Resin composition and cured product thereof

Patent metadata

Field	Value
Publication number	US-10138348-B2
Application number	US-201415123020-A
Country	US
Kind code	B2
Filing date	Nov 6, 2014
Priority date	Mar 14, 2014
Publication date	Nov 27, 2018
Grant date	Nov 27, 2018

Abstract

The present invention provides a resin composition which can be cured in a short time without a heat load on an adherend and with which a cured product having stable quality can be obtained. The resin composition in accordance with the present invention contains (i) a bisphenol A epoxy resin, (ii) an encapsulated curing agent including a core that contains a curing agent and a shell that covers the core, (iii) a filler, and (iv) a color material.

First claim

The invention claimed is:

1. A resin composition comprising:
a bisphenol A epoxy resin;
an encapsulated curing agent including a core that contains a curing agent and a shell that covers the core;
a filler; and
a color material,
the filler having a light-transmitting property and being one or more selected from the group consisting of fused silica, crystalline silica, and glass beads,
the bisphenol A epoxy resin being one or more selected from the group consisting of bisphenol A diglycidyl ether, hydrogenated bisphenol A diglycidyl ether, and tetrabromobisphenol A diglycidyl ether,

the filler being contained in an amount that is not less than 10 parts by weight and not more than 70 parts by weight relative to 100 parts by weight of the bisphenol A epoxy resin,
the color material being carbon black,
the color material being contained in an amount that is not less than 5 parts by weight and not more than 7 parts by weight relative to 100 parts by weight of the bisphenol A epoxy resin.

2. The resin composition as set forth in claim 1 , wherein:
the core contains one or more curing agents selected from the group consisting of an amine compound, an imidazole compound, and a thiol compound.

3. The resin composition as set forth in claim 1 , further comprising:
one or more curing assistant agents selected from the group consisting of an amine compound, an imidazole compound, a thiol compound, an acid anhydride compound, and a thermal acid generating agent.

4. A cured product of a resin composition recited in claim 1 , said cured product comprising two or more layers,
an outermost surface layer among the two or more layers containing a cured product of the bisphenol A epoxy resin as a main component.

Assignees

• Omron Tateisi Electronics Co

Inventors

• Nakajima Seiji
• Tatsuno Yosuke
• Ito Mitsuo
• Hirono Satoshi
• Morisaki Yuzo
• Kawamoto Junji

Classifications

• C08G59/245

  aromatic · CPC title

• C08J2363/02

  Polyglycidyl ethers of bis-phenols · CPC title

• C08K3/36 Primary

  Silica · CPC title

• C08G59/188

  using encapsulated compounds · CPC title

• C08L67/02

  Polyesters derived from dicarboxylic acids and dihydroxy compounds (C08L67/06 takes precedence) · CPC title