Adhesive compound with reduced yellowness index

Patent metadata

Field	Value
Publication number	US-10144853-B2
Application number	US-201615548295-A
Country	US
Kind code	B2
Filing date	Feb 5, 2016
Priority date	Feb 6, 2015
Publication date	Dec 4, 2018
Grant date	Dec 4, 2018

Abstract

Adhesive compounds and methods contain at least one reactive resin, at least one elastomer, at least one polar photoinitiator and, optionally, a non-aqueous solvent. The adhesive compounds and method further containing a non-ionic surfactant for reducing the yellowness index of the cured adhesive compound, having a reduced yellowing tendency after the crosslinking step. The adhesive compound may be preferably a pressure-sensitive adhesive compound and the elastomer may be preferably a non-polar elastomer.

First claim

The invention claimed is:

1. An adhesive composition comprising
an adhesive base composed of
at least one reactive resin
at least one elastomer
at least one polar photoinitiator, and

optionally, a nonaqueous solvent,
wherein

the adhesive composition further comprises a nonionic surfactant for reducing the yellowness index of the cured adhesive composition.

2. The adhesive composition according to claim 1 , wherein the adhesive composition is pressure-sensitively adhesive.

3. The adhesive composition according to claim 1 , wherein the elastomer is apolar.

4. The adhesive composition according to claim 1 , wherein the reactive resin is a cyclic ether selected from epoxides and oxetanes.

5. The adhesive composition according to claim 1 , wherein the adhesive composition further comprises at least one at least partially hydrogenated tackifier resin.

6. The adhesive composition according to claim 1 , wherein the adhesive composition is subjected to thermal or radiation-induced curing.

7. The adhesive composition according to claim 1 , wherein the fraction of nonionic surfactant, based on the amount of reactive resin, is 1 to 50%.

8. The adhesive composition according to claim 1 , wherein the adhesive base has a water vapor permeation rate, after the activation of the reactive resin component, of less than 100 g/m 2 d.

9. The adhesive composition according to claim 1 , wherein the adhesive composition is soluble in nonaqueous solvents.

10. An adhesive tape comprising the adhesive composition according to claim 1 .

11. A method comprising:
encapsulating one or more assemblies in organic electronics with the adhesive composition according to claim 1 .

12. A method for producing the adhesive composition according to claim 1 , comprising:
a) dissolving the elastomer and optionally tackifier resin in a nonaqueous solvent;
b) adding a solution of the reactive resin, the nonionic surfactant, and the polar photoinitiator to form a mixture; and
c) stirring the mixture.

13. The adhesive composition according to claim 7 , wherein the fraction of nonionic surfactant, based on the amount of reactive resin, is 5 to 17%.

14. The adhesive composition according to claim 8 , wherein the adhesive base has a water vapor permeation rate, after the activation of the reactive resin component, of less than 15 g/m 2 d.

Assignees

• Tesa Se

Inventors

• KEITE-TELGENBüSCHER KLAUS
• Reichenbach Anita
• Schuh Christian

Classifications

• C09J153/00

  Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers · CPC title

• C08L101/00

  Compositions of unspecified macromolecular compounds · CPC title

• H01L51/5237

  Electricity · mapped topic

• H01L51/0035

  Electricity · mapped topic

• C08L71/02 Primary

  Polyalkylene oxides · CPC title