Electronic device having wireless power transmitting/receiving conductive pattern

US10158261B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10158261-B2
Application numberUS-201615236374-A
CountryUS
Kind codeB2
Filing dateAug 12, 2016
Priority dateAug 12, 2015
Publication dateDec 18, 2018
Grant dateDec 18, 2018

How to read this patent

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  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

Various embodiments of the present disclosure may provide an electronic device that includes: a first plate directed in a first direction, a second plate directed in a second direction opposite to the first direction, and a side member configured to surround at least a part of the space between the first and second plates; a first printed circuit board (PCB) that is disposed between the first and second plates and includes at least one processor; a second printed circuit board (PCB) that is disposed between the first printed circuit board and the second plate and includes at least one antenna pattern; and a temperature sensor disposed to measure the temperature of at least a part of the second printed circuit board. Other various embodiments are possible.

First claim

Opening claim text (preview).

What is claimed is: 1. An electronic device comprising: a printed circuit board (PCB); at least one wireless power supply coil mounted on the PCB; at least one temperature sensor disposed on the PCB; a battery pack disposed to face the at least one wireless power supply coil; a rear case in which the battery pack is accommodated, wherein: the at least one temperature sensor is disposed around the at least one wireless power supply coil; the rear case includes a first opening in which the battery pack is accommodated; and the at least one temperature sensor is disposed around the first opening; and a second opening in which the at least one temperature sensor is accommodated and formed around the first opening. 2. The electronic device of claim 1 , wherein the rear case includes a rear cover coupled to the rear case, and wherein the PCB on which the at least one wireless power supply coil is mounted on an inside of the rear cover. 3. The electronic device of claim 1 , wherein the at least one temperature sensor is accommodated in the second opening and disposed adjacent to a protection circuit module (PCM) of the battery pack to face the PCM of the battery pack, wherein the second opening is formed in a recess shape that is sufficient to accommodate the at least one temperature sensor. 4. The electronic device of claim 1 , wherein a thermal spreading sheet and a heat shielding material are attached to the at least one temperature sensor. 5. The electronic device of claim 4 , wherein the thermal spreading sheet is additionally attached to a remaining coil mounting area other than the at least one temperature sensor when the at least one temperature sensor is mounted in a chip type in a first position. 6. The electronic device of claim 5 , wherein the thermal spreading sheet is additionally attached to a remaining coil mounting area that contains the at least one temperature sensor when the at least one temperature sensor is mounted in a pattern type in a first position. 7. The electronic device of claim 1 , wherein the at least one wireless power supply coil comprises a wireless charging coil antenna, a wireless short-range communication coil antenna, and a secure transfer coil antenna, and wherein the at least one temperature sensor is disposed around the wireless charging coil antenna. 8. An electronic device comprising: a support structure; a display disposed on a first surface of the support structure; a first PCB disposed on a second surface opposite to the first surface of the support structure; a rear case coupled to the support structure; a battery pack accommodated in the rear case; a front cover disposed on a front of the display; a rear cover disposed on a back of the rear case; a second PCB mounted on the rear cover; at least one wireless charging coil provided on the second PCB; and at least one temperature sensor disposed around the at least one wireless charging coil, wherein: the at least one temperature sensor is accommodated in a first opening of the rear case so as to be adjacent to the battery pack accommodated in the first opening of the rear case; and the at least one temperature sensor is formed around the first opening and accommodated in a second opening adjacent to the battery pack. 9. The electronic device of claim 8 , wherein the front cover or the rear cover is formed of at least one of a synthetic resin material, a metal material, or a glass material, and is flat or includes a curved edge. 10. The electronic device of claim 8 , wherein the battery pack is disposed parallel to the rear case without overlapping with the rear case, and wherein the at least one wireless charging coil is disposed to overlap the battery pack while facing the battery pack. 11. An electronic device comprising: a first plate directed in a first direction, a second plate directed in a second direction opposite to the first direction, and a side member configured to surround at least a part of a space between the first and second plates; a first printed circuit board (PCB) disposed between the first and second plates and comprises at least one processor; a second PCB disposed between the first PCB and the second plate and comprises at least one antenna pattern; and a temperature sensor configured to measure a temperature of at least a part of the second PCB. 12. The electronic device of claim 11 , wherein at least a part of the temperature sensor is disposed on the second PCB or in an interior of the second PCB. 13. The electronic device of claim 11 , wherein the second PCB comprises: a flexible printed circuit board (FPCB); the at least one antenna pattern comprising a first coil-type antenna pattern and a second coil-type antenna pattern configured to surround the first coil-type antenna pattern when viewed from above the second plate; and the temperature sensor disposed outside the second coil-type antenna pattern when viewed from above the second plate. 14. The electronic device of claim 11 , wherein the second PCB comprises: an FPCB; the at least one antenna pattern comprising a first coil-type antenna pattern and a second coil-type antenna pattern configured to surround the first coil-type antenna pattern when viewed from above the second plate; and the temperature sensor disposed within an area surrounded by the first coil-type antenna pattern when viewed from above the second plate. 15. The electronic device of claim 11 , wherein the second PCB comprises: an FPCB; the at least one antenna pattern comprising a first coil-type antenna pattern and a second coil-type antenna pattern configured to surround the first coil-type antenna pattern when viewed from above the second plate; and the temperature sensor disposed to at least partially overlap the first coil-type antenna pattern when viewed from above the second plate. 16. The electronic device of claim 11 , wherein the second PCB comprises: an FPCB; the at least one antenna pattern comprising at least one coil-type antenna pattern; and the temperature sensor disposed outside the at least one antenna pattern when viewed from above the second plate. 17. The electronic device of claim 11 , further comprising a thermal spreading sheet disposed between the first and second PCBs, wherein the temperature sensor is disposed to make contact with, or adjacent to, a part of the thermal spreading sheet, and wherein the thermal spreading sheet is disposed to at least partially contact the second PCB.

Assignees

Inventors

Classifications

  • Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers · CPC title

  • Multilayer circuits · CPC title

  • including a sensor for measuring a physical value, e.g. temperature or motion · CPC title

  • Cooling of mounted components (H05K1/0272 takes precedence) · CPC title

  • for a printed circuit board assembly · CPC title

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Frequently asked questions

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What does patent US10158261B2 cover?
Various embodiments of the present disclosure may provide an electronic device that includes: a first plate directed in a first direction, a second plate directed in a second direction opposite to the first direction, and a side member configured to surround at least a part of the space between the first and second plates; a first printed circuit board (PCB) that is disposed between the first a…
Who is the assignee on this patent?
Samsung Electronics Co Ltd, Samsung Electronics Co Ltd
What technology area does this patent fall under?
Primary CPC classification H02J50/90. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Dec 18 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).