Heat dissipation structure and device

Patent metadata

Field	Value
Publication number	US-10139170-B2
Application number	US-201615070452-A
Country	US
Kind code	B2
Filing date	Mar 15, 2016
Priority date	Mar 27, 2015
Publication date	Nov 27, 2018
Grant date	Nov 27, 2018

Abstract

According to one embodiment, a heat dissipation structure includes a heat dissipating unit and a heat accumulating unit. The heat dissipating unit includes at least one extending part which extends in a first direction, and is configured to be thermally connected to an apparatus which is configured to produce heat. The heat accumulating unit includes an accommodating unit which is configured to be thermally connected to the extending part, a heat storage material sealed inside the accommodating unit.

First claim

What is claimed is:

1. A heat dissipation structure comprising:
a heat dissipating unit which comprises a plurality of extending parts which extends in a first direction, the heat dissipating unit configured to be thermally connected to an apparatus configured to produce heat; and
a heat accumulating unit comprising a heat storage material and an accommodating unit configured to be thermally connected to the extending parts, the accommodating unit accommodating the heat storage material in a sealed manner, wherein
the extending parts are arranged with gaps in a second direction intersecting with the first direction,
the accommodating unit comprises a plurality of sealing portions and a plurality of intermediate portions, the sealing portions are separated from each other, each of the sealing portions accommodating the heat storage material in a sealed manner, the intermediate portions connecting the sealing portions,
the sealing portions are configured to be disposed in the gaps between the extending parts, respectively, and
the intermediate portions are supported by the extending parts,
wherein each of the extending parts comprises a first end in the first direction and a second end on an opposite side of the first end, the second end positioned closer to the apparatus than to the first end,
wherein a pressing member abuts a first film of the accommodation unit and the first ends abut a second film of the accommodation unit such that the pressing member presses the intermediate portions of the accommodating unit against the first ends.

2. The heat dissipation structure according to claim 1 , wherein the heat storage material is configured to absorb heat accompanying phase transition from solid state to liquid state.

3. The heat dissipation structure according to claim 1 , wherein the accommodating unit is configured to be deformed by flow of the heat storage material in liquid state.

4. The heat dissipation structure according to claim 1 , wherein the length of each of the sealing portions in the second direction is settable to be greater than the length of each of the gaps between the plurality of extending parts in the second direction.

5. The heat dissipation structure according to claim 4 , wherein the pressing member is configured to press the heat accumulating unit so that the accommodating unit is pressed against the plurality of extending parts.

6. The heat dissipation structure according to claim 5 , wherein the pressing member is configured to press the sealing portions toward inside of the gaps between the plurality of extending parts.

7. The heat dissipation structure according to claim 5 , wherein the pressing member is configured to elastically press the heat accumulating unit.

8. The heat dissipation structure according to claim 5 further comprising a housing which accommodates the heat dissipating unit and the heat accumulating unit, wherein
the housing comprises the pressing member.

9. The heat dissipation structure according to claim 1 , wherein each of the extending parts comprises a first area which is configured to be covered by the accommodating unit and a second area which is configured to be exposed.

10. The heat dissipation structure according to claim 1 , wherein the accommodating unit is configured to be thermally connected to the extending parts at a position closer to the first ends than to the second ends.

11. The heat dissipation structure according to claim 10 , wherein each of the intermediate portions is supported by the respective first ends.

12. The heat dissipation structure according to claim 1 , wherein the heat accumulating unit provided with a portion inside the accommodating unit in which the heat storage material in liquid state is flowable.

13. The heat dissipation structure according to claim 1 , wherein the accommodating unit comprises a film-like shape.

14. A device comprising:
the apparatus configured to produce heat; and
the heat dissipation structure according to claim 1 .

Assignees

• Toshiba Kk

Inventors

• Hongo Takuya

Classifications

• H10W40/43

  by flowing gases, e.g. forced air cooling · CPC title

• H10W40/735

  by melting or evaporation of solids · CPC title

• H10W40/037

  Assembling together parts thereof · CPC title

• H10W40/10

  Arrangements for heating · CPC title

• Y02E60/145

  Cross-Sectional Technologies · mapped topic