Method of manufacturing display panel

Patent metadata

Field	Value
Publication number	US-10153329-B2
Application number	US-201715613482-A
Country	US
Kind code	B2
Filing date	Jun 5, 2017
Priority date	Feb 21, 2017
Publication date	Dec 11, 2018
Grant date	Dec 11, 2018

Abstract

The present disclosure discloses a method of manufacturing a display panel. The method includes: providing a first substrate, and forming a release layer on the first substrate; forming a thin film transistor driving layer on the first substrate; forming a display element on the first substrate, wherein a part of the display element forms above the release layer and another part of the display element forms above the thin film transistor driving layer; separating the release layer and the first substrate with a laser; removing the release layer and the display element above the release layer, and forming a hollow portion on the first substrate; packaging the display element to form a display panel, wherein the display panel at least includes a first packaging portion; and providing a through hole passing through the display panel at a region on the display panel corresponding to the hollow portion.

First claim

What is claimed is:

1. A method of manufacturing a display panel, comprising following steps:
providing a first substrate, and forming a release layer on the first substrate;
forming a thin film transistor driving layer on the first substrate, and the thin film transistor driving layer surrounding the release layer;
forming a display element on the first substrate, wherein a part of the display element forms above the release layer and another part of the display element forms above the thin film transistor driving layer;
separating the release layer and the first substrate with a laser;
removing the release layer and the display element above the release layer, and forming a hollow portion on the first substrate;
packaging the display element to form a display panel, wherein the display panel at least comprises a first packaging portion formed on the first substrate and at least surrounding the hollow portion; and
providing a through hole passing through the display panel at a region on the display panel corresponding to the hollow portion, and the first packaging portion surrounding the through hole.

2. The method of manufacturing a display panel according to claim 1 , wherein during the step of forming the release layer on the first substrate, a ployimide material or an organic photoresist is coated on the first substrate, and the release layer is formed after exposure and development.

3. The method of manufacturing a display panel according to claim 1 , wherein the step of packaging the display element further comprises following sub-steps:
coating a packaging adhesive on the first substrate, wherein the packaging adhesive is coated surround the hollow portion and the display element, respectively;
covering a second substrate above the first substrate; and
curing the packaging adhesive to form the first packaging portion and a second packaging portion, and bonding the first substrate and the second substrate, wherein the first packaging portion surrounds the hollow portion and the second packaging portion surrounds the display element.

4. The method of manufacturing a display panel according to claim 3 , wherein the packaging adhesive is a ultraviolet curing adhesive, which is cured after being irradiated by a ultraviolet ray to bond the first substrate and the second substrate.

5. The method of manufacturing a display panel according to claim 3 , wherein the packaging adhesive is a glass cement, which is cured after laser sintering to bond the first substrate and the second substrate.

6. The method of manufacturing a display panel according to claim 1 , wherein the step of packaging the display element further comprises following sub-steps:
alternatingly depositing an inorganic thin film layer and an organic thin film layer on the first substrate until the display element is covered, wherein the inorganic thin film layer and the organic thin film layer form the first packaging portion and a third packaging portion, the first packaging portion forms at the hollow portion, and the third packaging portion surrounds and covers the display element.

7. The method of manufacturing a display panel according to claim 6 , wherein the organic thin film layer is made of acrylate-based resin material, and the inorganic thin film layer is made of silicon nitride material, aluminium oxide material or titanium dioxide material.

8. The method of manufacturing a display panel according to claim 1 , wherein the step of separating the release layer and the first substrate with the laser is performed in a nitrogen environment.

9. The method of manufacturing a display panel according to claim 1 , wherein the step of removing the release layer and the display element above the release layer is performed in a nitrogen environment.

10. The method of manufacturing a display panel according to claim 1 , wherein the through hole provided on the display panel has a diameter of 1 cm to 3 cm.

Assignees

• Everdisplay Optronics Shanghai Ltd
• Everdisplayoptronics Shanghai Ltd

Inventors

• Kao Chih-Hao
• Chen Jr-Hong

Classifications

• G03F7/2024

  of the already developed image · CPC title

• G03F7/343

  Lamination or delamination methods or apparatus for photolitographic photosensitive material · CPC title

• H01L29/4908

  Electricity · mapped topic

• H01L29/7869

  Electricity · mapped topic

• H01L51/5253

  Electricity · mapped topic