Active composite panel assemblies, systems, and methods

Patent metadata

Field	Value
Publication number	US-10149387-B2
Application number	US-201615131087-A
Country	US
Kind code	B2
Filing date	Apr 18, 2016
Priority date	Apr 18, 2016
Publication date	Dec 4, 2018
Grant date	Dec 4, 2018

Abstract

An active composite panel assembly is configured to transfer electrical signals from a source to an electrical device. The active composite panel assembly includes a composite layer, and an active layer secured to the composite layer. The active layer is configured to receive and conduct the electrical signals.

First claim

What is claimed is:

1. An active composite panel assembly that is configured to transfer electrical signals from a source to an electrical device, the active composite panel assembly comprising:
a composite layer including a core sandwiched between a first skin and a second skin, wherein the core includes a plurality of interconnected honeycomb cells, wherein one or both of the first skin and the second skin comprises at least one pre-impregnated epoxy resin layer; and
an active layer secured to and covering an entire surface of the composite layer, wherein the active layer is entirely conductive and configured to receive and conduct the electrical signals.

2. The active composite panel assembly of claim 1 , wherein the active layer comprises one or more of a conductive nano-grid, conductive nano-wires, or conductive nano-particles.

3. The active composite panel assembly of claim 1 , further comprising a conductive substrate secured to the active layer opposite from the composite layer.

4. The active composite panel assembly of claim 1 , further comprising a cover positioned over the active layer, wherein the cover is formed of one or more of laminate, plastic, or glass.

5. The active composite panel assembly of claim 4 , wherein a channel is formed through the cover, wherein the channel is sized and shaped to receive at least a portion of the electrical device.

6. The active composite panel assembly of claim 1 , further comprising the electrical device, wherein the electrical device is electrically coupled to the active layer.

7. The active composite panel assembly of claim 6 , wherein the electrical device is embedded within the active composite panel assembly or mounted onto a portion of the active composite panel assembly.

8. The active composite panel assembly of claim 1 , wherein the active layer includes a matrix layer that is mapped to detect resistances on a surface of the active composite panel assembly, wherein the resistances are controlled with a logic map to control transmission of the electrical signals to the electrical device.

9. The active composite panel assembly of claim 1 , further comprising a signal transfer medium that extends through portions of each of the first skin, the core, and the second skin of the composite layer and couples the active layer to one or both of an electrical connector or an electrical source.

10. A method of forming an active composite panel assembly that is configured to transfer electrical signals from a source to an electrical device, the method comprising:
providing a composite layer including a core sandwiched between a first skin and a second skin, wherein the core includes a plurality of interconnected honeycomb cells, wherein one or both of the first skin and the second skin comprises at least one pre-impregnated epoxy resin layer; and
securing an active layer to and covering an entire surface of the composite layer, wherein the active layer is entirely conductive, and wherein the active layer is configured to receive and conduct the electrical signals.

11. The method of claim 10 , wherein the active layer comprises one or more of a conductive nano-grid, conductive nano-wires, conductive nano-particles, conductive fibers, thin film transistors, switches, conductive films, conductive filaments, or conductive strands.

12. The method of claim 10 , further comprising securing a conductive substrate to the active layer opposite from the composite layer.

13. The method of claim 10 , further comprising positioning a cover over the active layer, wherein the cover is formed of one or more of laminate, plastic, or glass.

14. The method of claim 13 , further comprising forming a channel through the cover, wherein the channel is sized and shaped to receive at least a portion of the electrical device.

15. The method of claim 14 , further comprising:
positioning the electrical device on or in the active composite panel assembly; and
electrically coupling the electrical device to the active layer.

16. The method of claim 15 , wherein the positioning operation comprises embedding the electrical device within the active composite panel assembly.

17. The method of claim 15 , wherein the positioning operation comprises mounting the electrical device onto a portion of the active composite panel assembly.

18. The method of claim 10 , further comprising:
positioning a signal transfer medium through portions of each of the first skin, the core, and the second skin of the composite layer;
coupling the active layer to the signal transfer medium; and
coupling the signal transfer medium to one or both of an electrical connector or an electrical source.

19. An active composite panel assembly, comprising:
a composite layer including a core sandwiched between a first skin and a second skin, wherein the core includes a plurality of interconnected honeycomb cells, wherein one or both of the first skin and the second skin comprises at least one pre-impregnated epoxy resin layer;
an active layer secured to and covering an entire surface of the composite layer, wherein the active layer is entirely conductive and configured to receive and conduct electrical signals, wherein the active layer comprises one or more of a conductive nano-grid, conductive nano-wires, conductive nano-particles, conductive fibers, thin film transistors, switches, conductive films, conductive filaments, or conductive strands;
a conductive substrate secured to the active layer opposite from the composite layer;
a cover positioned over the conductive substrate opposite from the active layer, wherein the cover is formed of one or more of laminate, plastic, or glass;
a signal transfer medium that extends through portions of each of the first skin, the core, and the second skin of the composite layer and couples the active layer to one or both of an electrical connector or an electrical source; and
an electrical device configured to receive electrical signals from the active layer through the conductive substrate.

20. The active composite panel assembly of claim 19 , wherein the electrical device is positioned between the conductive substrate and the cover.

Assignees

• Boeing Co

Inventors

• Macaraeg Sesinando P
• Cuddy Nathanial C

Classifications

• H05K5/0247 Primary

  Electrical details of casings, e.g. terminals, passages for cables or wiring · CPC title

• H02G3/00

  Installations of electric cables or lines or protective tubing therefor in or on buildings, equivalent structures or vehicles (installations of bus-bars H02G5/00; overhead installations H02G7/00; installations in or on the ground H02G9/00) · CPC title

• B64D2011/0046

  Modular or preassembled units for creating cabin interior structures · CPC title

• B64C1/066 Primary

  Interior liners · CPC title

• B29C70/86

  Incorporated in coherent impregnated reinforcing layers, {e.g. by winding} · CPC title