Optoelectronic component and method for producing an optoelectronic component
US-2017069876-A1 · Mar 9, 2017 · US
US10147904B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10147904-B2 |
| Application number | US-201414916560-A |
| Country | US |
| Kind code | B2 |
| Filing date | Sep 2, 2014 |
| Priority date | Sep 4, 2013 |
| Publication date | Dec 4, 2018 |
| Grant date | Dec 4, 2018 |
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The invention relates to an organic optoelectronic component comprising a substrate ( 101 ) on which a first electrode ( 102 ), then an organic functional layer stack ( 103 ) having at least one organic optoelectronic layer, and then a second electrode ( 104 ) are successively arranged. A thin film encapsulation ( 107 ) is arranged over the second electrode ( 104 ) and in addition to the second electrode ( 104 ), at least one first intermediate layer ( 121 ) having a hardness which is different from the layer which is directly adjacent thereto is arranged between the organic functional layer stack ( 103 ) and the thin-film encapsulation ( 107 ).
Opening claim text (preview).
The invention claimed is: 1. An organic optoelectronic component, comprising: a substrate, on which a first electrode, thereabove an organic functional layer stack having at least one organic optoelectronic layer, and thereabove a second electrode are arranged; above the second electrode a thin-film encapsulation; and between the organic functional layer stack and the thin-film encapsulation in addition to the second electrode at least one first intermediate layer having a different hardness than a directly adjacent layer, wherein the thin-film encapsulation comprises one or more thin layers applied by at least one of chemical vapor deposition, atomic layer deposition or molecular layer deposition, and wherein the thin-film encapsulation is configured to form a barrier with respect to at least one of moisture, oxygen or corrosive gas, wherein the at least one first intermediate layer is arranged between the second electrode and the thin-film encapsulation, wherein the at least one first intermediate layer directly adjoins the second electrode and has a greater hardness than the second electrode, and wherein the at least one first intermediate layer has a lower hardness than a layer of the thin-film encapsulation that directly adjoins the at least one first intermediate layer. 2. The organic optoelectronic component according to claim 1 , wherein the at least one first intermediate layer is constructed to protect the organic functional layer stack against damage as a result of dirt particles, in particular dirt particles situated between the second electrode and the thin-film encapsulation. 3. The organic optoelectronic component according to claim 1 , wherein the second electrode comprises Al, Ag, Mg or a combination thereof and the first intermediate layer comprises Cr, Wo, V, Os, Ru, Ir or a combination thereof. 4. The organic optoelectronic component according to claim 1 , wherein a second intermediate layer directly adjoining the first intermediate layer is arranged between the first intermediate layer and the thin-film encapsulation, and the first intermediate layer has a greater hardness than the second intermediate layer. 5. The organic optoelectronic component according to claim 1 , wherein the at least one first intermediate layer completely covers the second electrode. 6. An organic optoelectronic component comprising: a substrate, on which a first electrode, thereabove an organic functional layer stack having at least one organic optoelectronic layer, and thereabove a second electrode are arranged; above the second electrode a thin-film encapsulation; and between the organic functional layer stack and the thin-film encapsulation in addition to the second electrode at least one first intermediate layer having a different hardness than a directly adjacent layer, wherein the at least one first intermediate layer is arranged between the second electrode and the thin-film encapsulation, wherein the at least one first intermediate layer directly adjoins the second electrode and has a greater hardness than the second electrode, and wherein the first intermediate layer has a lower hardness than a layer of the thin-film encapsulation that directly adjoins the first intermediate layer. 7. An organic optoelectronic component comprising: a substrate, on which a first electrode, thereabove an organic functional layer stack having at least one organic optoelectronic layer, and thereabove a second electrode are arranged; above the second electrode a thin-film encapsulation; and between the organic functional layer stack and the thin-film encapsulation in addition to the second electrode at least one first intermediate layer having a different hardness than a directly adjacent layer, wherein the at least one first intermediate layer is arranged between the second electrode and the thin-film encapsulation, wherein the at least one first intermediate layer directly adjoins the second electrode and has a greater hardness than the second electrode, wherein the first intermediate layer has a lower hardness than a layer of the thin-film encapsulation that directly adjoins the first intermediate layer, and wherein the second electrode comprises Al, Ag, Mg or a combination thereof and the first intermediate layer comprises Ni, Ti, V or a combination thereof.
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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