Molded intelligent power module and method of making the same

Patent metadata

Field	Value
Publication number	US-10141249-B2
Application number	US-201715699985-A
Country	US
Kind code	B2
Filing date	Sep 8, 2017
Priority date	Oct 16, 2016
Publication date	Nov 27, 2018
Grant date	Nov 27, 2018

Abstract

An intelligent power module (IPM) has a first, second, third and fourth die paddles, a first, second, third, fourth, fifth and sixth metal-oxide-semiconductor field-effect transistors (MOSFETs), a tie bar, a metal slug, a plurality of spacers, a plurality of leads and a molding encapsulation. The molding encapsulation encloses the first, second, third and fourth die paddles, the first, second, third, fourth, fifth and sixth MOSFETs, the tie bar and the plurality of spacers. A bottom surface of the metal slug is exposed from the molding encapsulation. A process for fabricating the IPM comprises preparing the first, second, third and fourth die paddles, the first, second, third, fourth, fifth and sixth MOSFETs, the tie bar, the plurality of leads, the metal slug and the plurality of spacers and applying a molding process to form the molding encapsulation.

First claim

The invention claimed is:

1. An intelligent power module (IPM) for driving a motor, the IPM comprising:
a first, second, third and fourth die paddles;
a first transistor attached to the first die paddle;
a second transistor attached to the second die paddle;
a third transistor attached to the third die paddle;
a fourth, fifth, and sixth transistors attached to the fourth die paddle;
a plurality of leads;
a metal slug;
a plurality of spacers disposed between the metal slug and the first, second, third and fourth die paddles; and
a molding encapsulation enclosing the first, second, third, and fourth die paddles, the first, second, third, fourth, fifth, and sixth transistors and the plurality of spacers;
wherein the plurality of leads are at least partially embedded in the molding encapsulation;
wherein a majority portion of the metal slug is embedded in the molding encapsulation; and
wherein a bottom surface of the metal slug is exposed from the molding encapsulation.

2. The IPM of claim 1 , further comprising
an integrated circuit (IC) enclosed in the molding encapsulation; the IC being electrically connected to the first, second, third, fourth, fifth, and sixth transistors;
wherein the molding encapsulation further encloses the IC.

3. The IPM of claim 1 further comprising
a tie bar having a first end, a second end and a mid-range extension;
a low voltage integrated circuit (IC) attached to the tie bar; the low voltage IC being electrically connected to the first, second and third transistors;
a high voltage IC attached to the tie bar, the high voltage IC being electrically connected to the fourth, fifth, and sixth transistors;
a first, second and third boost diodes;
wherein the molding encapsulation further encloses the low voltage IC, the high voltage IC and the first, second and third boost diodes.

4. The IPM of claim 1 , wherein the plurality of spacers are made of plastics and the metal slug is made of a material selected from the group consisting of copper, aluminum, steel and nickel.

5. The IPM of claim 1 , wherein the plurality of spacers are of cylindrical shapes and a thickness of the plurality of spacers is in a range from 0.2 millimeter to 0.6 millimeter.

6. The IPM of claim 1 , wherein a thickness of the metal slug is larger than one third of a thickness of the molding encapsulation.

7. The IPM of claim 1 further comprising a first, second, third and fourth location pins;
wherein the first location pin is disposed adjacent to a first side of the metal slug;
wherein the second location pin is disposed adjacent to a second side of the metal slug;
wherein the third location pin is disposed adjacent to a third side of the metal slug; and
wherein the fourth location pin is disposed adjacent to a fourth side of the metal slug.

8. The IPM of claim 1 , wherein the metal slug is of a rectangular prism shape.

9. The IPM of claim 8 , wherein the metal slug has a first chamfered recess along a longitudinal direction and a second chamfered recess parallel to the first chamfered recess.

10. The IPM of claim 1 , wherein the plurality of spacers comprises
a first spacer aligned with a first gap between the first die paddle and the second die paddle;
a second spacer aligned with a second gap between the second die paddle and the third die paddle;
a third spacer aligned with a third gap between the third die paddle and the fourth die paddle.

11. The IPM of claim 10 , wherein the plurality of spacers further comprises
a fourth spacer aligned with a first slot of the fourth die paddle; and
a fifth spacer aligned with a second slot of the fourth die paddle.

12. The IPM of claim 1 , wherein the first transistor is a first metal-oxide-semiconductor field-effect transistor (MOSFET);
the second transistor is a second MOSFET;
the third transistor is a third MOSFET;
the fourth transistor is a fourth MOSFET;
the fifth transistor is a fifth MOSFET; and
the sixth transistor is a sixth MOSFET.

Assignees

• Alpha & Omega Semiconductor Cayman Ltd

Inventors

• Niu Zhiqiang
• Suh Bum-Seok
• Cho Wonjin
• Lu Jun

Classifications

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W90/753

  between laterally-adjacent chips · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W72/5525

  comprising copper [Cu] · CPC title

• H10W72/5522

  comprising gold [Au] · CPC title