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US-11981152-B2 · May 14, 2024 · US
Sinterable bonding material and semiconductor device using the same
US10141283B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10141283-B2 |
| Application number | US-201715631223-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jun 23, 2017 |
| Priority date | Dec 26, 2014 |
| Publication date | Nov 27, 2018 |
| Grant date | Nov 27, 2018 |
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- Title
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Abstract
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An objective of the present invention is to provide a sinterable bonding material excellent in sinterability. The present invention relates to a sinterable bonding material comprising a silver filler and an organic base compound as a sintering promoter.
First claim
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The invention claimed is: 1. A sinterable bonding material comprising a silver filler and an organic base compound as a sintering promoter, wherein the silver filler comprises a flake-shaped filler, and wherein the organic base compound is a nitrogen containing hetero ring compound having an amidine moiety and/or a guanidine moiety. 2. The sinterable bonding material according to claim 1 , wherein the pKa of the conjugate acid of the organic base compound is 7.0 or more. 3. The sinterable bonding material according to claim 1 , wherein the organic base compound is at least one selected from the group consisting of substituted or unsubstituted imidazoles, 1,8-diazabicyclo[5.4.0]-7-undecene, and 1,5-diazabicyclo[4.3.0]-5-nonene. 4. The sinterable bonding material according to claim 1 , wherein the silver filler having an arithmetic average roughness (Ra) of 10 nm or less. 5. The sinterable bonding material according to claim 1 , further comprising a solvent. 6. The semiconductor device manufactured by using the sinterable bonding material according to claim 1 . 7. A method for manufacturing a semiconductor device comprising the steps of: providing two members to be bonded; disposing the two members and a bonding material so that surfaces to be bonded of the two members face to each other with the bonding material disposed therebetween; and heating the two members, with the bonding material disposed therebetween to a predetermined temperature, wherein the bonding material is a sinterable bonding material comprising a silver filler and an organic base compound as a sintering promoter, wherein the silver filler comprises a flake-shaped filler, and wherein the organic base compound is a nitrogen containing hetero ring compound having an amidine moiety and/or a guanidine moiety.
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Classifications
Bond pads specially adapted therefor · CPC title
Connecting techniques · CPC title
comprising metals or metalloids, e.g. PbSn, Ag or Cu · CPC title
of die-attach connectors · CPC title
Using a reflow oven · CPC title
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Frequently asked questions
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- What does patent US10141283B2 cover?
- An objective of the present invention is to provide a sinterable bonding material excellent in sinterability. The present invention relates to a sinterable bonding material comprising a silver filler and an organic base compound as a sintering promoter.
- Who is the assignee on this patent?
- Henkel Ag & Co Kgaa, Henkel IP & Holding GmbH
- What technology area does this patent fall under?
- Primary CPC classification B22F1/10. Mapped technology areas include Operations & Transport.
- When was this patent published?
- Publication date Tue Nov 27 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).