Curable adhesive compositions
US-9074040-B2 · Jul 7, 2015 · US
Structural PU adhesive for composite bonding
US10155838B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10155838-B2 |
| Application number | US-201414898916-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jul 24, 2014 |
| Priority date | Jul 31, 2013 |
| Publication date | Dec 18, 2018 |
| Grant date | Dec 18, 2018 |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
A new polyurethane (PU) adhesive composition having unique properties in automotive related applications such as composite bonding.
First claim
Opening claim text (preview).
The invention claimed is: 1. A one-component adhesive composition comprising 3 to 50 wt %, based on the total weight of the adhesive composition, of o,o′-diallyl-bisphenol A, 5 to 50 wt %, based on the total weight of the adhesive composition, of a dimeric isocyanate selected from dimeric toluene diisocyanate and dimeric methylene diphenyl diisocyanate encapsulated by deactivating the surface of the dimeric isocyanate with an aliphatic polyamine, an aliphatic polyol having a functionality greater than 2 and a catalyst; wherein the composition has an elastic modulus of above 50 MPa. 2. The composition of claim 1 wherein the catalyst comprises Sn—, Zr, Ti, Bi-metallo-organic compound or mixture thereof. 3. The composition of claim 1 , wherein the catalyst comprises Bi-neodecanoate. 4. The composition of claim 1 wherein the catalyst is a Sn—, Zr—, Ti— or Bi-metallo-organic compound in combination with chelating ligands.
Assignees
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Classifications
containing urethdione groups · CPC title
- C08G18/5024Primary
containing primary and/or secondary amino groups · CPC title
containing aromatic groups or benzoquinone groups · CPC title
of antimony, bismuth or arsenic · CPC title
using additives, e.g. absorbing agents · CPC title
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Frequently asked questions
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- What does patent US10155838B2 cover?
- A new polyurethane (PU) adhesive composition having unique properties in automotive related applications such as composite bonding.
- Who is the assignee on this patent?
- Dow Global Technologies Llc
- What technology area does this patent fall under?
- Primary CPC classification C08G18/5024. Mapped technology areas include Chemistry & Metallurgy.
- When was this patent published?
- Publication date Tue Dec 18 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).