Affixing structure for electronic component

Patent metadata

Field	Value
Publication number	US-10149385-B2
Application number	US-201415031383-A
Country	US
Kind code	B2
Filing date	Dec 10, 2014
Priority date	Dec 13, 2013
Publication date	Dec 4, 2018
Grant date	Dec 4, 2018

Abstract

An affixing structure that reduces costs and reduces the risk of vibration causing damage or the like to electrical connection terminals on an electronic component affixed to a circuit board is provided. In the affixing structure, which is affixed to a circuit board (21) via a plurality of lead frames (55) that are part of a transformer (50), at least one second side wall perpendicular to a first side wall where the lead frames (55) are arranged is adhesively supported on the circuit board (21) by a support (60). The height (H3) of the part of the support (60) in contact with the transformer (50) is greater than or equal to the height (H2) of the center of gravity of the electronic component, and the length (L) of the support (60) in the direction of the first side wall is greater than or equal to the height (H3).

First claim

The invention claimed is:

1. An affixing structure affixed to a circuit board via a plurality of electrical connection terminals included in an electronic component, wherein
at least one second side wall of the electronic component that is perpendicular to a first side wall where the electrical connection terminals are arranged is adhesively supported on the circuit board by a support, with use of an adhesive having elasticity;
a height (H 3 ) of a part of the support in contact with the second side wall of the electronic component is greater than or equal to a height (H 2 ) from the circuit board to a position of the center of gravity of the electronic component;
a length (L) of the support in a direction following the first side wall is greater than or equal to the height (H 3 ), and
the electric component is a transformer.

2. The affixing structure according to claim 1 , wherein
each of the electrical connection terminals is constituted by a lead frame.

3. The affixing structure according to claim 1 , wherein
the support is constituted only by an adhesive.

4. The affixing structure according to claim 2 , wherein
the support is constituted only by an adhesive.

5. The affixing structure according to claim 1 , wherein
the support is constituted by an adhesive and a stiffener affixed to the circuit board by the adhesive.

6. The affixing structure according to claim 2 , wherein
the support is constituted by an adhesive and a stiffener affixed to the circuit board by the adhesive.

7. The affixing structure according to claim 5 , wherein
the stiffener is a triangular pillar-shaped member whose cross section is a right-angle triangle.

8. The affixing structure according to claim 1 , wherein
the electrical connection terminals are not arranged on the second side wall.

9. The affixing structure according to claim 1 , wherein
two of the second side walls are provided and supported by the respective supports.

10. The affixing structure according to claim 1 , wherein
the circuit board is incorporated into a vehicle electric compressor.

11. An affixing structure affixed to a circuit board via a plurality of electrical connection terminals included in an electronic component, wherein
at least one second side wall of the electronic component that is perpendicular to a first side wall where the electrical connection terminals are arranged is adhesively supported on the circuit board by a support, with use of an adhesive having elasticity,
a height (H 3 ) of a part of the support in contact with the second side wall of the electronic component is greater than or equal to a height (H 2 ) from the circuit board to a position of the center of gravity of the electronic component, and
a length (L) of the support in a direction following the first side wall is greater than or equal to the height (H 3 ).

Assignees

• Mitsubishi Heavy Ind Automotive Thermal Systems Ltd
• Mitsubishi Heavy Ind Thermal Systems Ltd

Inventors

• Yakushiji Shunsuke
• Tamaki Hitoshi
• Takashige Takayuki

Classifications

• F04C23/008

  Hermetic pumps · CPC title

• H05K3/305

  Affixing by adhesive · CPC title

• H05K3/3421

  Leaded components · CPC title

• F04C2240/803

  Electric connectors or cables; Fittings therefor · CPC title

• H05K2201/2009

  Reinforced areas, e.g. for a specific part of a flexible printed circuit · CPC title