Systems, compositions, and methods for enhanced electromagnetic shielding and corrosion resistance
US-11965116-B2 · Apr 23, 2024 · US
US10138382B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10138382-B2 |
| Application number | US-201515321304-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jul 24, 2015 |
| Priority date | Jul 25, 2014 |
| Publication date | Nov 27, 2018 |
| Grant date | Nov 27, 2018 |
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The present invention relates to a composition comprising i) particles comprising a conductive polymer, ii) metal nanowires, and iii) at least one solvent, wherein at least one of the following conditions is satisfied: α1) the particles comprising the conductive polymer are characterized by a weight average particle diameter of less than 100 nm; α2) the content of cations of the metal on which the metal nanowires ii) are based is below 500 ppm, based on the total weight of the composition; α3) the composition comprises, in addition to component iii), at least one high-boiling solvent that is miscible with the at least one solvent iii) and that has a boiling point (determined at 1013 mbar) of more than 100° C.
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The invention claimed is: 1. A composition comprising i) particles comprising a conductive polymer, wherein the particles comprising the conductive polymer comprise a complex of poly(3,4-ethylenedioxythiophene) and polystyrene sulfonic acid (PEDOT:PSS), ii) metal nanowires, and iii) at least one solvent, wherein each of the following conditions are satisfied: α1) the particles comprising the conductive polymer are characterized by a weight average particle diameter of less than 60 nm; α2) the content of cations of the metal on which the metal nanowires ii) are based is below 500 ppm, based on the total weight of the composition; and α3) the composition comprises, in addition to component iii), at least one high-boiling solvent that is miscible with the at least one solvent iii) and that has a boiling point (determined at 1013 mbar) of more than 100° C. 2. The composition according to claim 1 , wherein the composition comprises at least 50 wt.-% of water as the at least one solvent iii) and at least 1 wt.-% of the at least one high-boiling solvent that is miscible with water and that has a boiling point (determined at 1013 mbar) of more than 100° C. 3. The composition according to claim 2 , wherein the high-boiling solvent that is miscible with water and that has a boiling point (determined at 1013 mbar) of more than 100° C. is DMSO. 4. The composition according to claim 1 , wherein the composition further comprises iv) at least one surfactant. 5. The composition according to claim 1 , wherein the metal on which the metal nanowires ii) are based is selected from the group consisting of silver, copper, gold and platinum. 6. The composition according to claim 1 , wherein the metal nanowires ii) have an aspect ratio of at least 10:1. 7. The composition according to claim 1 , wherein the composition comprises the particles of the conductive polymer i) and the metal nanowires ii) in such a relative amount that the weight ratio of metal contained in the metal nanowires:conductive polymer in the composition is in a range of from 10:1 to 1:10. 8. The composition according to claim 1 , wherein the metal nanowires ii) are silver nanowires and wherein the content of silver cations in the composition is below 100 ppm, based on the total weight of the composition. 9. A process for the production of a layered body, comprising the process steps: I) providing a substrate; II) applying a composition according to claim 1 onto the substrate; III) partially removing at least one solvent iii) from the composition to obtain a layered body comprising an electrically conductive layer coated onto the substrate.
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