Switch device

Patent metadata

Field	Value
Publication number	US-10153766-B2
Application number	US-201715433447-A
Country	US
Kind code	B2
Filing date	Feb 15, 2017
Priority date	Feb 15, 2017
Publication date	Dec 11, 2018
Grant date	Dec 11, 2018

Abstract

A device is provided that includes a switch within a package. A first electrical connection is provided between a load terminal of the switch and first pin of the package, and a second electrical connection at least partially different from the first electrical connection is provided between the switch and a second pin of the package. The second pin is different from the first pin.

First claim

What is claimed is:

1. A device, comprising:
a package; and
a switch arranged in the package, the switch comprising a control terminal, a first load terminal and a second load terminal, wherein the second load terminal of the switch is connected with a first pin of said package via a first electrical connection, wherein said second load terminal is coupled to a second pin of said package different from said first pin via a second electrical connection, wherein the second electrical connection is at least partially different from said first electrical connection; and
a magnetic field sensor device arranged adjacent to said first electrical connection.

2. The device of claim 1 , wherein the control terminal is electrically coupled to a third pin of said package, and the first load terminal is electrically coupled to a fourth pin of said package.

3. The device of claim 2 , wherein the third pin and the second pin are configured to be coupled to a driver circuit to drive a switching of said switch.

4. The device of claim 2 , further comprising a driver circuit driving a switching of said switch, wherein the driver circuit is coupled to said second pin and said third pin.

5. The device of claim 1 , wherein the first load terminal is coupled to a fourth pin, wherein the magnetic field sensor device comprises a first signal output coupled to a fifth pin and a second signal output coupled to a sixth pin, wherein the fifth and sixth pins are arranged on opposite sides of said fourth pin.

6. The device of claim 1 , wherein the magnetic field sensor device comprises a first supply terminal and a second supply terminal, wherein the first supply terminal is coupled to a seventh pin and the second supply terminal is coupled to said second pin.

7. The device of claim 1 , wherein the switch comprises a metal oxide semiconductor field effect transistor, wherein the second load terminal is a source terminal.

8. A device, comprising:
a package; and
a switch arranged in the package, the switch comprising a control terminal, a first load terminal and a second load terminal,
wherein the second load terminal of the switch is connected with a first pin of said package via a first electrical connection, wherein said second load terminal is coupled to a second pin of said package different from said first pin via a second electrical connection, wherein the second electrical connection is at least partially different from said first electrical connection, and
wherein said first electrical connection comprises a metal clip starting at a second load terminal contact area of a semiconductor chip die comprising the switch.

9. The device of claim 8 , wherein the second electrical connection comprises a bond wire starting at said second load terminal contact area.

10. The device of claim 8 , wherein the second electrical connection comprises a bond wire starting at said metal clip.

11. A device, comprising:
a package;
a power switch chip die arranged within said package, the power switch chip die comprising a control terminal contact area, a first load terminal contact area and a second load terminal contact area, wherein the control terminal contact area is coupled to a first pin of the package, wherein the first load terminal contact area is coupled to a second pin of said package different from said first pin;
a metal clip coupling the second load terminal contact area to a third pin of the package,
a current sensor device provided on said metal clip; and
an electrical connection coupling the second load terminal contact area to a fourth pin different from said third pin.

12. The device of claim 11 , wherein the current sensor device comprises a magnetic field sensor device, wherein a supply terminal of the magnetic field sensor device is coupled to said fourth pin.

13. The device of claim 11 , wherein said electrical connection has one end at said second load terminal contact area.

14. The device of claim 11 , wherein said electrical connection has one end at said metal clip.

15. The device of claim 11 , wherein the current sensor device comprises first and second signal terminals coupled to fifth and sixth pins of said package, the fifth and sixth pins being arranged on opposite sides of the second pin.

16. The device of claim 11 , wherein said metal clip comprises a U-shaped portion, wherein said current sensor device is provided on said U-shaped portion.

17. A method for manufacturing a switch device, the method comprising:
arranging a power switch chip die in a package, the power switch chip die comprising a control terminal, a first load terminal and a second load terminal, the power switch chip die comprising a control terminal contact area, a first load terminal contact area and a second load terminal contact area;
coupling the control terminal contact area to a first pin of the package;
coupling the first load terminal contact area to a second pin of the package different from the first pin of the package;
coupling a metal clip between the second load terminal contact area and a third pin of the package; and
coupling the second load terminal contact area to a fourth pin different from the third pin.

18. The method of claim 17 , wherein coupling the second load terminal contact area to the fourth pin comprises coupling the second load terminal contact area to a first location on the metal clip between the second load terminal contact area and the third pin of the package.

19. The method of claim 18 , wherein the first location is based on a required turn-on behavior of the switch device and an inductivity associated with the required turn-on behavior.

20. The method of claim 17 , further attaching a current sensor device on the metal clip.

Assignees

• Infineon Technologies Austria Ag

Inventors

• Mauder Anton
• Gruber Martin
• Keser Goran

Classifications

• H10W90/764

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W72/871

  Bond wires and strap connectors · CPC title

• H10W72/691

  Bond pads specially adapted therefor · CPC title

• H10W72/631

  Shapes of strap connectors · CPC title