Heat dissipation device and portable electronic device

Patent metadata

Field	Value
Publication number	US-10145628-B2
Application number	US-201615094266-A
Country	US
Kind code	B2
Filing date	Apr 8, 2016
Priority date	Nov 27, 2015
Publication date	Dec 4, 2018
Grant date	Dec 4, 2018

Abstract

A heat dissipation device includes a first casing, a second casing, a thin pump, and a cooling member. The second casing is connected to the first casing to form a first accommodating space and a second accommodating space adjacent to and communicating with the first accommodating space. The thin pump is disposed in the first accommodating space. The cooling member is disposed in the second accommodating space and has a plurality of spacers, and the spacers and the thin pump are disposed on the same plane of the first casing. A portable electronic device having the heat dissipation device is also disclosed.

First claim

What is claimed is:

1. A heat dissipation device, comprising:
a first casing;
a second casing connected to the first casing to form a first accommodating space and a second accommodating space adjacent to and communicating with the first accommodating space;
a thin pump disposed in the first accommodating space; and
a cooling member disposed in the second accommodating space and having a plurality of spacers, wherein the first accommodating space, the second accommodating space, the thin pump and the cooling member are between the first casing and the second casing, the thin pump is connected to the first casing or the second casing, and a side of the thin pump directly faces the first casing,
wherein the first casing or the second casing has a fluid inlet, and the fluid inlet communicates with the first accommodating space, and
wherein the first casing or the second casing further has a fluid outlet, at least a channel is formed by the plurality of spacers in the second accommodating space, and the channel communicates with the fluid outlet and the fluid inlet respectively.

2. The heat dissipation device of claim 1 , wherein the thickness of the thin pump is between 1 mm and 6 mm.

3. The heat dissipation device of claim 1 , wherein the plurality of spacers are parallel arranged side by side on the first casing or the second casing.

4. The heat dissipation device of claim 3 , wherein the plurality of spacers and one of the first casing and the second casing are a single member.

5. The heat dissipation device of claim 1 , further comprising:
a cover disposed on a portion of the first casing corresponding to the thin pump.

6. The heat dissipation device of claim 5 , wherein the cover has a fluid inlet, and the fluid inlet communicates with the first accommodating space.

7. The heat dissipation device of claim 6 , wherein the first casing or the second casing further has a fluid outlet, at least a channel is formed by the plurality of spacers in the second accommodating space, and the channel communicates with the fluid outlet and the fluid inlet respectively.

8. A portable electronic device, comprising:
a body having a heat emitting source; and
a heat dissipation device contacting the heat emitting source, wherein the heat dissipation device comprises:
a first casing;
a second casing connected to the first casing to form a first accommodating space and a second accommodating space adjacent to and communicating with the first accommodating space;
a thin pump disposed in the first accommodating space; and
a cooling member disposed in the second accommodating space and having a plurality of spacers, wherein the first accommodating space, the second accommodating space, the thin pump and the cooling member are between the first casing and the second casing, the thin pump is connected to the first casing or the second casing, and a side of the thin pump directly faces the first casing
wherein the first casing or the second casing has a fluid inlet, and the fluid inlet communicates with the first accommodating space, and
wherein the first casing or the second casing further has a fluid outlet, at least a channel is formed by the plurality of spacers in the second accommodating space, and the channel communicates with the fluid outlet and the fluid inlet respectively.

9. The portable electronic device of claim 8 , wherein the thickness of the thin pump is between 1 mm and 6 mm.

10. The portable electronic device of claim 8 , wherein the plurality of spacers are parallel arranged side by side on the first casing or the second casing.

11. The portable electronic device of claim 10 , wherein the plurality of spacers and one of the first casing and the second casing are a single member.

12. The portable electronic device of claim 8 , wherein the heat dissipation device further comprises:
a cover disposed on a portion of the first casing corresponding to the thin pump.

13. The portable electronic device of claim 12 , wherein the cover has a fluid inlet, and the fluid inlet communicates with the first accommodating space.

14. The portable electronic device of claim 13 , wherein the first casing or the second casing further has a fluid outlet, at least a channel is formed by the plurality of spacers in the second accommodating space, and the channel communicates with the fluid outlet and the fluid inlet respectively.

Assignees

• Delta Electronics Inc

Inventors

• Lu Chao-Wen

Classifications

• F28D15/00

  Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls {; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies (F28D17/00, F28D19/00, F28D20/00 take precedence)} · CPC title

• F28F9/005

  Other auxiliary members within casings, e.g. internal filling means or sealing means · CPC title

• F28F9/001

  Casings in the form of plate-like arrangements; Frames enclosing a heat exchange core · CPC title

• G06F2200/201

  Cooling arrangements using cooling fluid · CPC title

• F28F2250/08

  Fluid driving means, e.g. pumps, fans · CPC title