Peeling Method
US-2015044792-A1 · Feb 12, 2015 · US
Peeling method using separating peeling layer and layer to be peeled
US10141526B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10141526-B2 |
| Application number | US-201615252295-A |
| Country | US |
| Kind code | B2 |
| Filing date | Aug 31, 2016 |
| Priority date | Feb 19, 2014 |
| Publication date | Nov 27, 2018 |
| Grant date | Nov 27, 2018 |
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- Title
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Abstract
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A flexible device is provided. The hardness of a bonding layer of the flexible device is set to be higher than Shore D of 70, or preferably higher than or equal to Shore D of 80. The coefficient of expansion of a flexible substrate of the flexible device is set to be less than 58 ppm/° C., or preferably less than or equal to 30 ppm/° C.
First claim
Opening claim text (preview).
The invention claimed is: 1. A peeling method comprising: a first step of forming a peeling layer over a first substrate, a second step of forming a layer to be peeled over the peeling layer, wherein the layer to be peeled comprises a first layer comprising a region in contact with the peeling layer, a third step of disposing a bonding layer so as to overlap with the peeling layer and the layer to be peeled, wherein the bonding layer is a sheet-like adhesive, a fourth step of curing the bonding layer, a fifth step of removing a first portion comprised in the first layer, wherein the first portion comprises a region overlapping with the peeling layer and the bonding layer, and a sixth step of separating the peeling layer and the layer to be peeled, wherein the bonding layer cured in the fourth step has a portion having hardness higher than Shore D of 70, and wherein, in the fifth step, the first portion is removed by laser light irradiation. 2. The peeling method according to claim 1 , wherein the layer to be peeled comprises an inorganic insulating film. 3. The peeling method according to claim 1 , wherein, in the third step, the peeling layer and the bonding layer overlap with each other so that an end portion of the bonding layer is positioned on an inner side than an end portion of the peeling layer. 4. The peeling method according to claim 1 , wherein the bonding layer cured in the fourth step has a portion having hardness higher than or equal to Shore D of 80. 5. A peeling method comprising: a first step of forming a peeling layer over a first substrate, a second step of forming a layer to be peeled over the peeling layer, wherein the layer to be peeled comprises a first layer comprising a region in contact with the peeling layer, a third step of disposing a bonding layer so as to overlap with the peeling layer and the layer to be peeled, wherein the bonding layer is a sheet-like adhesive, a fourth step of curing the bonding layer, a fifth step of removing a first portion comprised in the first layer, wherein the first portion comprises a region overlapping with the peeling layer and the bonding layer, and a sixth step of separating the peeling layer and the layer to be peeled, and wherein the bonding layer cured in the fourth step has a portion having hardness higher than Shore D of 70. 6. The peeling method according to claim 5 , wherein the layer to be peeled comprises an inorganic insulating film. 7. The peeling method according to claim 5 , wherein, in the third step, the peeling layer and the bonding layer overlap with each other so that an end portion of the bonding layer is positioned on an inner side than an end portion of the peeling layer. 8. The peeling method according to claim 5 , wherein the bonding layer cured in the fourth step has a portion having hardness higher than or equal to Shore D of 80.
Assignees
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Classifications
involving the assembly of discrete sheets or panels only · CPC title
comprising iron or steel {(B32B15/011, B32B15/012 and B32B15/013 take precedence)} · CPC title
comprising glass as the main or only constituent of a layer, next to another layer of a specific {material} · CPC title
using fillers, pigments, thixotroping agents · CPC title
using laser · CPC title
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Frequently asked questions
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- What does patent US10141526B2 cover?
- A flexible device is provided. The hardness of a bonding layer of the flexible device is set to be higher than Shore D of 70, or preferably higher than or equal to Shore D of 80. The coefficient of expansion of a flexible substrate of the flexible device is set to be less than 58 ppm/° C., or preferably less than or equal to 30 ppm/° C.
- Who is the assignee on this patent?
- Semiconductor Energy Lab
- What technology area does this patent fall under?
- Primary CPC classification B32B37/02. Mapped technology areas include Operations & Transport.
- When was this patent published?
- Publication date Tue Nov 27 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).