The invention claimed is:
1. A synaptic transistor based on a metal nano-sheet, comprising:
a gate electrode layer;
a buffer layer disposed on the gate electrode layer;
an insulating layer disposed on the buffer layer;
a self-assembled floating gate layer disposed on the insulating layer;
a channel layer disposed on the self-assembled floating gate layer;
a source electrode layer disposed on one side of the channel layer; and
a drain electrode layer disposed on the other side of the channel layer, the drain electrode layer being spaced apart from the source electrode layer,
wherein the self-assembled floating gate layer comprises a metal oxide layer disposed on an external surface thereof and formed by naturally oxidization, and a metal layer disposed inside thereof.
2. The synaptic transistor of claim 1 , wherein the self-assembled floating gate layer comprises at least one naturally oxidizing material selected from the group consisting of silver (Ag), copper (Cu), and aluminum (Al).
3. The synaptic transistor of claim 1 , wherein a metal layer disposed inside of the self-assembled floating gate layer comprises a floating electrode configured to store an electric charge transmitted from a channel layer.
4. The synaptic transistor of claim 1 , wherein a metal oxide layer disposed outer portion of the self-assembled floating gate layer is used as both of a tunneling layer and a blocking insulating layer.
5. A method of manufacturing a synaptic transistor based on a metal nano-sheet, comprising:
preparing a gate electrode layer;
forming a buffer layer on the gate electrode layer;
forming an insulating layer on the buffer layer;
forming a self-assembled floating gate layer on the insulating layer;
forming a channel layer on the self-assembled floating gate layer;
forming a source electrode layer on one side of the channel layer; and
forming a drain electrode layer on the other side of the channel layer, the drain electrode layer being spaced apart from the source electrode layer,
wherein the self-assembled floating gate layer comprises a metal oxide layer disposed on an external surface thereof and formed by naturally oxidization, and a metal layer disposed inside thereof.
6. The method of claim 5 , wherein in the forming the self-assembled floating gate layer, the self-assembled floating gate layer comprises at least one naturally oxidizing material selected from the group consisting of silver (Ag), copper (Cu), and aluminum (Al).
7. The method of claim 5 , wherein in the forming the self-assembled floating gate layer, the self-assembled floating gate layer is formed to have an aluminum (Al) layer at a thickness of 3 nm to 10 nm through a physical vapor deposition.
8. The method of claim 5 , wherein in the forming the drain electrode layer on the other side of the channel layer, which is spaced apart from the source electrode layer, the source electrode layer and the drain electrode layer are formed from a metal thin film.