Semi-crystalline build materials

Patent metadata

Field	Value
Publication number	US-10144828-B2
Application number	US-201514723336-A
Country	US
Kind code	B2
Filing date	May 27, 2015
Priority date	Nov 21, 2012
Publication date	Dec 4, 2018
Grant date	Dec 4, 2018

Abstract

A polymeric material includes a semi-crystalline polymer and a secondary material wherein when the secondary material is combined with the semi-crystalline polymer to form a blend having at least a 3° C. reduction in a hot crystallization temperature relative to the neat semi-crystalline polymer.

First claim

The invention claimed is:

1. A polymeric material comprising:
a semi-crystalline polymer comprising polyhexamethyleneaidpamide; and
a secondary material comprising polyamides of trimethylhexamethylenediamine and terephthalic acid wherein when the secondary material or materials are combined with the semi-crystalline polymer to form a blend with at least at 3° C. reduction in a hot crystallization temperature relative to the neat semi-crystalline polymer.

2. The polymeric material of claim 1 and wherein the polyhexamethyleneaidpamide comprises between about 50 wt. % and about 75 wt. % and wherein the polyamides of trimethylhexamethylenediamine and terephthalic acid comprises between about 25 wt. % and about 50 wt. %.

3. The polymeric material of claim 1 and wherein the semi-crystalline polymer comprises polyhexamethyleneaidpamide and the secondary material comprises polyamides of trimethylhexamethylenediamine and terephthalic acid.

4. The polymeric material of claim 3 and wherein the polyhexamethyleneaidpamide comprises between about 30 wt. % and about 60 wt. % and the secondary material comprises polyamides of trimethylhexamethylenediamine and terephthalic acid comprising between about 40 wt. % and about 70 wt. %.

5. The polymeric material of claim 3 and further comprising a reinforcing material, and wherein the polymeric material comprises polyhexamethyleneaidpamide wherein the ratio of the polyhexamethyleneaidpamide to the secondary materials of polyamides of trimethylhexamethylenediamine and terephthalic acid is in the range of 2:1 and 4:1 the reinforcing material comprises between about 10 wt. % and about 50 wt. %.

6. The polymeric material of claim 1 and further comprising reinforcing agents or fillers.

7. A polymeric material comprising:
a semi-crystalline polymer comprising polycarpolactum;
a secondary material comprising polyamides of trimethylhexamethylenediamine and terephthalic acid wherein when the secondary material is combined with the semi-crystalline polymer to form a blend having an enthalpy that is between about 2 J/g heat of fusion and about 80% of the heat of fusion of the neat semi-crystalline polymer, as measured by differential scanning calorimetry (DSC) when cooling from a melting temperature to a hot crystalline temperature at a rate of 10° C./min; and
a plasticizer in the range of about 5 wt. % and about 30 wt. % to reduce a glass transition temperature to a range between about 20° C. and about 45° C.

8. The polymeric material of claim 7 and wherein the secondary material comprises an amorphous polymer that is substantially miscible with the semi-crystalline polymer.

9. The polymeric material of claim 7 and wherein the secondary material further comprises irregular monomer configured to break the long range order of the repeat units to hinder formation of crystallites.

10. The polymeric material of claim 7 and wherein the polycarpolactum comprises between about 50 wt. % and about 75 wt. % and wherein the polyamides of trimethylhexamethylenediamine and terephthalic acid comprises between about 25 wt. % and about 50 wt. %.

11. The polymeric material of claim 7 and further comprising reinforcing agents or fillers.

Assignees

• Stratasys Inc

Inventors

• Rodgers Luke M B
• Jaker Vittorio L

Classifications

• B33Y10/00

  Processes of additive manufacturing · CPC title

• B29K2105/0002

  monomers or prepolymers · CPC title

• C08L67/03

  the dicarboxylic acids and dihydroxy compounds having the carboxyl- and the hydroxy groups directly linked to aromatic rings · CPC title

• B29K2071/00

  Use of polyethers {, e.g. PEEK, i.e. polyether-etherketone or PEK, i.e. polyetherketone or derivatives thereof}, as moulding material · CPC title

• B29K2079/085

  Thermoplastic polyimides, e.g. polyesterimides, PEI, i.e. polyetherimides, or polyamideimides; Derivatives thereof · CPC title