Hot melt adhesive composition including a block composite compatibilizer

US10155889B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10155889-B2
Application numberUS-201515505493-A
CountryUS
Kind codeB2
Filing dateAug 20, 2015
Priority dateAug 21, 2014
Publication dateDec 18, 2018
Grant dateDec 18, 2018

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  1. Title

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  2. Abstract

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  4. Key dates

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  5. First independent claim

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Abstract

Official abstract text for this publication.

A hot melt adhesive (HMA) composition includes (A) from 1-60 wt % of a block composite compatibilizer comprising (i) a hard polymer that includes propylene, (ii) a soft polymer that includes ethylene, and (iii) a block copolymer having a soft block and a hard block, the hard block of the block copolymer having the same composition as the hard polymer of the block composite compatibilizer and the soft block of the block copolymer having the same composition as the soft polymer of the block composite compatibilizer; (B) from 1-70 wt % of a tackifier; (C) from 1-40 wt % of at least one selected from the group of a wax and an oil; and (D) Optionally, from greater than zero to 97 wt % of a polymer component that includes an ethylene-based polymer and/or a propylene-based polymer.

First claim

Opening claim text (preview).

What is claimed is: 1. A hot melt adhesive composition, comprising: (A) 1-60 wt % of a block composite compatibilizer comprising: (i) a hard polymer that includes propylene; (ii) a soft polymer that includes ethylene; and (iii) a block copolymer having a soft block and a hard block, the hard block of the block copolymer having the same composition as the hard polymer of the block composite compatibilizer and the soft block of the block copolymer having the same composition as the soft polymer of the block composite compatibilizer; (B) 1-70 wt % of a tackifier; (C) 1-40 wt % of at least one selected from the group of a wax and an oil; and (D) from greater than zero to 97 wt % of a polymer component that includes an ethylene-based polymer having a density from 0.86 g/cc to 0.885 g/cc, a melt index (I 2 ) from 5 g/10 min to 3,000 g/10 min, and a Brookfield viscosity of less than 50,000 centipoise (cP). 2. The hot melt adhesive composition as claimed in claim 1 , wherein the soft block of the block copolymer includes from 50 wt % to 84 wt % of units derived from ethylene with a remainder derived from propylene. 3. The hot melt adhesive composition as claimed in claim 2 , wherein the hard block of the block copolymer includes from 0 wt % to 20 wt % of units derived from ethylene and a remainder derived from propylene. 4. The hot melt adhesive composition as claimed in claim 1 , wherein the block composite compatibilizer has a microstructure index of greater than 1 to less than 20. 5. The hot melt adhesive composition as claimed in claim 1 , wherein the block composite compatibilizer has a block composite index of greater than 0 and less than 1.0. 6. The hot melt adhesive composition as claimed in claim 1 , wherein the block composite compatabilizer has a modified block composite index of greater than 0 and less than 1.0. 7. The hot melt adhesive composition as claimed in claim 1 , further comprising from 1-5 wt % of an antioxidant. 8. The hot melt adhesive composition as claimed in claim 1 , wherein the block composite compatabilizer has a melt index (I 2 ) from 300 g/10 min to 700 g/10 min. 9. The hot melt adhesive composition as claimed in claim 1 , further comprising a propylene based polymer and an ethylene based wax. 10. The hot melt adhesive composition as claimed in claim 1 , wherein the composition has a peel adhesion failure temperature of from 50° C. to 70° C. 11. The holt melt adhesive composition as claimed in claim 1 , wherein the composition has a fiber tear greater than 60% at a temperature of from −40° C. to 60° C. 12. The hot melt adhesive composition as claimed in claim 1 , wherein the composition has a set time of less than or equal to 3 seconds. 13. A hot melt adhesive composition, comprising: (A) 1-60 wt % of a block composite compatibilizer comprising: (i) a hard polymer that includes propylene; (ii) a soft polymer that includes ethylene; and (iii) a block copolymer having a soft block and a hard block, the hard block of the block copolymer having the same composition as the hard polymer of the block composite compatibilizer and the soft block of the block copolymer having the same composition as the soft polymer of the block composite compatibilizer; (B) 1-70 wt % of a tackifier; (C) 1-40 wt % of at least one selected from the group of a wax and an oil; and (D) from greater than zero to 97 wt % of a polymer component that includes a propylene-based polymer having a density from 0.85 g/cc to 0.90 g/cc and a Brookfield viscosity of less than 50,000 cP. 14. A hot melt adhesive composition, comprising: (A) 1-60 wt % of a block composite compatibilizer comprising: (i) a hard polymer that includes propylene; (ii) a soft polymer that includes ethylene; and (iii) a block copolymer having a soft block and a hard block, the hard block of the block copolymer having the same composition as the hard polymer of the block composite compatibilizer and the soft block of the block copolymer having the same composition as the soft polymer of the block composite compatibilizer; (B) 1-70 wt % of a tackifier; (C) 1-40 wt % of at least one selected from the group of a wax and an oil; and (D) from greater than zero to 97 wt % of a polymer component that includes: an ethylene-based polymer having a density from 0.86 g/cc to 0.885 g/cc, a melt index (I 2 ) from 5 g/10 min to 3,000 g/10 min, and a Brookfield viscosity of less than 50,000 centipoise (cP), and a propylene-based polymer having a density from 0.85 g/cc to 0.90 g/cc and a Brookfield viscosity of less than 50,000 cP. 15. An article comprising: a substrate; and a hot melt adhesive composition as claimed in claim 1 on at least one surface of the substrate.

Assignees

Inventors

Classifications

  • Macromolecular additives · CPC title

  • Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers · CPC title

  • Polyethylene · CPC title

  • C09J153/00Primary

    Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers · CPC title

  • Presence of block copolymer · CPC title

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What does patent US10155889B2 cover?
A hot melt adhesive (HMA) composition includes (A) from 1-60 wt % of a block composite compatibilizer comprising (i) a hard polymer that includes propylene, (ii) a soft polymer that includes ethylene, and (iii) a block copolymer having a soft block and a hard block, the hard block of the block copolymer having the same composition as the hard polymer of the block composite compatibilizer and th…
Who is the assignee on this patent?
Dow Global Technologies Llc
What technology area does this patent fall under?
Primary CPC classification C09J153/00. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Dec 18 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).