Dual module for dual chip card

Patent metadata

Field	Value
Publication number	US-10147670-B2
Application number	US-201615562239-A
Country	US
Kind code	B2
Filing date	Apr 1, 2016
Priority date	Apr 2, 2015
Publication date	Dec 4, 2018
Grant date	Dec 4, 2018

Abstract

A dual module for a dual chip card includes a supporting film supporting on an outer surface, a plurality of connecting pads including two series of connecting pads extending in a given direction and, on an inner surface, two inner connection areas for connection to an antenna of the dual card and a chip, the chip including contact terminals connected by wires to the inner connection areas or electric connecting pads by holes passing through the supporting film while being coated, together with the wires, by coating resin. The electric connecting pads of the outer surface include only three pads. Each of the two inner connection areas forms a comb including a body extending under each of the pads of one of the two series of connecting pads separated from the coating mass, respectively. Blades extend separately from one another from the body until ends covered by the coating mass.

First claim

The invention claimed is:

1. A dual module for a dual chip card, comprising a supporting film ( 7 ) supporting on an outer surface a plurality of electrical contact pads (C 1 -C 8 ) including two series of electrical contact pads extending in a given direction for their entire length along two edges of this supporting film which are parallel to this direction and, on an inner surface, two internal connection zones ( 9 ) designed to be connected to an antenna of said dual chip card and a microcircuit ( 6 ), this microcircuit having connection terminals connected by wires respectively to the internal connection zones or to certain of the electrical contact pads by means of holes ( 41 - 45 ) passing through this supporting film while being coated, together with these wires, by a coating resin mass, wherein the series of electrical contact pads of the outer surface have only three pads (C 1 -C 3 , C 5 -C 7 ) and wherein each of the two internal connection zones is shaped as a comb ( 20 , 30 ) comprising a body extending under each of the pads of one of the two series of contact pads separated from the coating mass, and teeth, including two end teeth starting at the ends of the body and at least one intermediate tooth ( 20 A-D, 30 A-D), which extend independently of one another from said body, transversely to the given direction, as far as the ends covered by the coating mass, one of the ends of one tooth of each comb being connected by one of said wires to one of said connection terminals of the microcircuit.

2. The dual module as claimed in claim 1 , whose teeth of the combs extend from their body on either side of the holes, the outermost teeth of each comb, which are the ones furthest apart from each other, being longer than the other teeth of the same comb, so that their ends are next to a zone of the outer surface which is situated between said series of electrical contact pads.

3. The dual module as claimed in claim 2 , whose holes are connected, on the inner surface of the supporting film, to metallized tracks parallel and/or perpendicular to the direction of the series of pads, passing between the opposite ends of the outermost teeth of two distinct combs, in middle zones substantially located midway from the edges of the supporting film, which are bordered by the series of electrical contact pads.

4. The dual module as claimed in claim 3 , whose metallized tracks connected to the holes have a curved shape, on the outside of the resin mass coating the microcircuit and the connection wires.

5. The dual module as claimed in claim 4 , whose ends of the teeth of the two combs jointly delimit a polygonal central zone surrounding the microcircuit, on the outside of which are situated the holes.

6. The dual module as claimed in claim 3 , whose ends of the teeth of the two combs jointly delimit a polygonal central zone surrounding the microcircuit, on the outside of which are situated the holes.

7. The dual module as claimed in claim 3 , whose outermost teeth have ends with indentations toward the central zone.

8. The dual module as claimed in claim 2 , whose ends of the teeth of the two combs jointly delimit a polygonal central zone surrounding the microcircuit, on the outside of which are situated the holes.

9. The dual module as claimed in claim 2 , whose outermost teeth have ends with indentations toward the central zone.

10. The dual module as claimed in claim 2 , the ends of whose teeth are at the same distance from the ends of the closest teeth, to within 20%.

11. The module as claimed in claim 2 , comprising two combs provided with four teeth jointly delimiting an octagonal central zone.

12. The dual module as claimed in claim 1 , comprising, between the two series of three contact pads (C 1 -C 3 , C 5 -C 7 ), two transverse contact pads (C 4 , C 8 ) respectively situated between the first contact pads of the two series and between the third contact pads of the two series, at a distance from a central zone situated next to the microcircuit and the coating resin mass.

13. The dual module as claimed in claim 12 , whose outer surface furthermore has a central pad (C 5 A) electrically connected to one of the pads of one of the series of contact pads and separated from the two transverse contact pads by slots ( 11 , 12 ) along the periphery of the resin mass coating the microcircuit on the other surface.

14. The dual module as claimed in claim 13 , whose slots along the transverse contact pads have their concavity turned toward the central zone and whose periphery of said resin mass likewise has its concavity turned toward the microcircuit.

15. The dual module as claimed in claim 1 , whose holes are connected, on the inner surface, to metallized tracks having, on the outside of the resin mass, a curvature equal to that of elementary portions forming slots ( 13 , 14 ) along the series of contact pads and a central metallized pad.

16. The dual module as claimed in claim 1 , having at least 5 holes.

17. The dual module as claimed in claim 1 , whose dimensions are at most those of the format M3, that is, 11+/−0.2 mm*8.2+/−0.2 mm.

18. A supporting film intended for the fabrication of a module as claimed in claim 1 , supporting on an outer surface a plurality of electrical contact pads (C 1 -C 8 ) and, on an inner surface, internal connection zones ( 9 ) and a location ( 100 ) designed to receive a microcircuit comprising direction terminals needing to be connected to pads of the supporting film by wires, this supporting film being traversed by holes ( 41 - 45 ) situated at a distance from the location designed for the microcircuit, this inner surface being adapted to be covered, together with the microcircuit, by a mass of coating resin extending as far as a given line ( 110 ), wherein the contact pads of the outer surface comprise two series of only three pads (C 1 -C 3 , C 5 -C 7 ), extending in a given direction, and wherein the internal connection zones are shaped as two combs ( 20 , 30 ) whose two bodies extend respectively under each of the two series of contact pads, each body extending under each of the pads of the corresponding series at a distance from the zone which is to be covered by the coating mass, these combs having teeth ( 20 A-D, 30 A-D) which extend from their body, transversely to the given direction, as far as the ends emerging in the zone intended to be covered by the coating mass.

19. A dual chip card comprising a card body in which is situated an antenna ( 6 ) and a cavity comprising a deep portion surrounded by a course ( 4 B) of lesser depth, as well as a module as claimed in claim 1 , the antenna having ends ( 3 A, 3 B) situated on the course surrounding the deep portion of the cavity, on sides perpendicular to the direction (F) in which the card is intended to be inserted into a card reading terminal, the microcircuit and its mass of coating resin being situated in the deep portion of the cavity, and the module being secured to the card body by a mass of resin connecting the periphery of the module all along the course, the internal connection zones being next to the ends of the antenna, and the resin being anisotropically electrically conductive perpendicular to the plane of the supporting film.

20. The dual card as claimed in claim 19 , wherein the space between the mass of coating resin of the microcircuit and the mass of anisotropic attachment resin is next to slots ( 11 , 12 ) delimiting transverse contact pads of the module (C 4 , C 8 ), between the first pads and the third pads of said series of contact pa

Assignees

• Oberthur Technologies
• Idemia France

Inventors

• Gac Philippe
• Huet Mickael
• Fontaine Jean-Michel

Classifications

• H10W72/5522

  comprising gold [Au] · CPC title

• H10W72/5449

  not being orthogonal to a side surface of the chip, e.g. fan-out arrangements · CPC title

• H10W72/00 Primary

  Interconnections or connectors in packages · CPC title

• G06K19/0775

  arrangements for connecting the integrated circuit to the antenna · CPC title

• G06K19/07739

  comprising a first part capable of functioning as a record carrier on its own and a second part being only functional as a form factor changing part, e.g. SIM cards type ID 0001, removably attached to a regular smart card form factor · CPC title