Low application temperature hot melt adhesive

Patent metadata

Field	Value
Publication number	US-10138398-B2
Application number	US-201815879903-A
Country	US
Kind code	B2
Filing date	Jan 25, 2018
Priority date	Aug 20, 2009
Publication date	Nov 27, 2018
Grant date	Nov 27, 2018

Abstract

The invention relates to a low application temperature hot melt adhesive. More specifically, the low application temperature hot melt adhesive comprises olefin copolymers with an average Melt Index greater than 5 but less than about 35 g/10 minutes at 190° C. The adhesive is particularly useful in the construction of nonwoven articles.

First claim

We claim:

1. A low application temperature hot melt adhesive comprising:
(a) at least about 5 wt % to about 25 wt % of an olefin block copolymer, wherein having an average Melt Index range of greater than 5 and less than about 35 g/10 minutes at 190° C.;
(b) from about 40 to about 70 wt % of a tackifier;
(c) from about 0.5 to about 5 wt % a wax;
(d) from about 1 to about 30 wt % of a plasticizer diluent; and
(e) from 0 to about 5 wt % of an optional component;
wherein the adhesive has a viscosity of below about 11,000 centipoises at 120° C., a yield stress (12 in/min extensional rate) range of from about 7 to about 50 psi at 25° C., and a cross-over temperature (when G″=G′) greater than about 70° C.; and
wherein the sum of the total wt % of the adhesive equals to 100.

2. The low application temperature hot melt adhesive of claim 1 , further comprising up to about 50 wt % of an additional polymer, wherein the additional polymer is selected from the group consisting of hydrogenated styrene block copolymers, amorphous poly-α-olefins and olefin copolymer with an average Melt Index of greater than about 35 g/10 minutes at 190° C.

3. The low application temperature hot melt adhesive of claim 1 , wherein the olefin block copolymer is an ethyelen and at least one C3 to C20 alpha-olefin comonomer.

4. The low application temperature hot melt adhesive of claim 3 , wherein the alpha-olefin comonomer propylene, butene or octane.

5. The low application temperature hot melt adhesive of claim 1 , wherein the tackifier is selected from polyterpenes, aliphatic resins, cycloaliphatic resins, aliphatic/aromatic, cycloaliphatic/aromatic, natural and modified rosin esters, and mixtures thereof.

6. The low application temperature hot melt adhesive of claim 1 , wherein the optional component is selected from an antioxidant, a filler, a pigment, a flow modifier, a dyestuff and mixtures thereof.

7. A low application temperature hot melt adhesive comprising:
(a) at least about 5 wt % to about 25 wt % of an olefin random copolymer, wherein having an average Melt Index range of greater than 5 and less than about 35 g/10 minutes at 190° C.;
(b) from about 40 to about 70 wt % of a tackifier;
(c) from about 0.5 to about 5 wt % a wax;
(d) from about 1 to about 30 wt % of a plasticizer diluent; and
(e) from 0 to about 5 wt % of an optional component;
wherein the adhesive has a viscosity of below about 11,000 centipoises at 120° C., a yield stress (12 in/min extensional rate) range of from about 7 to about 50 psi at 25° C., and a cross-over temperature (when G″=G′) greater than about 70° C.; and
wherein the sum of the total wt % of the adhesive equals to 100.

8. The low application temperature hot melt adhesive of claim 7 , further comprising up to about 50 wt % of an additional polymer, wherein the additional polymer is selected from the group consisting of hydrogenated styrene block copolymers, amorphous poly-α-olefins and olefin copolymer with an average Melt Index of greater than about 35 g/10 minutes at 190° C.

9. The low application temperature hot melt adhesive of claim 7 , wherein the olefin random copolymer is an ethylene and at least one C3 to C20 alpha-olefin comonomer.

10. The low application temperature hot melt adhesive of claim 9 , wherein the alpha-olefin comonomer propylene, butene or octane.

11. The low application temperature hot melt adhesive of claim 7 , wherein the tackifier is selected from polyterpenes, aliphatic resins, cycloaliphatic resins, aliphatic/aromatic, cycloaliphatic/aromatic, natural and modified rosin esters, and mixtures thereof.

12. The low application temperature hot melt adhesive of claim 7 , wherein the optional component is selected from an antioxidant, a filler, a pigment, a flow modifier, a dyestuff and mixtures thereof.

13. An article comprising a substrate and the low application temperature hot melt adhesive of claim 1 .

14. An article comprising a substrate and the low application temperature hot melt adhesive of claim 7 .

Assignees

• Henkel IP & Holding GmbH

Inventors

• Hu Yuhong
• Xenidou Maria
• Pollock-Downer Alethea
• Sharak Matthew
• Dejesus Maria Cristina Barbosa

Classifications

• C09J123/20

  having four to nine carbon atoms · CPC title

• C09J153/00

  Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers · CPC title

• C08L2666/02

  Organic macromolecular compounds, natural resins, waxes or and bituminous materials · CPC title

• C09J5/00

  Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers · CPC title

• C09J123/0815 Primary

  Copolymers of ethene with aliphatic 1-olefins · CPC title