Resonator device, manufacturing resonator device manufacturing method, oscillator, electronic apparatus, vehicle, and base station

Patent metadata

Field	Value
Publication number	US-10153730-B2
Application number	US-201615285889-A
Country	US
Kind code	B2
Filing date	Oct 5, 2016
Priority date	Oct 19, 2015
Publication date	Dec 11, 2018
Grant date	Dec 11, 2018

Abstract

A resonator device includes a resonator element, a package that accommodates the resonator element, a temperature control element arranged on a first surface of the package, and a circuit part arranged on a second surface of the package that faces away from the first surface.

First claim

What is claimed is:

1. A resonator device comprising:
a resonator element;
a package that accommodates the resonator element;
a temperature control element arranged on a first surface of the package; and
a circuit part arranged on a second surface of the package that faces away from the first surface,
wherein the package includes a base and a lid having thermal conductivity higher than thermal conductivity of the base, and
the temperature control element is arranged on the lid.

2. An oscillator comprising the resonator device according to claim 1 .

3. An electronic apparatus comprising the resonator device according to claim 1 .

4. A vehicle comprising the resonator device according to claim 1 .

5. A base station comprising the resonator device according to claim 1 .

6. A resonator device manufacturing method, the method comprising:
arranging a package that accommodates a resonator element and a temperature control element on a substrate comprising a first flexible section having flexibility in such a way that the first flexible section is located between the package and the temperature control element; and
arranging the temperature control element on a first surface of the package by flexing the first flexible section.

7. The method according to claim 6 , further comprising arranging a circuit part of a circuit that drives the resonator element on a second surface of the package that faces away from the first surface.

8. The method according to claim 7 , wherein the arranging of the circuit part on the second surface is performed before the package is arranged on the substrate.

9. The method according to claim 7 ,
wherein the substrate further includes a second flexible section having flexibility,
the method further comprising:
arranging the electronic part on the substrate in such a way that the second flexible section is located between the package or the temperature control element and the electronic part;
arranging the temperature control element on the first surface of the package by flexing the first flexible section; and
arranging the electronic part on a third surface that connects the first surface and the second surface of the package to each other by flexing the second flexible section.

10. A resonator device comprising:
a resonator element;
a package that accommodates the resonator element;
a temperature control element arranged on a first surface of the package;
a circuit part arranged on a second surface of the package that faces away from the first surface; and
a substrate on which the package and the temperature control element are arranged,
wherein the substrate includes a first flexible section that has flexibility and is located between an area where the package is arranged and an area where the temperature control element is arranged.

11. The resonator device according to claim 10 ,
wherein the substrate has an opening in a position that overlaps with the second surface, and
the circuit part is arranged in the opening.

12. The resonator device according to claim 10 ,
wherein the substrate includes a rigid section harder than the first flexible section, and
the temperature control element is arranged in the rigid section.

13. The resonator device according to claim 10 ,
wherein the first flexible section includes a wiring line electrically connected to the package.

14. The resonator device according to claim 10 , further comprising an electronic part arranged on a third surface that connects the first surface and the second surface of the package to each other,
wherein the electronic part is arranged on the substrate, and
the substrate includes a second flexible section that has flexibility and is located between the area where the package is arranged or the area where the temperature control element is arranged and an area where the electronic part is arranged.

15. The resonator device according to claim 10 , further comprising a support substrate that supports the substrate,
wherein the temperature control element is arranged between the support substrate and the package.

16. An oscillator comprising the resonator device according to claim 10 .

17. An electronic apparatus comprising the resonator device according to claim 10 .

18. A vehicle comprising the resonator device according to claim 10 .

19. A base station comprising the resonator device according to claim 10 .

Assignees

• Seiko Epson Corp

Inventors

• Kondo Manabu

Classifications

• H03B28/00 Primary

  Generation of oscillations by methods not covered by groups H03B5/00 - H03B27/00, including modification of the waveform to produce sinusoidal oscillations (analogue function generators for performing computing operations G06G7/26; use of transformers for conversion of waveform in AC-AC converters H02M5/18) · CPC title

• H03H9/1021

  the BAW device being of the cantilever type · CPC title

• H03H1/00

  Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network (constructional details of electromechanical transducers H03H9/00) · CPC title

• H03H9/02

  Details · CPC title

• H03H9/0547 Primary

  consisting of a vertical arrangement (H03H9/0566 takes precedence) · CPC title