MEMS force sensors fabricated using paper substrates
US-9682856-B2 · Jun 20, 2017 · US
US10151649B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10151649-B2 |
| Application number | US-201415036937-A |
| Country | US |
| Kind code | B2 |
| Filing date | Nov 17, 2014 |
| Priority date | Nov 18, 2013 |
| Publication date | Dec 11, 2018 |
| Grant date | Dec 11, 2018 |
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
What the patent document calls the invention.
A short plain-language summary of the technical disclosure.
Who owns or filed the patent and who is credited as inventor.
Filing, priority, publication, and grant dates set the timeline.
The legal scope of protection — read this for what is actually claimed.
Technology tags used to group this patent with similar filings.
Prior art links and similar publications in this corpus.
Official abstract text for this publication.
A printed stretchable strain sensor comprises a seamless elastomeric body and a strain-sensitive conductive structure embedded in the seamless elastomeric body. The strain-sensitive conductive structure comprises one or more conductive filaments arranged in a continuous pattern. A method of printing a stretchable strain sensor comprises depositing one or more conductive filaments in a predetermined continuous pattern into or onto a support matrix. After the depositing, the support matrix is cured to embed a strain-sensitive conductive structure in a seamless elastomeric body.
Opening claim text (preview).
The invention claimed is: 1. A method of printing a stretchable strain sensor, the method comprising: depositing one or more conductive filaments in a predetermined continuous pattern into or onto a support matrix; and after the depositing, curing the support matrix to embed a strain-sensitive conductive structure in a seamless monolithic elastomeric body, wherein a plateau value of shear elastic modulus G′ f of the conductive filament is from about 10 times to about 1000 times a plateau value of shear elastic modulus G′ s of the support matrix. 2. The method of claim 1 , wherein the support matrix is viscoelastic. 3. The method of claim 1 , wherein the support matrix comprises a fluid filler layer thereon, and wherein curing the support matrix further comprises curing the fluid filler layer. 4. The method of claim 3 , wherein the fluid filler layer comprises a strain-rate independent viscosity of no more than about 100 Pa·s. 5. The method of claim 1 , wherein a plurality of the strain-sensitive conductive structures are embedded in the seamless monolithic elastomeric body. 6. A method of printing a stretchable strain sensor, the method comprising: depositing one or more sacrificial filaments comprising a fugitive ink in a predetermined continuous pattern into or onto a support matrix; after the depositing, curing the support matrix to form a seamless monolithic elastomeric body, removing the fugitive ink to create a continuous channel in the seamless monolithic elastomeric body; and flowing a conductive fluid into the continuous channel, thereby embedding a strain-sensitive conductive structure in the seamless monolithic elastomeric body. 7. The method of claim 6 , wherein the fugitive ink is removed after curing the support matrix, upon cooling of the seamless monolithic elastomeric body. 8. The method of claim 6 , wherein the conductive fluid is selected from the group consisting of: eutectic gallium-indium alloys, mercury, dispersions of metal particles, ionic fluids, intrinsically conductive polymers and hydrogels, and polymer and hydrogel composites. 9. The method of claim 6 , wherein the one or more sacrificial filaments are deposited at a printing speed of from about 0.1 mm/s to about 100 mm/s. 10. The method of claim 6 , wherein the curing comprises applying UV light, heat, or a chemical curing agent. 11. The method of claim 6 , wherein the support matrix comprises a fluid filler layer thereon, and wherein curing the support matrix further comprises curing the fluid filler layer. 12. The method of claim 6 , wherein a plateau value of shear elastic modulus G′ f of the sacrificial filament is from about 10 times to about 1000 times a plateau value of shear elastic modulus G′ s of the support matrix. 13. The method of claim 6 , wherein a plurality of the strain-sensitive conductive structures are embedded in the seamless monolithic elastomeric body. 14. A method of printing a stretchable strain sensor, the method comprising: depositing one or more conductive filaments in a predetermined continuous pattern into or onto a support matrix comprising a fluid filler layer thereon, the fluid filler layer comprising a strain-rate independent viscosity of no more than about 100 Pa·s; and after the depositing, curing the support matrix and the fluid filler layer to embed a strain-sensitive conductive structure in a seamless monolithic elastomeric body.
Hand-worn input/output arrangements, e.g. data gloves · CPC title
constructional details of the strain gauges (adjustable resistors H01C10/00) · CPC title
by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids (of piezo-resistive materials G01L1/18); by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress · CPC title
using properties of piezo-resistive materials, i.e. materials of which the ohmic resistance varies according to changes in magnitude or direction of force applied to the material · CPC title
Related publications grouped by family.
Answers are generated from the same data shown on this page.