Implantable modular electrode array assembly

Patent metadata

Field	Value
Publication number	US-10155107-B2
Application number	US-201615285817-A
Country	US
Kind code	B2
Filing date	Oct 5, 2016
Priority date	Oct 7, 2015
Publication date	Dec 18, 2018
Grant date	Dec 18, 2018

Abstract

This disclosure describes various modular electrode assemblies. For example, an implantable modular electrode assembly may include a hub including a plurality of electrical contacts configured to receive electrical signals from an implantable medical device, a first electrode module including a first substrate and a first plurality of electrodes on the first substrate, and a second electrode module including a second substrate and a second plurality of electrodes on the second substrate. The first and second electrode modules may be connectable to the hub, where the plurality of electrical contacts electrically communicate with the first and second plurality of electrodes.

First claim

What is claimed is:

1. An implantable modular electrode assembly comprising:
a hub comprising:
a plurality of electrical contacts; and
a hub substrate defining a plurality of ports, wherein each port of the plurality of ports comprises a respective electrical contact of the plurality of electrical contacts, and wherein the hub is configured to receive electrical signals from an implantable medical device;

a first electrode module comprising:
a first substrate;
a first plurality of electrodes on the first substrate; and
a plurality of electrical connectors on a surface of the first substrate, wherein each electrical connector of the plurality of electrical connectors is configured to be received by a respective port of the plurality of ports to connect the first electrode module to the hub, wherein at least some of the plurality of electrical contacts electrically communicate with the first plurality of electrodes; and

a second electrode module comprising a second substrate and a second plurality of electrodes on the second substrate, wherein the second electrode module is connectable to the hub, wherein at least some of the plurality of electrical contacts electrically communicate with the second plurality of electrodes.

2. The implantable modular electrode assembly of claim 1 , wherein the plurality of electrical connectors on a surface of the first substrate comprises a first plurality of electrical connectors on a surface of the first substrate, wherein the second electrode module comprises a second plurality of electrical connectors on a surface of the second substrate, wherein each electrical connector of the second plurality of electrical connectors is configured to be received by a respective port of the plurality of ports to connect the second electrode module to the hub.

3. The implantable modular electrode assembly of claim 1 , wherein the first plurality of electrodes form a first two-dimensional array on the surface of the first substrate.

4. The implantable modular electrode assembly of claim 3 , wherein the second plurality of electrodes form a second two-dimensional array on the surface of the second substrate, wherein the first two-dimensional array and the second two-dimensional array form mirror images of one another.

5. The implantable modular electrode assembly of claim 3 , wherein the second plurality of electrodes form a second two-dimensional array on the surface of the second substrate, wherein the first two-dimensional array is different than the second two-dimensional array.

6. The implantable modular electrode assembly of claim 1 , wherein the hub comprises a connector assembly configured to receive a lead, wherein the lead includes conductors to transmit the electrical signals from the implantable medical device to the hub.

7. The implantable modular electrode assembly of claim 1 , wherein the first substrate comprises a first flexible substrate and the second substrate comprises a second flexible substrate.

8. The implantable modular electrode assembly of claim 1 , wherein the first electrode module is detachably coupled to the hub.

9. A system comprising:
an implantable medical device;
at least one lead electrically connected to the implantable medical device; and
a modular electrode assembly electrically connected to at least one lead, the modular electrode assembly comprising:
a hub comprising:
a plurality of electrical contacts; and
a hub substrate defining a plurality of ports, wherein each port of the plurality of ports comprises a respective electrical contact of the plurality of electrical contacts, and wherein the hub is configured to receive electrical signals from the implantable medical device;

a first electrode module comprising:
a first substrate;
a first plurality of electrodes on the first substrate; and
a plurality of electrical connectors on a surface of the first substrate, wherein each electrical connector of the plurality of electrical connectors is configured to be received by a respective port of the plurality of ports to connect the first electrode module to the hub, wherein at least some of the plurality of electrical contacts electrically communicate with the first plurality of electrodes; and

a second electrode module comprising a second substrate and a second plurality of electrodes on the second substrate, wherein the second electrode module is connectable to the hub, wherein at least some of the plurality of electrical contacts electrically communicate with the second plurality of electrodes;

wherein the implantable medical device is configured to transmit electrical signals through the lead to the first and second plurality of electrodes.

10. The system of claim 9 , wherein the plurality of electrical connectors on a surface of the first substrate comprises a first plurality of electrical connectors on a surface of the first substrate, wherein the second electrode module comprises a second plurality of electrical connectors on a surface of the second substrate, wherein each electrical connector of the second plurality of electrical connectors is configured to be received by a respective port of the plurality of ports to connect the second electrode module to the hub.

11. The system of claim 9 , wherein the first plurality of electrodes form a first two-dimensional array on the surface of the first substrate.

12. The system of claim 11 , wherein the second plurality of electrodes form a second two-dimensional array on the surface of the second substrate, wherein the first two-dimensional array and the second two-dimensional array form mirror images of one another.

13. The system of claim 11 , wherein the second plurality of electrodes form a second two-dimensional array on the surface of the second substrate, wherein the first two-dimensional array is different than the second two-dimensional array.

14. The system of claim 9 , wherein the hub comprises a connector assembly configured to receive a lead, wherein the lead includes conductors to transmit the electrical signals from the implantable medical device to the hub.

15. The system of claim 9 , wherein the first substrate comprises a first flexible substrate and the second substrate comprises a second flexible substrate.

16. The system of claim 9 , wherein the first electrode module is detachably coupled to the hub.

Assignees

• Medtronic Inc

Inventors

• Olson Robert L

Classifications

• A61N1/0531 Primary

  Brain cortex electrodes · CPC title

• A61N1/0551

  Spinal or peripheral nerve electrodes · CPC title

• H01R24/60

  Contacts spaced along planar side wall transverse to longitudinal axis of engagement · CPC title

• H01R31/005

  Intermediate parts for distributing signals · CPC title

• H01R12/79

  connecting to rigid printed circuits or like structures · CPC title