427. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Dec 18 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).