Layered heater system with honeycomb core structure

Patent metadata

Field	Value
Publication number	US-10159114-B2
Application number	US-40572209-A
Country	US
Kind code	B2
Filing date	Mar 17, 2009
Priority date	Mar 18, 2008
Publication date	Dec 18, 2018
Grant date	Dec 18, 2018

Abstract

A layered heater system is provided that includes an engineered substrate having an upper face sheet, a lower face sheet, and a core disposed between the upper face sheet and the lower face sheet. A dielectric layer is formed on at least one of the upper face sheet and the lower face sheet, a resistive element layer is formed on the dielectric layer, a protective layer is formed on the resistive element layer, and terminal pads are formed over at least a portion of the resistive element layer, wherein the terminal pads are exposed through the protective layer. In one form, the core defines a honeycomb structure, and in another, the core defines a frame structure having a plurality of support ribs.

First claim

What is claimed is:

1. A layered heater system comprising:
an engineered substrate comprising an upper face sheet, a lower face sheet, and a core disposed between the upper face sheet and the lower face sheet;
a resistive element layer formed proximate at least one of the upper face sheet and the lower face sheet;
a protective layer formed on the resistive element layer; and
terminal pads formed over at least a portion of the resistive element layer, wherein the terminal pads are exposed through the protective layer,
wherein the engineered substrate includes a plurality of walls to control a predetermined amount of heat transfer from one of the upper face sheet and the lower face sheet through the plurality of walls to the other one of the upper face sheet and the lower face sheet based on size of the plurality of walls and to control portions of the other one of the upper face sheet and the lower face sheet being heated based on positions of the plurality of walls, and
wherein the resistive element layer is selectively coupled to and decoupled from the engineered substrate such that the resistive element layer conducts heat to the engineered substrate when the resistive element is coupled to the engineered substrate and such that the resistive element layer is thermally isolated from the engineered substrate when the resistive element layer is decoupled from the engineered substrate to define a gap therebetween.

2. The layered heater system according to claim 1 , wherein the core defines a honeycomb structure.

3. The layered heater according to claim 2 , wherein the honeycomb structure comprises a plurality of cells having the plurality of walls, and a thickness of the plurality of walls is tailored for specific heat transfer requirements.

4. The layered heater according to claim 2 , wherein the honeycomb structure comprises a plurality of cells having a peripheral size, and the peripheral size is tailored for specific load carrying capability.

5. The layered heater system according to claim 1 , wherein the upper face sheet and the lower face sheet comprise a stainless steel material.

6. The layered heater system according to claim 1 ,
further comprising a heater plate and a dielectric layer formed on the heater plate, wherein the resistive element is formed on the dielectric layer.

7. The layered heater system according to claim 1 , further comprising at least one temperature sensor.

8. The layered heater system according to claim 7 , further comprising a thermowell disposed within the core to receive the temperature sensor.

9. The layered heater according to claim 1 , further comprising:
an electrical interconnect for use in connecting the terminal pads to a power supply comprising:
a dielectric enclosure defining an inner cavity having a central portion; and
a contact member disposed within the central portion of the inner cavity of the dielectric enclosure, the contact member being adapted for electrical contact with the terminal pad.

10. The layered heater system according to claim 9 , wherein the electrical interconnect is in a high voltage vacuum environment.

Assignees

• Everly Mark
• Swanson Cal
• Kupiszewski Tom
• Ptasienski Kevin
• Lanham Chris
• Stewart Mike
• Watlow Electric Mfg

Inventors

• Everly Mark
• Swanson Cal
• Kupiszewski Tom
• Ptasienski Kevin
• Lanham Chris
• Stewart Mike

Classifications

• F24D13/022

  resistances incorporated in construction elements · CPC title

• F24D13/02

  solely using resistance heating, e.g. underfloor heating · CPC title

• H05B3/265 Primary

  the insulating base being an inorganic material, e.g. ceramic (H05B3/262 takes precedence) · CPC title

• Y02B30/26

  Cross-Sectional Technologies · mapped topic

• Y02B30/00

  Energy efficient heating, ventilation or air conditioning [HVAC] · CPC title