Enhanced capacitance touch screen display and methods for use therewith
US-2024411406-A1 · Dec 12, 2024 · US
US10156748B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10156748-B2 |
| Application number | US-201415037226-A |
| Country | US |
| Kind code | B2 |
| Filing date | Nov 28, 2014 |
| Priority date | Nov 28, 2013 |
| Publication date | Dec 18, 2018 |
| Grant date | Dec 18, 2018 |
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A matrix circuit substrate, having: a substrate body, having a first surface and a second surface which are opposite each other, and at least one sidewall located between the first surface and the second surface, the sidewall having at least one recess; multiple electrodes, disposed in a crisscross arrangement on the first surface; and at least one first conductive material, disposed in the recess to correspond to at least one of the electrodes, and electrically connected to the electrode. Additionally, a display apparatus having such substrate, and to a method for manufacturing such substrate.
Opening claim text (preview).
The invention claimed is: 1. A display apparatus, comprising: a matrix circuit substrate comprising a substrate body, having a first surface and a second surface which are opposite each other, and at least one sidewall located between the first surface and the second surface, the sidewall having at least one recess; multiple electrodes, disposed in a crisscross arrangement on the first surface; and at least one first conductive material, disposed in the recess to correspond to at least one of the electrodes, and electrically connected to the electrode, wherein said recess does not extend to said second surface; a display medium, driven by the matrix circuit substrate; and a counter substrate disposed opposite the matrix circuit substrate, wherein a sidewall of the counter substrate has at least one second recess, and the first conductive material is also disposed in the second recess. 2. The display apparatus according to claim 1 , wherein the first conductive material is electrically connected to a circuit of the counter substrate. 3. The display apparatus according to claim 1 , wherein the cross sectional area of the recess on the sidewall is larger than the cross sectional area of the electrode in the plane defined by said sidewall. 4. The display apparatus according to claim 1 , further comprising: an electrical connection element, which is electrically connected to the first conductive material. 5. The display apparatus according to claim 4 , further comprising: a second conductive material, disposed on the sidewall between the electrical connection element and the first conductive material, to connect the first conductive material electrically to the electrical connection element. 6. The display apparatus according to claim 4 , further comprising: a control circuit electrically connected to the electrical connection element. 7. The display apparatus according to claim 1 , wherein the recess extends to the first surface. 8. A display apparatus, comprising: a matrix circuit substrate comprising a substrate body, having a first surface and a second surface which are opposite each other, and at least one sidewall located between the first surface and the second surface, the sidewall having at least one recess; multiple electrodes, disposed in a crisscross arrangement on the first surface; and at least one first conductive material, disposed in the recess to correspond to at least one of the electrodes, and electrically connected to the electrode, wherein said recess does not extend to said second surface; a display medium, driven by the matrix circuit substrate; and a counter substrate disposed opposite the matrix circuit substrate, wherein the counter substrate further includes a third conductive material, a sidewall of the counter substrate also having at least one second recess in which the third conductive material is disposed. 9. The display apparatus according to claim 8 , wherein the cross sectional area of the recess on the sidewall is larger than the cross sectional area of the electrode in the plane defined by said sidewall. 10. The display apparatus according to claim 8 , further comprising: an electrical connection element, which is electrically connected to the first conductive material. 11. The display apparatus according to claim 10 , further comprising: a second conductive material, disposed on the sidewall between the electrical connection element and the first conductive material, to connect the first conductive material electrically to the electrical connection element. 12. The display apparatus according to claim 10 , further comprising: a control circuit electrically connected to the electrical connection element. 13. The display apparatus according to claim 8 , wherein the recess extends to the first surface. 14. A method for manufacturing a display apparatus, the method comprising the following steps: manufacturing a matrix circuit substrate by drilling a mother substrate to form at least one hole that does not run all the way through said mother substrate, wherein the mother substrate has multiple electrodes in a crisscross configuration; filling the hole with a first conductive material, wherein at least one of the electrodes is electrically connected to the first conductive material; cutting the mother substrate to form at least one substrate body, each substrate body having a first surface and a second surface opposite each other and at least one sidewall located between the first surface and the second surface; and grinding the sidewall up to the hole, so that the hole forms a recess in the sidewall and the first conductive material is exposed on the sidewall; forming the matrix circuit substrate with a display medium, driven by the matrix circuit substrate, and a counter substrate disposed opposite the matrix circuit substrate, wherein a sidewall of the counter substrate has at least one second recess, and the first conductive material is also disposed in the second recess. 15. The method according to claim 14 , further comprising: curing the first conductive material with which the hole is filled. 16. The method according to claim 14 , further comprising: joining an electrical connection element to the sidewall, so that the electrical connection element is electrically connected to the first conductive material. 17. The method according to claim 14 , wherein the step of grinding the sidewall comprises grinding up to the hole to form a recess, the cross sectional area of the recess on the sidewall being larger than the cross sectional area of the electrode.
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