Thermoplastic resin composition and molded article
US-12098241-B2 · Sep 24, 2024 · US
Curable composition
US10150895B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10150895-B2 |
| Application number | US-201515113693-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jan 20, 2015 |
| Priority date | Jan 23, 2014 |
| Publication date | Dec 11, 2018 |
| Grant date | Dec 11, 2018 |
How to read this patent
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
- Title
What the patent document calls the invention.
- Abstract
A short plain-language summary of the technical disclosure.
- Assignees and inventors
Who owns or filed the patent and who is credited as inventor.
- Key dates
Filing, priority, publication, and grant dates set the timeline.
- First independent claim
The legal scope of protection — read this for what is actually claimed.
- CPC / IPC classifications
Technology tags used to group this patent with similar filings.
- Citations and related patents
Prior art links and similar publications in this corpus.
Abstract
Official abstract text for this publication.
A curable composition includes an organic polymer containing a reactive silicon group (A), and a bound substance of kaolinite and quartz (B) at a proportion of 30-200 parts by weight relative to 100 parts by weight of the organic polymer containing a reactive silicon group (A).
First claim
Opening claim text (preview).
The invention claimed is: 1. A curable composition comprising: an organic polymer containing a reactive silicon group (A), and a bound substance of kaolinite and quartz (B) at a proportion of 30-200 parts by weight relative to 100 parts by weight of the organic polymer containing a reactive silicon group (A); wherein the bound substance of kaolinite and quartz (B) is calcined. 2. The curable composition according to claim 1 , wherein the organic polymer containing a reactive silicon group (A) comprises a reactive silicon group-containing polyoxyalkylene-based polymer (A1) and/or a reactive silicon group-containing (meth)acrylate-based polymer (A2). 3. The curable composition according to claim 1 , wherein the organic polymer containing a reactive silicon group (A) comprises a polyoxyalkylene-based polymer (a1) and/or a (meth)acrylate-based polymer (a2) as a main chain skeleton. 4. The curable composition according to claim 1 , wherein the bound substance of kaolinite and quartz (B) has a kaolinite content of not more than 15 wt %. 5. The curable composition according to claim 1 , wherein the bound substance of kaolinite and quartz (B) has a D 50 particle size of 1-3 μm. 6. The curable composition according to claim 1 , wherein the bound substance of kaolinite and quartz (B) is surface-treated. 7. The curable composition according to claim 1 , further comprising an epoxy group-containing silane coupling agent (C) and an amidine compound (D). 8. The curable composition according to claim 1 , further comprising an organotin-based compound. 9. An adhesive comprising the curable composition according to claim 1 . 10. A cured product obtained by curing the curable composition according to claim 1 . 11. An adhered structure of wood and a cured product obtained by curing the curable composition according to claim 1 . 12. The curable composition according to claim 1 , wherein the organic polymer containing a reactive silicon group (A) comprises a reactive silicon group-containing polyoxyalkylene-based polymer (A1) and a reactive silicon group-containing (meth)acrylate-based polymer (A2). 13. The curable composition according to claim 12 , wherein the reactive silicon group-containing polyoxyalkylene-based polymer (A1) contains a polyoxyalkylene-based polymer (a1) as a main chain skeleton; the reactive silicon group-containing (meth)acrylate-based polymer (A2) contains a (meth)acrylate-based polymer (a2) as a main chain skeleton; and a weight ratio of the polyoxyalkylene-based polymer (a1) and the (meth)acrylate-based polymer (a2) ((a1)/(a2)) is 20/80-90/10. 14. The curable composition according to claim 13 , wherein the weight ratio of the polyoxyalkylene-based polymer (a1) and the (meth)acrylate-based polymer (a2) ((a1)/(a2)) is 30/70-80/20. 15. The curable composition according to claim 13 , wherein the weight ratio of the polyoxyalkylene-based polymer (a1) and the (meth)acrylate-based polymer (a2) ((a1)/(a2)) is 40/60-70/30.
Assignees
Inventors
Classifications
with silicon-containing compounds · CPC title
containing hydrolysable silane groups · CPC title
containing hydrolysable silane groups · CPC title
Clay · CPC title
- C08K3/34Primary
Silicon-containing compounds · CPC title
Patent family
Related publications grouped by family.
External sources
Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US10150895B2 cover?
- A curable composition includes an organic polymer containing a reactive silicon group (A), and a bound substance of kaolinite and quartz (B) at a proportion of 30-200 parts by weight relative to 100 parts by weight of the organic polymer containing a reactive silicon group (A).
- Who is the assignee on this patent?
- Kaneka Corp
- What technology area does this patent fall under?
- Primary CPC classification C08K3/34. Mapped technology areas include Chemistry & Metallurgy.
- When was this patent published?
- Publication date Tue Dec 11 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).