Phenolic resin composition and phenolic resin cured product

Patent metadata

Field	Value
Publication number	US-10144823-B2
Application number	US-201515313207-A
Country	US
Kind code	B2
Filing date	May 27, 2015
Priority date	May 30, 2014
Publication date	Dec 4, 2018
Grant date	Dec 4, 2018

Abstract

The phenolic resin composition of the present invention includes a novolac-type phenolic resin, a resorcinol resin, and a curing agent, and is of a solid form. The mixing ratio of the resorcinol resin is preferably more than or equal to 1 part by mass and less than or equal to 100 parts by mass with respect to 100 parts by mass of the novolac-type phenolic resin. The mixing ratio of the curing agent is preferably more than or equal to 5 parts by mass and less than or equal to 25 parts by mass with respect to 100 parts by mass of a total amount of the novolac-type phenolic resin and the resorcinol resin. The phenolic resin cured product is obtained by heat-curing the phenolic resin composition.

First claim

The invention claimed is:

1. A phenolic resin composition comprising a novolac-type phenolic resin, a resorcinol resin, and a curing agent, wherein the phenolic resin composition is in the form of a solid,
wherein the resorcinol resin has a number-average molecular weight of more than or equal to 150 and less than or equal to 10000.

2. The phenolic resin composition according to claim 1 ,
wherein the curing agent includes hexamethylenetetramine.

3. The phenolic resin composition according to claim 1 ,
wherein the mixing ratio of the resorcinol resin is more than or equal to 1 part by mass and less than or equal to 100 parts by mass with respect to 100 parts by mass of the novolac-type phenolic resin.

4. The phenolic resin composition according to claim 1 ,
wherein the mixing ratio of the curing agent is more than or equal to 5 parts by mass and less than or equal to 25 parts by mass with respect to 100 parts by mass of a total amount of the novolac-type phenolic resin and the resorcinol resin.

5. The phenolic resin composition according to claim 1 ,
wherein, when the phenolic resin composition is subjected to compression-molding under the conditions of a temperature of 180° C., a curing time of 3 minutes, and a pressure of 10 MPa, and then subjected to post-curing under the condition of a temperature of 180° C. for 8 hours to give a cured product having a thickness of 4 mm, the cured product has a bending strength measured under a 25° C. atmosphere in accordance with JIS K 6911, of more than or equal to 100 MPa and less than or equal to 300 MPa.

6. The phenolic resin composition according to claim 1 ,
wherein, when the phenolic resin composition is subjected to compression-molding under the conditions of a temperature of 180° C., a curing time of 3 minutes, and a pressure of 10 MPa, and then subjected to post-curing under the condition of a temperature of 180° C. for 8 hours to give a cured product having a thickness of 4 mm, and the cured product is subjected to a heat treatment test at 240° C. for 100 hours,
the variation of bending strength calculated by 100×(R 1 −R 2 )/R 1 is 35% or less, wherein the bending strength of a sheet of the cured product prior to the heat treatment test, as measured in a 25° C. atmosphere in accordance with JIS K 6911, is defined as R 1 , and the bending strength of the sheet of the cured product after the heat treatment test, as measured in a 25° C. atmosphere in accordance with JIS K 6911, is defined as R 2 .

7. The phenolic resin composition according to claim 1 ,
wherein the resorcinol resin is a novolac-type resorcinol resin.

8. The phenolic resin composition according to claim 1 ,
wherein the phenolic resin composition has a melting point of higher than or equal to 50° C. and lower than or equal to 150° C.

9. A phenolic resin cured product obtained by heat-curing the phenolic resin composition according to claim 1 .

Assignees

• Sumitomo Bakelite Co

Inventors

• Harada Naoyuki
• KUNIMI Takao

Classifications

• C08L2205/05

  containing polymer components which can react with one another · CPC title

• C08K5/107

  with polyphenols · CPC title

• C08K5/3477

  Six-membered rings · CPC title

• C08L61/06 Primary

  of aldehydes with phenols · CPC title

• C08L2312/04

  with phenolic resin · CPC title