Fe—Ni/Ti metalized skutterudite thermoelectric material and method of manufacturing the same

Patent metadata

Field	Value
Publication number	US-10147864-B2
Application number	US-201715695006-A
Country	US
Kind code	B2
Filing date	Sep 5, 2017
Priority date	Apr 11, 2017
Publication date	Dec 4, 2018
Grant date	Dec 4, 2018

Abstract

This invention relates to a metalized skutterudite thermoelectric material having improved long-term stability and a method of manufacturing the same, wherein the skutterudite thermoelectric material is metalized with a multilayer structure including a Ti layer for preventing the diffusion of the skutterudite thermoelectric material and a Fe—Ni layer for preventing an increase in the thickness of an intermetallic compound layer, whereby the performance of the skutterudite thermoelectric material does not deteriorate due to diffusion and formation of the intermetallic compound even upon long-term use, thus exhibiting improved stability of use, and moreover, the lifetime and stability of a thermoelectric power generation module using the skutterudite thermoelectric material can be increased, whereby the power generation efficiency of the thermoelectric power generation module can be increased in the long term.

First claim

What is claimed is:

1. A Fe—Ni/Ti metalized skutterudite thermoelectric material, comprising a metalization layer formed on a surface thereof, wherein the metalization layer is configured such that a Fe—Ni layer and a Ti layer are sequentially stacked,
wherein the skutterudite thermoelectric material comprises FeSb 3 as a p-type thermoelectric material or CoSb 3 as an n-type thermoelectric material, and
wherein the Fe—Ni layer comprises Fe and Ni at a weight ratio ranging from 75:25 to 55:45.

2. The Fe—Ni/Ti metalized skutterudite thermoelectric material of claim 1 , wherein the Fe—Ni layer has a thickness of 40 μm or more.

3. The Fe—Ni/Ti metalized skutterudite thermoelectric material of claim 2 , wherein the Fe—Ni layer has a thickness of 150 μm or less.

4. The Fe—Ni/Ti metalized skutterudite thermoelectric material of claim 1 , wherein the Ti layer has a thickness of 40 μm or more.

5. The Fe—Ni/Ti metalized skutterudite thermoelectric material of claim 4 , wherein the Ti layer has a thickness of 150 μm or less.

6. A method of manufacturing a Fe—Ni/Ti metalized skutterudite thermoelectric material, comprising forming, on a surface of a skutterudite thermoelectric material, a metalization layer configured such that a Fe—Ni layer and a Ti layer are sequentially stacked,
wherein the skutterudite thermoelectric material comprises FeSb 3 as a p-type thermoelectric material or CoSb 3 as an n-type thermoelectric material, and
wherein the Fe—Ni layer comprises Fe and Ni at a weight ratio ranging from 75:25 to 55:45.

7. The method of claim 6 , wherein the forming the metalization layer is performed by sequentially forming the Fe—Ni layer and the Ti layer on the surface of the skutterudite thermoelectric material.

8. The method of claim 6 , wherein the forming the metalization layer is performed in a manner in which a Fe—Ni metal foil and a Ti metal foil are sequentially superimposed on the surface of the skutterudite thermoelectric material and hot pressed.

9. The method of claim 6 , wherein the forming the metalization layer is performed in a manner in which a Fe—Ni foil and a Ti foil are sequentially superimposed on a skutterudite powder and pressure sintered, whereby the skutterudite powder is sintered, and simultaneously, the metalization layer, configured such that the Fe—Ni layer and the Ti layer are sequentially stacked, is formed on the surface of the skutterudite thermoelectric material.

Assignees

• Korea Inst Energy Res
• Korea Advanced Inst Sci & Tech

Inventors

• Park Sang Hyun
• Yoo Chung-Yul
• Jin Young Hwan
• Yoon Hana
• Cho Byung Jin

Classifications

• B32B19/041

  of metal · CPC title

• B32B2309/105

  Thickness · CPC title

• B32B2457/00

  Electrical equipment · CPC title

• B32B2307/30

  having particular thermal properties · CPC title

• B32B15/16

  next to a particulate layer · CPC title