Apparatus and method for solid state source array design and fabrication

Patent metadata

Field	Value
Publication number	US-10154586-B2
Application number	US-201414538733-A
Country	US
Kind code	B2
Filing date	Nov 11, 2014
Priority date	Nov 11, 2014
Publication date	Dec 11, 2018
Grant date	Dec 11, 2018

Abstract

Apparatus for providing pulsed or continuous energy in a process chamber are provided herein. The apparatus may include a base having a plurality of vias formed in a bottom surface of the base, and wherein an electrical connector is disposed in each via, a first metallic layer disposed on a top surface of the base and electrically coupled to the electrical connectors disposed in the plurality of via, and a plurality of solid state light sources disposed on a top surface of the metallic layer and electrically coupled to the metallic layer.

First claim

The invention claimed is:

1. An apparatus for providing pulsed or continuous energy, the apparatus comprising:
a base having a plurality of vias formed in a bottom surface of the base, and wherein an electrical connector is disposed in each via;
a first metallic layer disposed on a top surface of the base and electrically coupled to the electrical connector disposed in the plurality of vias; and
a plurality of solid state light sources disposed on a top surface of the first metallic layer and electrically coupled to the first metallic layer,
wherein each via includes an electrically conductive material is deposited in each via, and wherein the electrical connector disposed in each via is a spring-loaded compressible electrical connector.

2. The apparatus of claim 1 , wherein the electrical connector is spring-loaded on only one end.

3. The apparatus of claim 1 , wherein the electrical connector contacts the electrically conductive material deposited in each via and forms an electrical path from the bottom surface of the base to the top surface of the base.

4. The apparatus of claim 3 , wherein a first channel is formed in the bottom surface of the base, and wherein the plurality of vias are formed in a bottom surface of the first channel.

5. The apparatus of claim 4 , wherein the base includes a second channel formed in the bottom surface of the base, wherein the second channel is perpendicular to the first channel.

6. The apparatus of claim 1 , wherein each of the plurality of solid state light sources are light emitting diodes (LEDs).

7. The apparatus of claim 1 , wherein each via includes a first portion that extends from the bottom surface of the base partially into the base and a second portion that extends from the first portion to the top surface of the base, and wherein the electrically conductive material completely fills the second portion.

8. An apparatus for providing pulsed or continuous energy, the apparatus comprising:
a base having a plurality of vias formed in a bottom surface of the base, and wherein an electrical connector is disposed in each via;
a first metallic layer disposed on a top surface of the base and electrically coupled to the electrical connector disposed in the plurality of vias; and
a plurality of solid state light sources disposed on a top surface of the first metallic layer and electrically coupled to the first metallic layer,
wherein the base includes a plurality of fastener holes formed in the bottom surface of the base.

9. An energy source for providing light and heat energy to a process chamber, the energy source comprising:
a heat exchanger;
a metallic plate couple to a top surface of the heat exchanger;
a power distribution board disposed on a top surface of the metallic plate, the power distribution board including a plurality of openings formed through the power distribution board; and
a plurality of solid state light source arrays, wherein each solid state light source array is electrically coupled to a top surface of the power distribution board, and wherein a least a portion of each solid state light source array is disposed through at least one of the plurality of openings to contact the metallic plate.

10. The energy source of claim 9 , wherein each solid state light source array includes:
a base having a first channel and a second channel formed in a bottom surface of the base, wherein the base includes a plurality of vias formed in a bottom surface of the first channel, and wherein an electrical connector is disposed in each via;
a first metallic layer disposed on a top surface of the base and electrically coupled to the electrical connector disposed in the plurality of vias; and
a plurality of solid state light sources disposed on a top surface of the first metallic layer and electrically coupled to the first metallic layer.

11. The energy source of claim 10 , wherein the second channel is perpendicular to the first channel.

12. The energy source of claim 11 , wherein each solid state light source array is disposed within four openings such that the top surface of the power distribution board is disposed in the first and second channels.

13. The energy source of claim 10 , wherein each via includes a first portion that extends partially into the base and a second portion that extends from the first portion to the top surface of base, wherein surfaces of the first portion of each via include a layer of electrical material deposited in each via, and wherein the second portion of each via is filled with the electrical material.

14. The energy source of claim 10 , wherein the electrical connector disposed in each via is a spring-loaded compressible electrical connector.

15. The energy source of claim 14 , wherein the top surface of the power distribution board electrically contacts and compresses the spring-loaded compressible electrical connector disposed in each via.

16. The energy source of claim 10 , wherein the power distribution board supplies power to the plurality of solid state light source arrays.

17. The energy source of claim 10 , wherein each of the plurality of solid state light sources are light emitting diodes (LEDs).

Assignees

• Applied Materials Inc

Inventors

• Thirunavukarasu Sriskantharajah
• Johnson Joseph

Classifications

• H05K1/112 Primary

  directly combined with via connections · CPC title

• H05K2201/09845

  Stepped hole, via, edge, bump or conductor · CPC title

• H05K2201/10303

  Pin-in-hole mounted pins · CPC title

• H05K2201/10106

  Light emitting diode [LED] · CPC title