Adhesive compositions, manufacture and use thereof

US10150897B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10150897-B2
Application numberUS-201414781349-A
CountryUS
Kind codeB2
Filing dateApr 7, 2014
Priority dateApr 19, 2013
Publication dateDec 11, 2018
Grant dateDec 11, 2018

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

The invention relates to an adhesive composition having an added component of rubber-epoxy such as XNBR-epoxy adducts. It was found that the new adhesive composition significantly reduces meander formation in the making of automotive parts.

First claim

Opening claim text (preview).

The invention claimed is: 1. An adhesive composition comprising a) an epoxy resin that includes a liquid diglycidyl ether of bisphenol A; b) a blocked polyurethane toughener; c) a curing agent that includes dicyandiamide; and d) a rubber-epoxy adduct component with a Mw value above 60,000 Da, the adhesive composition having a viscosity value—from 307 to 1350 Pas at 25° C. 2. An adhesive composition consisting essentially of a) at least one liquid diglycidyl ether of bisphenol A and optionally at least one solid diglycidyl ether of bisphenol A; b) a blocked polyurethane toughener; c) a curing agent that includes dicyandiamide; d) a rubber-epoxy adduct component with a Mw value above 60,000 Da; e) and optionally one or more of a filler, a wetting agent, a colorant and an adhesion promoter, the adhesive composition having a viscosity value—from 307 to 1350 Pa·s at 25° C. 3. The adhesive composition according to claim 2 , wherein the rubber-epoxy component comprises carboxylated acrylonitrile butadiene rubber-epoxy adducts. 4. The adhesive composition according to claim 2 wherein the epoxy resin further includes a solid diglycidyl ether of bisphenol A. 5. The adhesive composition according to claim 2 wherein the rubber-epoxy adduct component has about 1 to 15 wt % of rubber elastomer. 6. The adhesive composition according to claim 2 wherein the rubber-epoxy adduct component has about 3 to 10 wt % of rubber elastomer. 7. The adhesive composition according to claim 2 , wherein the rubber-epoxy adduct component has a molecular weight of Mw above 80,000 and Mn above 10,000. 8. The adhesive composition according to claim 2 wherein the rubber elastomer is a combination of at least two different carboxylated nitrile butadiene rubbers. 9. The adhesive composition according to claim 2 wherein the composition comprises at least about 4 wt % of the rubber-epoxy adduct component. 10. The adhesive composition according to claim 2 wherein the composition comprises at least about 8 wt % of the rubber-epoxy adduct component. 11. The adhesive composition according to claim 2 wherein the composition comprises at least about 12 wt % of the rubber-epoxy adduct component. 12. The adhesive composition according to claim 2 wherein the rubber-epoxy adduct component has a viscosity above 50,000 mPa·s at 25° C. 13. The adhesive composition according to claim 2 wherein the rubber-epoxy adduct component has a viscosity above 300,000 mPa·s at 25° C.

Assignees

Inventors

Classifications

  • C09J163/00Primary

    Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins · CPC title

  • Latex · CPC title

  • Adhesives based on rubbers containing carboxyl groups · CPC title

  • Copolymers with acrylonitrile · CPC title

  • Adhesives based on homopolymers or copolymers of conjugated diene hydrocarbons · CPC title

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Frequently asked questions

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What does patent US10150897B2 cover?
The invention relates to an adhesive composition having an added component of rubber-epoxy such as XNBR-epoxy adducts. It was found that the new adhesive composition significantly reduces meander formation in the making of automotive parts.
Who is the assignee on this patent?
Dow Global Technologies Llc
What technology area does this patent fall under?
Primary CPC classification C09J163/00. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Dec 11 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).