Fluoro-silicone compositions as temporary bonding adhesives

Patent metadata

Field	Value
Publication number	US-10147631-B2
Application number	US-201615276357-A
Country	US
Kind code	B2
Filing date	Sep 26, 2016
Priority date	Sep 26, 2016
Publication date	Dec 4, 2018
Grant date	Dec 4, 2018

Abstract

Fluoro-containing silicone-based storage stable temporary bonding adhesive compositions are disclosed. The adhesive compositions can be used in varied applications including, but not limited to, 3D chip integration, packaging applications, semiconductor devices, radio-frequency identification tags, chip cards, high-density memory devices, and microelectronic devices. The adhesive compositions generally comprise: a) a fluoro-containing silicone having the general formula (I); M′[D o D f p D x q ] n M′ wherein M′ is a vinyl or hydrogen functionalized unit; D f unit comprises a fluoro-substituted group; D x unit comprises a vinyl or SiH functionalized group; 1>o≥0, 1>p>0, and 1>q≥0 wherein o+p+q=1 and p is equal to or less than 20% mole percent of the sum of o+p+q; and n is an integer from 1 to 1000; b) an alkenyl functional polydimethylsiloxane fluid; c) an alkenyl functional MQ siloxane resin; d) an SiH functional siloxane crosslinker; and e) a hydrosilylation catalyst.

First claim

What is claimed is:

1. An adhesive composition, wherein the adhesive composition comprises a fluoro-containing silicone, wherein the adhesive composition when coated onto a first substrate forms a film that can be bonded to a second substrate to form a laminate sequentially comprising the first substrate, the film, and the second substrate; and debonded from the second substrate to obtain a second substrate substantially free of the fluoro-containing silicone, wherein the fluoro-containing silicone has the general formula:
M′[D o D f p D x q ] n M′  (I)

wherein
M′ is an alkenyl or a hydrogen functionalized unit;
D f unit comprises a fluoro-substituted group;
D X unit comprises an alkenyl or a silicon hydride (SiH) functionalized group;
1>o≥0, 1>p>0, and 1 >q≥0 wherein o+p+q=1 and p is equal to or less than 20% mole percent of the sum of o+p+q; and
n is an integer from 1 to 1000.

2. The adhesive composition of claim 1 , wherein the adhesive composition is stable at room temperature for at least one month and can be thermally cured at a temperature of 100° C. to 180° C.

3. The adhesive composition of claim 1 , wherein the fluoro-containing silicone is an alkenyl functional, alternatively a vinyl functional, organosiloxane polymer comprising a fluoro-substituted C 3 -C 23 hydrocarbyl group.

4. The adhesive composition of claim 1 , wherein the fluoro-containing silicone is a SiH functional organosiloxane polymer comprising a fluoro-substituted C 3 -C 23 hydrocarbyl group.

5. The adhesive composition of claim 1 , wherein the fluoro-containing silicone is an alkenyl functional siloxane polymer having the general formula:

wherein each R is independently a C 1 -C 6 hydrocarbyl group, alternatively each R is independently methyl, ethyl, n-propyl, propan-2-yl, n-butyl, sec-butyl, iso-butyl, tert-butyl, or phenyl; R f is a fluoro-substituted C 3 -C 23 hydrocarbyl group; X is an alkenyl group; R 1 is either a hydrocarbyl group (R) or/and an alkenyl group (X) group; n is an integer from 1 to 1000; and 1>o≥0, 1>p>0, and 1>q≥0 wherein o +p +q =1 and p is equal to or less than 20% mole percent of the sum of o +p +q.

6. The adhesive composition of claim 5 , wherein R f is —(CH 2 ) 2 (CF 2 ) w CF 3 wherein w is 0 or an integer from 1 to 20, alternatively R f is —(CH 2 ) 2 CF 3 , —(CH 2 ) 2 (CF 2 ) 5 CF 3 , —(CH 2 ) 2 (CF 2 ) 7 CF 3 , or —(CH 2 ) 2 (CF 2 ) 9 CF 3 .

7. A semiconductor coated with the adhesive composition of 1, optionally wherein the adhesive composition is cured.

8. The adhesive composition of claim 1 , further comprising:
b) an alkenyl functional polydimethylsiloxane fluid;
c) an alkenyl functional MQ siloxane resin;
d) an SiH functional siloxane crosslinker; and
e) a hydrosilylation catalyst.

9. The adhesive composition of claim 8 , further comprising: f) a cure inhibitor; wherein the cure inhibitor is an organic compound that comprises at least one unsaturated bond and/or at least one heteroatom.

10. The adhesive composition of claim 9 , wherein the cure inhibitor is an amine, an alkenyl ester, or an alkynyl alcohol.

11. The adhesive composition of claim 9 , wherein the cure inhibitor is a maleate compound having the general formula cis-R 2 OOC—CH═CH—COOR 2 , wherein R 2 is a C 1 -C 6 hydrocarbyl group, alternatively the cure inhibitor is diallyl maleate.

12. The adhesive composition of claim 9 , wherein the molar ratio of the cure inhibitor to the hydrosilylation catalyst is about 40:1 to about 300:1, alternatively is about 200:1.

13. The adhesive composition of claim 8 , wherein the hydrosilylation catalyst is a platinum catalyst or a rhodium catalyst.

14. The adhesive composition of claim 8 , wherein the alkenyl functional polydimethylsiloxane fluid is vinyl terminated polydimethylsiloxane fluid.

15. The adhesive composition of claim 8 , wherein the alkenyl functional MQ siloxane resin is a vinyl functional MQ silicone resin.

16. A method for making a substrate system, the method comprising:
(1) applying an adhesive composition onto a surface of a first substrate, wherein the adhesive composition applied onto the surface of the first substrate forms an adhesive film; and
(2) contacting a second substrate with the adhesive film and curing the adhesive film to form the substrate system, wherein the cured adhesive film is in contact with the surface of the first substrate and with a surface of the second substrate;
wherein the adhesive composition is according to claim 8 and further comprises f) a cure inhibitor.

17. An adhesive composition comprising:
a) a fluoro-containing silicone having the general formula;
M′[D o D f p D x q ] n M′  (I)

wherein M′ is a vinyl or hydrogen functionalized unit; D f unit comprises a fluoro-substituted group; D X unit comprises a vinyl or SiH functionalized group; 1>o≥0, 1>p>0, and 1>q≥0wherein o +p +q =1 and p is equal to or less than 20% mole percent of the sum of o +p +q; and n is an integer from 1 to 1000;
b) an alkenyl functional polydimethylsiloxane fluid;
c) an alkenyl functional MQ siloxane resin;
d) an SiH functional siloxane crosslinker; and
e) a hydrosilylation catalyst.

18. The adhesive composition of claim 17 , wherein the fluoro-containing silicone is a silicon hydride (SiH) functional organosiloxane polymer having the general formula:

wherein each R is independently a C 1 -C 6 hydrocarbyl group, alternatively each R is independently methyl, ethyl, n-propyl, propan-2-yl, n-butyl, sec-butyl, iso-butyl, tert-butyl, or phenyl; R f is a fluoro-substituted C 3 -C 23 hydrocarbyl group, alternatively R f is —(CH 2 ) 2 (CF 2 ) w CF 3 wherein w is 0 or an integer from 1 to 20, alternatively R f is —(CH 2 ) 2 CF 3 , —(CH 2 ) 2 (CF 2 ) 5 CF 3 , —(CH 2 ) 2 (CF 2 ) 7 CF 3 , or —(CH 2 ) 2 (CF 2 ) 9 CF 3 ; n is an integer from 1 to 200; R 1 is either a hydrocarbyl group (R) or/and a hydride group; and 1>o≥0, 1>p>0, and 1>q≥0wherein o +p +q =1 and p is equal or less than 20% mole percent of the sum of o +p +q; provided that if R 1 is a hydrocarbyl group, then 1>q>0.

19. A method for making a wafer system, the method comprising:
(1) applying an adhesive composition onto a release layer of a release layer coated device wafer to form an adhesive coated device wafer, wherein the adhesive composition applied onto the release layer forms an adhesive film; and
(2) contacting a carrier wafer onto the adhesive film and curing the adhesive film to form the wafer system, wherein the adhesive film is in contact with the release layer and with a surface of the carrier wafer;
wherein the adhesive composition is according to claim 17 and further comprises f) a cure inhibitor.

20. A method for making a wafer system, the method comprising:
(1) applying an adhesive composition to a surface of a carrier wafer to form an adhesive coated carrier wafer, wherein the adhesive composition applied onto the surface of the carrier wafer forms an adhesive film; and
(2) contacting a release layer coated device wafer with the adhesive coated carrier wafer and curing the adhesive film to form the wafer system, wherein the cured adhesive film is in contact with the release layer and the surface of the carrier wafer;
wherein the adhesive composition is according to claim 17 and further comprises f) a cure inhibitor.

Assignees

• Dow Corning
• Dow Silicones Corp

Inventors

• Fu Peng-Fei
• Wang Sheng

Classifications

• H10P72/7442

  Separation by peeling · CPC title

• H10P72/7416

  used during dicing or grinding · CPC title

• H10P72/744

  Details of chemical or physical process used for separating the auxiliary support from a device or a wafer · CPC title

• H10P72/74

  using temporarily an auxiliary support · CPC title

• H10P52/00

  Grinding, lapping or polishing of wafers, substrates or parts of devices · CPC title