Array substrate, manufacturing method thereof, and display device

Patent metadata

Field	Value
Publication number	US-10147643-B2
Application number	US-201615521079-A
Country	US
Kind code	B2
Filing date	Sep 7, 2016
Priority date	Jan 11, 2016
Publication date	Dec 4, 2018
Grant date	Dec 4, 2018

Abstract

An array substrate, a manufacturing method thereof, and a display device are provided. The array substrate includes: a base substrate, a signal line disposed on the base substrate, an extinction layer disposed between the base substrate and the signal line, the extinction layer being configured to reduce an ambient light when the array substrate is located on a light exiting side. An orthographic projection of the signal line in a plane of the base substrate is coincided with an orthographic projection of the extinction layer in the plane of the base substrate.

First claim

What is claimed is:

1. An array substrate, comprising:
a base substrate;
a signal line disposed on the base substrate; and
an extinction layer disposed between the base substrate and the signal line, the extinction layer including two opposite surfaces, a plurality of protrusion structures are disposed on the two opposite surfaces of the extinction layer, and the extension layer being configured to reduce an ambient light entering the signal line when the array substrate is located on a light exiting side,
wherein an orthographic projection of the signal line in a plane of the base substrate is coincided with an orthographic projection of the extinction layer in the plane of the base substrate.

2. The array substrate according to claim 1 , wherein a material of the extinction layer comprises amorphous silicon or semiconductor mixture doped with amorphous silicon.

3. The array substrate according to claim 1 , wherein the extinction layer has a thickness satisfying an interference extinction formula:
d =(2 n+ 1)λ/4 N   (1)

where d is a thickness of the extinction layer, λ is a wavelength of the visible light in the air, N is a refractive index of the extinction layer, n is a natural number.

4. The array substrate according to claim 3 , wherein the thickness of the extinction layer is 340 Å.

5. The array substrate according to claim 1 , wherein the signal line is a gate line, or a common electrode line.

6. A display device, comprising the array substrate according to claim 1 , wherein the array substrate is located on a light exiting surface of the display device.

7. The array substrate according to claim 2 , wherein the extinction layer has a thickness satisfying an interference extinction formula:
d =(2 n+ 1)λ/4 N   (1)

where d is a thickness of the extinction layer, λ is a wavelength of the visible light in the air, N is a refractive index of the extinction layer, n is a natural number.

8. The array substrate according to claim 7 , wherein the thickness of the extinction layer is 340 Å.

9. A method for manufacturing an array substrate, comprising:
providing a base substrate; and
forming a patterned extinction layer and a patterned signal line on the base substrate by a single patterning process, the patterned extinction layer including two opposite surfaces;
wherein the forming of the patterned extinction layer includes forming a plurality of protrusion structures on the two opposite surfaces of the extinction layer.

10. The method for manufacturing the array substrate according to claim 9 , further comprising:
sequentially depositing an extinction layer and a metal layer on a surface of the base substrate;
etching the metal layer by a mask, and forming a patterned signal line; and
etching the extinction layer by using a pattern of the signal line, and forming a patterned extinction layer which has the same pattern as the patterned signal line.

11. The method for manufacturing the array substrate according to claim 10 , further comprising:
placing the base substrate in a vacuum chamber, and performing a roughening treatment to a surface of the base substrate by a plasma gas, to allow a plurality of protrusion structures to be formed on a surface of a subsequently formed extinction layer near the base substrate.

12. The method for manufacturing the array substrate according to claim 10 , further comprising:
depositing an extinction layer on a surface of the base substrate;
placing the base substrate deposited with the extinction layer in a vacuum chamber, and performing a roughening treatment to the extinction layer by a plasma gas, to allow a plurality of protrusion structures to be formed on the extinction layer; and
depositing a metal layer on the roughening treated extinction layer.

13. The method for manufacturing the array substrate according to claim 11 , further comprising:
depositing an extinction layer on a surface of the base substrate;
placing the base substrate deposited with the extinction layer in a vacuum chamber, and performing a roughening treatment to the extinction layer by a plasma gas, to allow a plurality of protrusion structures to be formed on the extinction layer; and
depositing a metal layer on the roughening treated extinction layer.

Assignees

• Boe Technology Group Co Ltd
• Beijing Boe Display Tech Co
• Beijing Boe Display Techology Co Ltd

Inventors

• Wang Shoukun
• Guo Huibin
• Feng Yuchun
• Li Liangliang

Classifications

• H10P50/71

  using masks for conductive or resistive materials · CPC title

• H10D84/01 Primary

  Manufacture or treatment · CPC title

• H01L27/12

  Electricity · mapped topic

• H01L21/32139

  Electricity · mapped topic

• H01L21/77 Primary

  Electricity · mapped topic