Connection element, connection arrangement, method for producing a connection element and method for producing a connection arrangement

US10150277B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10150277-B2
Application numberUS-201615371890-A
CountryUS
Kind codeB2
Filing dateDec 7, 2016
Priority dateDec 8, 2015
Publication dateDec 11, 2018
Grant dateDec 11, 2018

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A connection element includes a composite component with a cured epoxy resin, a first layer including a first thermoplastic polymer and an intermediate layer arranged between the composite component and the first layer, the first layer containing both the cured epoxy resin of the composite component and the first thermoplastic polymer of the first layer. The first thermoplastic polymer has a melting point above a curing temperature of the epoxy resin and is soluble at a temperature of at least 150° C. in the epoxy resin used for producing the composite component.

First claim

Opening claim text (preview).

The invention claimed is: 1. A connection element comprising: a composite component comprising a cured epoxy resin; a first layer comprising a first thermoplastic polymer; an intermediate layer arranged between the composite component and the first layer and containing both the epoxy resin of the composite component and the first thermoplastic polymer of the first layer; wherein the first thermoplastic polymer has a melting point, in particular a glass transition temperature, above a curing temperature of the epoxy resin; wherein the first thermoplastic polymer is soluble at a temperature of at least 150° C. in the epoxy resin used for producing the composite component; wherein the curing temperature of the epoxy resin is up to 180° C.; wherein the glass transition temperature of the first thermoplastic polymer is higher than 185° C., in particular higher than 200° C.; and wherein the epoxy resin extends into the intermediate layer, from the composite component towards the first layer, in a form of a number of volume portions which are mutually adjacent or interconnected at least in part, wherein the volume portions are configured as bubbles and have, in a region of the intermediate layer that is adjacent to the composite component, a diameter or a volume that is greater than in a region of the intermediate layer that is adjacent to the first layer. 2. The connection element of claim 1 , wherein the first layer is provided externally on the composite component. 3. The connection element of claim 1 , wherein the first layer consists of the first thermoplastic polymer. 4. The connection element of claim 1 , wherein the first thermoplastic polymer is selected from at least one of a group consisting of polyetherimide, polysulphone, polyphenylsulphone, polyhydroxyether, and polycarbonate. 5. The connection element of claim 1 , wherein the first layer has a thickness in a range of greater than 50 micrometers (μm) to less than or equal to 300 μm. 6. The connection element of claim 5 , wherein the thickness of the first layer is in a range of from 100 μm to 150 μm. 7. The connection element of claim 1 , wherein the composite component comprises a fiber-reinforced plastics material. 8. The connection element of claim 7 , wherein the fiber-reinforced plastics material is configured as a carbon-fiber-reinforced plastics material. 9. The connection element of claim 1 , wherein the composite component comprises a sandwich structure comprising a fiber-reinforced plastics material cover layer. 10. The connection element of claim 9 , wherein the fiber-reinforced plastics material cover layer is a carbon-fiber-reinforced plastics material cover layer. 11. The connection element of claim 1 , comprising a second layer having a second thermoplastic polymer arranged on the first layer. 12. The connection element of claim 11 , wherein the second thermoplastic polymer is selected from at least one of a group consisting of polyetheretherketone, polyethersulphone, polyamide, and polyphenylsulphone. 13. The connection element of claim 1 , wherein the intermediate layer has a thickness in a range of from 20 micrometers (μm)to 100 μm or from 30 μm to 80 μm. 14. The connection element of claim 13 , wherein the thickness of the intermediate layer has a is in a range of from 30 μm to 80 μm. 15. The connection element of claim 1 , wherein the intermediate layer comprises a continuous concentration transition from the epoxy resin to the first thermoplastic polymer. 16. The connection element of claim 1 ., wherein the diameter of the volume portions in the region of the intermediate layer that is adjacent to the composite component is greater than 1 micrometer (μm) and is less than 1 μm in the region of the intermediate layer that is adjacent to the first layer. 17. The connection element of claim 16 , wherein the diameter of the volume portions in the region of the intermediate layer that is adjacent to the composite component is in a range of from 1 μm to 20 μm. 18. The connection element of claim 16 , wherein the diameter of the volume portions in the region of the intermediate layer that is adjacent to the first layer is less than 0.1 μm. 19. A connection arrangement comprising: a connection element comprising: a composite component comprising a cured epoxy resin; a first layer comprising a first thermoplastic polymer; and an intermediate layer arranged between the composite component and the first layer and containing both the epoxy resin of the composite component and the first thermoplastic polymer of the first layer; wherein the first thermoplastic polymer has a melting point, in particular a glass transition temperature, above a curing temperature of the epoxy resin; wherein the first thermoplastic polymer is soluble at a temperature of at least 150° C. in the epoxy resin used for producing the composite component; wherein the curing temperature of the epoxy resin is up to 180° C.; wherein the glass transition temperature of the first thermoplastic polymer is higher than 18° C., in particular higher than 200° C.; and wherein the epoxy resin extends into the intermediate layer, from the composite component towards the first layer, in a form of a number of volume portions which are mutually adjacent or interconnected at least in part, wherein the volume portions are configured as bubbles and have, in a region of the intermediate layer that is adjacent to the composite component, a diameter or a volume that is greater than in a region of the intermediate layer that is adjacent to the first layer; and a component connected to the connection element, wherein the component is welded to the first layer of the connection element. 20. The connection arrangement of claim 19 , wherein the component is welded to the first layer of the connection element by friction welding. 21. The connection arrangement of claim 20 , wherein the component is welded to the first layer of the connection element by circular vibration friction welding. 22. A connection arrangement comprising: a connection element comprising: a composite component comprising a cured epoxy resin: a first layer comprising a first thermoplastic polymer: an intermediate layer arranged between the composite component and the first layer and containing both the epoxy resin of the composite component and the first thermoplastic polymer of the first layer and a second layer comprising a second thermoplastic polymer arranged on the first layer; wherein the first thermoplastic polymer has a melting point, in particular a glass transition temperature, above a curing temperature of the epoxy resin, wherein the first thermoplastic polymer is soluble at a temperature of at least 150° C. in the epoxy resin used for producing the composite component; wherein the curing temperature of the epoxy resin is up to 180° C.; wherein the glass transition temperature of the first thermoplastic polymer is higher than 185° C., in particular higher than 200° C.; and wherein the epoxy resin extends into the intermediate layer, from the composite component towards the first layer, in a form of a number of volume portions which are mutually adjacent or interconnected at least in part, wherein the volume portions are configured as bubbles and have, in a region of the intermediate layer that is adjacent to the composite component, a diameter or a volume that is greater than in a region of the intermediate layer that is adjacent to the first layer; and

Assignees

Inventors

Classifications

  • using friction · CPC title

  • using ultrasonic vibrations {(non-plastics element to plastics elements B29C65/645)} · CPC title

  • of synthetic resin · CPC title

  • comprising polysulphones; polysulfides · CPC title

  • comprising synthetic resins not wholly covered by any one of the sub-groups {B32B27/30 - B32B27/42} · CPC title

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What does patent US10150277B2 cover?
A connection element includes a composite component with a cured epoxy resin, a first layer including a first thermoplastic polymer and an intermediate layer arranged between the composite component and the first layer, the first layer containing both the cured epoxy resin of the composite component and the first thermoplastic polymer of the first layer. The first thermoplastic polymer has a me…
Who is the assignee on this patent?
Airbus Defence & Space Gmbh
What technology area does this patent fall under?
Primary CPC classification B32B27/38. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Dec 11 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).