Conductive structures, wordlines and transistors

Patent metadata

Field	Value
Publication number	US-10147727-B2
Application number	US-201815895587-A
Country	US
Kind code	B2
Filing date	Feb 13, 2018
Priority date	Nov 11, 2016
Publication date	Dec 4, 2018
Grant date	Dec 4, 2018

Abstract

Some embodiments include a conductive structure which has a first conductive material having a work function of at least 4.5 eV, and a second conductive material over and directly against the first conductive material. The second conductive material has a work function of less than 4.5 eV, and is shaped as an upwardly-opening container. The conductive structure includes a third conductive material within the upwardly-opening container shape of the second conductive material and directly against the second conductive material. The third conductive material is a different composition relative to the second conductive material. Some embodiments include wordlines, and some embodiments include transistors.

First claim

We claim:

1. A conductive structure, comprising:
a first conductive material comprising one or more of TiN, TaN and WN; where the formulas indicate primary constituents rather than specific stoichiometries;
a second conductive material over and directly against the first conductive material; the second conductive material being shaped as an upwardly-opening container; the second conductive material comprising one or more of WSiCN, TiSiN, WSiN, TiSiCN and TiAlN; where the formulas indicate primary constituents rather than specific stoichiometries; and
a third conductive material within the upwardly-opening container shape of the second conductive material and being directly against the second conductive material; the third conductive material being a different composition relative to the second conductive material.

2. The conductive structure of claim 1 wherein the third conductive material comprises one or more of Ir, Ru, Rh, Ti and W.

3. The conductive structure of claim 2 wherein the third conductive material further comprises one or more of Al, C, N and Si.

4. The conductive structure of claim 1 extending into a recess within a semiconductor material.

5. The conductive structure of claim 1 extending into a recess within a semiconductor material, and being spaced from the semiconductor material by dielectric material.

6. The conductive structure of claim 1 wherein the first conductive material is part of a conductive block which includes a fourth conductive material in combination with the first conductive material; the conductive block having an outer peripheral surface which includes an upper surface; the upper surface comprising regions of the first and fourth conductive materials, and the second conductive material being over and directly against the upper surface of the conductive block; all portions of the outer peripheral surface of the conductive block besides the upper surface only comprising the first conductive material.

7. The conductive structure of claim 6 wherein the third and fourth conductive materials are a same composition as one another.

8. A wordline, comprising:
a first conductive material comprising one or both of TaN and WN; where the formulas indicate primary constituents rather than specific stoichiometries;
a second conductive material over and directly against the first conductive material; the second conductive material comprising one or more of WSiCN, TiSiN, WSiN, TiSiCN and TiAlN, where the formulas indicate primary constituents rather than specific stoichiometries; the second conductive material being shaped as an upwardly-opening container; and
a third conductive material within the upwardly-opening container shape of the second conductive material and being directly against the second conductive material; the third conductive material being a different composition relative to the second conductive material.

9. The wordline of claim 8 wherein the third conductive material comprises one or more of Ir, Ru, Rh, Ti and W.

10. The wordline of claim 9 wherein the third conductive material further comprises one or more of Al, C, N and Si.

11. A transistor, comprising:
a gate recessed into a silicon-comprising semiconductor material, and spaced from the silicon-comprising semiconductor material by insulative material; the gate comprising:
a first conductive material comprising one or more of TiN, TaN and WN, where the formulas indicate primary constituents rather than specific stoichiometries;
a second conductive material over and directly against the first conductive material; the second conductive material comprising one or more of WSiCN, TiSiN, WSiN, TiSiCN and TiAlN, where the formulas indicate primary constituents rather than specific stoichiometries; and
a third conductive material directly against the second conductive material; the third conductive material being a different composition relative to the second conductive material, and comprising one or more of Ir, Ru, Rh, Ti and W.

12. The transistor of claim 11 wherein the second conductive material is shaped as an upwardly-opening container, and wherein the third conductive material is entirely within the upwardly-opening container shape of the second conductive material.

13. The transistor of claim 11 wherein the third conductive material further comprises one or more of Al, C, N and Si.

14. The transistor of claim 11 wherein the first conductive material is part of a conductive block which includes a fourth conductive material in combination with the first conductive material; the conductive block having an outer peripheral surface which includes an upper surface; the upper surface comprising regions of the first and fourth conductive materials, and the second conductive material being over and directly against the upper surface of the conductive block; all portions of the outer peripheral surface of the conductive block besides the upper surface only comprising the first conductive material.

15. The transistor of claim 14 wherein the third and fourth conductive materials are a same composition as one another.

16. The transistor of claim 14 wherein the third and fourth conductive materials are different compositions relative to one another.

Assignees

• Micron Technology Inc

Inventors

• Goswami Jaydeb
• Bian Zailong
• Hu Yushi
• Blomiley Eric R
• Guha Jaydip
• Gehrke Thomas

Classifications

• H10W20/4446

  Refractory-metal alloys · CPC title

• H10W20/435 Primary

  Cross-sectional shapes or dispositions of interconnections · CPC title

• H10W20/425

  Barrier, adhesion or liner layers · CPC title

• H01L23/53252

  Electricity · mapped topic

• H01L27/10823 Primary

  Electricity · mapped topic