Metal dewetting methods and articles produced thereby

Patent metadata

Field	Value
Publication number	US-10155248-B2
Application number	US-201615044330-A
Country	US
Kind code	B2
Filing date	Feb 16, 2016
Priority date	Nov 30, 2011
Publication date	Dec 18, 2018
Grant date	Dec 18, 2018

Abstract

Described herein are improved dewetting methods and improved patterned articles produced using such methods. The improved methods and articles generally implement continuous ultra-thin metal-containing films or film stacks as the materials to be dewetted. For example, a method can involve the steps of providing a substrate that has a continuous ultra-thin metal-containing film or film stack disposed on a surface thereof, and dewetting at least a portion of the continuous ultra-thin metal-containing film or film stack to produce a plurality of discrete metal-containing dewetted islands on the surface of the substrate.

First claim

What is claimed is:

1. A method of forming a patterned article, the method comprising:
providing a substrate comprising a continuous ultra-thin metal-containing film stack disposed on a surface of the substrate, wherein the continuous ultra-thin metal-containing film stack comprises at least a first layer disposed on the surface of the substrate and a second layer disposed on the first layer; and
dewetting at least a portion of the second layer of the continuous ultra-thin metal-containing film stack to produce a plurality of discrete metal-containing dewetted islands on a surface of the first layer of the continuous ultra-thin metal-containing film stack,
wherein the dewetting comprises a thermal treatment for a time and at a temperature sufficient to produce the plurality of discrete metal-containing dewetted islands on the surface of the first layer of the continuous ultra-thin metal-containing film stack such that the plurality of discrete metal-containing dewetted islands have an average height of 5 nanometers to 300 nanometers, an average longest lateral cross-sectional dimension of 10 nanometers to 1000 nanometers, and are randomly oriented on the surface of the first layer of the continuous ultra-thin metal-containing film stack so as to cover less than or equal to 0.5 of an area fraction of the surface of the first layer of the continuous ultra-thin metal-containing film stack.

2. The method of forming a patterned article of claim 1 , wherein the continuous ultra-thin metal-containing film stack has an average thickness of less than or equal to 10 nanometers.

3. The method of forming a patterned article of claim 1 , wherein the continuous ultra-thin metal-containing film stack comprises no openings or void spaces in an area defined by its perimeter.

4. The method of forming a patterned article of claim 1 , wherein the continuous ultra-thin metal-containing film stack comprises a metal in its elemental form or a metal that is a constituent of an alloy.

5. The method of forming a patterned article of claim 1 , wherein the continuous ultra-thin metal-containing film stack comprises a passivation layer.

6. The method of forming a patterned article of claim 1 , wherein the thermal treatment is carried out at a temperature of less than or equal to 800 degrees Celsius.

7. The method of forming a patterned article of claim 1 , wherein the thermal treatment is carried out for a time of less than or equal to 1 hour.

8. The method of forming a patterned article of claim 1 , wherein the substrate comprises a silicate glass, borosilicate glass, aluminosilicate glass, or boroaluminosilicate glass.

9. The method of forming a patterned article of claim 1 , wherein the substrate comprises a glass-ceramic.

10. The method of forming a patterned article of claim 9 , wherein the glass-ceramic comprises a ceramic phase, wherein the ceramic phase comprises β-spodumene, β-quartz, nepheline, kalsilite, or carnegieite.

11. The method of forming a patterned article of claim 1 , wherein the substrate comprises a ceramic material or a polymer.

12. The method of forming a patterned article of claim 1 , wherein the substrate has an average thickness in the range from 0.02 millimeters (mm) to 2 mm.

13. A method of forming a patterned article, the method comprising:
dewetting at least a portion of a second layer of a continuous ultra-thin metal-containing film stack to produce a plurality of discrete metal-containing dewetted islands on a surface of a first layer of the continuous ultra-thin metal-containing film stack,
wherein the continuous ultra-thin metal-containing film stack is disposed on a surface of a substrate, the first layer is disposed on a surface of the substrate and the second layer is disposed on the first layer, and
wherein the plurality of discrete metal-containing dewetted islands have an average height of 5 nanometers to 300 nanometers, an average longest lateral cross-sectional dimension of 10 nanometers to 1000 nanometers, and are randomly oriented on the surface of the first layer of the continuous ultra-thin metal-containing film stack so as to cover less than or equal to 0.5 of an area fraction of the surface of the first layer of the continuous ultra-thin metal-containing film stack.

14. The method of forming a patterned article of claim 13 , wherein the dewetting comprises a thermal treatment.

15. The method of forming a patterned article of claim 14 , wherein the thermal treatment is carried out at a temperature of less than or equal to 800 degrees Celsius.

16. The method of forming a patterned article of claim 14 , wherein the thermal treatment is carried out for a time of less than or equal to 1 hour.

17. The method of forming a patterned article of claim 13 , wherein the continuous ultra-thin metal-containing film stack has an average thickness of less than or equal to 10 nanometers.

18. The method of forming a patterned article of claim 13 , wherein the continuous ultra-thin metal-containing film stack comprises no openings or void spaces in an area defined by its perimeter.

19. The method of forming a patterned article of claim 13 , wherein the continuous ultra-thin metal-containing film stack comprises a metal in its elemental form or a metal that is a constituent of an alloy.

20. The method of forming a patterned article of claim 13 , wherein the continuous ultra-thin metal-containing film stack comprises a passivation layer.

Assignees

• Corning Inc
• Icfo The Inst Of Photonic Sciences
• Icrea Inst Catalana De Recerca I Estudis Avancats

Inventors

• Baker David Eugene
• Carbonell Carme Gomez
• Dawson-Elli David Francis
• Mazumder Prantik
• Pruneri Valerio
• Tian Lili

Classifications

• B32B33/00

  Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class · CPC title

• Y10T428/24355

  Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.] · CPC title

• B05D3/007 Primary

  After-treatment · CPC title

• C03C17/06

  with metals (C03C17/34, C03C17/44 take precedence) · CPC title

• C23C14/5806

  Thermal treatment · CPC title