Low-profile power and data contacts

US10153577B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10153577-B2
Application numberUS-201815948050-A
CountryUS
Kind codeB2
Filing dateApr 9, 2018
Priority dateSep 8, 2015
Publication dateDec 11, 2018
Grant dateDec 11, 2018

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

Contact structures that are readily manufactured, where contacts in the contact structures consume a minimal amount of surface area, depth, and volume in an electronic device.

First claim

Opening claim text (preview).

What is claimed is: 1. An electronic device comprising: a device enclosure substantially housing the electronic device and having a plurality of openings; a plurality of electrical contacts, each located in a corresponding one of the plurality of openings in the device enclosure such that a gap exists between an outside edge of each contact and an inside edge of the corresponding opening in device enclosure, and each having a contacting surface for mating with a contact on a corresponding device when the electronic device and corresponding device are mated; and a plurality of insulating rings, each filling the gap between the outside edge of an electrical contact and the inside edge of the corresponding opening in the device enclosure. 2. The electronic device of claim 1 wherein each of the plurality of electrical contacts are soldered to a flexible circuit board. 3. The electronic device of claim 2 further comprising a bracket behind the electrical contacts such that the plurality of electrical contacts are between the bracket and the device enclosure. 4. The electronic device of claim 1 wherein the contacting surface of each of the plurality of electrical contacts is at least substantially flush with an outside surface of the device enclosure. 5. The electronic device of claim 1 wherein the contacting surface of each of the plurality of electrical contacts is curved and is at least substantially flush with an outside surface of the device enclosure. 6. The electronic device of claim 1 wherein each of the plurality of insulating rings are formed as part of a separate insulating housing. 7. The electronic device of claim 1 wherein all of the plurality of insulating rings are formed as part of a single insulating housing. 8. An electronic device comprising: a device enclosure substantially housing the electronic device and having a plurality of openings; a plurality of electrical contacts, each located in a corresponding one of the plurality of openings in the device enclosure, each having a contacting surface for mating with a contact on a corresponding device when the electronic device and corresponding device are mated; and a plurality of insulating rings, each ring between a contact and the device enclosure, where for each insulating ring, a contact is located inside and adjacent to an inside edge of the insulating ring and the device enclosure is adjacent to an outside edge of the insulating ring. 9. The electronic device of claim 8 further comprising a bracket behind the plurality of electrical contacts such that the plurality of electrical contacts are between the bracket and the device enclosure. 10. The electronic device of claim 9 wherein an insulating ring is formed as a portion of an insulating housing, and further comprising a silicone gasket between the insulating housing and the device enclosure. 11. The electronic device of claim 8 wherein the contacting surface of each of the plurality of electrical contacts is at least substantially flush with an outside surface of the device enclosure. 12. The electronic device of claim 8 wherein the contacting surface of each of the plurality of electrical contacts is curved and is at least substantially flush with an outside surface of the device enclosure. 13. An electronic device comprising: a device enclosure substantially housing the electronic device and having a plurality of openings; a plurality of electrical contacts, each electrical contact having a contacting surface on a first side and a contacting portion on a second side opposing the first side, each contacting surface for mating with a contact on a corresponding device when the electronic device and corresponding device are mated and each electrical contact located in a corresponding one of the plurality of openings in the device enclosure; and a plurality of insulating rings, each around an outside of a corresponding one the plurality of electrical contacts, wherein for each of the plurality of electrical contacts, the electrical contact, corresponding insulating ring, and device enclosure are contiguous. 14. The electronic device of claim 13 wherein the insulating rings are formed with an insulating housing, wherein the insulating housing is formed of plastic. 15. The electronic device of claim 14 further comprising a seal between the insulating housing and the device enclosure, wherein the seal is a gasket. 16. The electronic device of claim 15 further comprising a flexible circuit board attached to contacting portions of each of the plurality of electrical contacts, wherein the flexible circuit board is attached to the insulating housing using a heat-activated film. 17. The electronic device of claim 16 further comprising a bracket, wherein the bracket is behind the insulating housing such that the plurality of electrical contacts are between the bracket and the device enclosure. 18. The electronic device of claim 17 further comprising a shim between the insulating housing and the device enclosure. 19. The electronic device of claim 13 wherein the contacting surface of each of the plurality of electrical contacts is at least substantially flush with an outside surface of the device enclosure. 20. The electronic device of claim 13 wherein the contacting surface of each of the plurality of electrical contacts is curved and is at least substantially flush with an outside surface of the device enclosure.

Assignees

Inventors

Classifications

  • for flexible printed circuits, flat or ribbon cables or like structures · CPC title

  • characterised by the terminal · CPC title

  • with a panel or printed circuit board · CPC title

  • Sealing between contact members and housing, e.g. sealing insert · CPC title

  • Contacts for co-operating by abutting · CPC title

Patent family

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External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US10153577B2 cover?
Contact structures that are readily manufactured, where contacts in the contact structures consume a minimal amount of surface area, depth, and volume in an electronic device.
Who is the assignee on this patent?
Apple Inc
What technology area does this patent fall under?
Primary CPC classification H01R13/40. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Dec 11 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 12 related publications on this page (citations in our corpus or others sharing the same primary CPC).