Diamond surface polishing method and apparatus for implementing same

Patent metadata

Field	Value
Publication number	US-10155293-B2
Application number	US-201715696491-A
Country	US
Kind code	B2
Filing date	Sep 6, 2017
Priority date	Mar 9, 2015
Publication date	Dec 18, 2018
Grant date	Dec 18, 2018

Abstract

The diamond surface polishing method according to the present invention involves polishing a polished object, the surface of which is made of diamond, by rubbing a polishing member having an elongated shape such as a linear or belt-like shape and containing at least a metal or a metal oxide against the diamond surface, wherein a pressing force of the polishing member is controlled in accordance with material properties of the polishing member and/or a shape of the polished object and a diamond crystal size in a rubbing section so that contact surface pressure in a machining area becomes uniform.

First claim

The invention claimed is:

1. A diamond surface polishing method for polishing a polished object, the surface of which is made of diamond, the method comprising:
rubbing a polishing member having an elongated shape and containing at least a metal or a metal oxide against the diamond surface,
wherein, while a polishing surface of the polishing member is continuously or intermittently paid out, a pressing force of the polishing member is controlled in accordance with at least one of (i) material properties of the polishing member and (ii) a shape of the polished object in a rubbing section, so that contact surface pressure in a machining area becomes uniform, and
wherein the pressing force of the polishing member is corrected in accordance with a crystal size of the diamond surface of the polished object.

2. The diamond surface polishing method according to claim 1 , wherein the pressing force of the polishing member is increased with increasing crystal size of the diamond surface of the polished object, and decreased with decreasing crystal size of the diamond surface of the polished object.

3. A diamond surface polishing apparatus, comprising:
means for holding a polished object;
a polishing member having an elongated shape and containing at least a metal or a metal oxide;
means for pressing the polishing member toward a machining surface of the polished object; and
means for causing the polishing member and the polished object to relatively move and rub against each other,
the diamond surface polishing apparatus further comprising:
means for inputting and storing a shape or coordinate information of the polished object;
means for inputting or computing a pressing force of the means for pressing the polishing member in accordance with the shape of the polished object; and
means for inputting a crystal size of a diamond,
wherein the pressing force is correctively computed in accordance with the crystal size that has been input,
wherein while a polishing surface of the polishing member is continuously or intermittently paid out, the means for pressing the polishing member is controlled in accordance with the pressing force that has been input or computed in accordance with the shape of the polished object and that has been correctively computed in accordance with the crystal size.

4. The diamond surface polishing apparatus according to claim 3 , wherein the means for inputting or computing a pressing force computes the pressing force so that the contact surface pressure in the machining area becomes uniform.

5. The polishing apparatus according to claim 3 , further comprising means for continuously or intermittently paying out the polishing member.

6. The polishing apparatus according to claim 4 , further comprising means for continuously or intermittently paying out the polishing member.

7. The polishing apparatus according to claim 3 , further comprising means for rotating the means for holding the polished object.

8. The polishing apparatus according to claim 4 , further comprising means for rotating the means for holding the polished object.

9. The polishing apparatus according to claim 5 , further comprising means for rotating the means for holding the polished object.

10. The polishing apparatus according to claim 6 , further comprising means for rotating the means for holding the polished object.

11. The diamond surface polishing apparatus according to claim 3 , further comprising:
a storage unit configured to store correspondence information between a correction amount for correcting the pressing force and a crystal size of the diamond; and
a control unit configured to read the correspondence information from the storage unit based on the crystal size that has been input, to compute a corrected pressing force based on the correspondence information, and to output the corrected pressing force to the means for pressing the polishing member,
wherein the pressing force of the polishing member is increased with increasing crystal size, and decreased with decreasing crystal size.

12. The diamond surface polishing apparatus according to claim 4 , further comprising:
a storage unit configured to store correspondence information between a correction amount for correcting the pressing force and a crystal size of the diamond; and
a control unit configured to read the correspondence information from the storage unit based on the crystal size that has been input, to compute a corrected pressing force based on the correspondence information, and to output the corrected pressing force to the means for pressing the polishing member,
wherein the pressing force of the polishing member is increased with increasing crystal size, and decreased with decreasing crystal size.

13. The diamond surface polishing apparatus according to claim 5 , further comprising:
a storage unit configured to store correspondence information between a correction amount for correcting the pressing force and a crystal size of the diamond; and
a control unit configured to read the correspondence information from the storage unit based on the crystal size that has been input, to compute a corrected pressing force based on the correspondence information, and to output the corrected pressing force to the means for pressing the polishing member,
wherein the pressing force of the polishing member is increased with increasing crystal size, and decreased with decreasing crystal size.

14. The diamond surface polishing apparatus according to claim 6 , further comprising:
a storage unit configured to store correspondence information between a correction amount for correcting the pressing force and a crystal size of the diamond; and
a control unit configured to read the correspondence information from the storage unit based on the crystal size that has been input, to compute a corrected pressing force based on the correspondence information, and to output the corrected pressing force to the means for pressing the polishing member,
wherein the pressing force of the polishing member is increased with increasing crystal size and decreased with decreasing crystal size.

15. The diamond surface polishing apparatus according to claim 7 , further comprising:
a storage unit configured to store correspondence information between a correction amount for correcting the pressing force and a crystal size of the diamond; and
a control unit configured to read the correspondence information from the storage unit based on the crystal size that has been input, to compute a corrected pressing force based on the correspondence information, and to output the corrected pressing force to the means for pressing the polishing member,
wherein the pressing force of the polishing member is increased with increasing crystal size, and decreased with decreasing crystal size.

16. The diamond surface polishing apparatus according to claim 8 , further comprising:
a storage unit configured to store correspondence information between a correction amount for correcting the pressing force and a crystal size of the diamond; and
a control unit configured to read the correspondence information from the storage unit based on the crystal size that has been input, to compute a corrected pressing force based on the correspondence information, and to output the corrected pressing force to the means for pressing the polishing member,
wherein the pressing force of the polishing member is increased with increasing crystal size, and decreased with decreasing crystal size.

17. The diamond surface polishing apparatus according to claim 9 , f

Assignees

• Toyo Seikan Group Holdings Ltd

Inventors

• Shimamura Masahiro
• Takao Kenichi
• Shiroishi Ryozo

Classifications

• B24B9/16 Primary

  of diamonds; of jewels or the like; Diamond grinders' dops; Dop holders or tongs (for grinding sharp pointed diamonds or sapphires B24B19/16) · CPC title

• B24B21/00

  Machines or devices using grinding or polishing belts (for sharpening cutting edges of tools B24B3/00; portable belt-grinding machines B24B23/06); Accessories therefor · CPC title