Matrix type integrated circuit with fault isolation capability
US-9947712-B2 · Apr 17, 2018 · US
US10138005B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10138005-B2 |
| Application number | US-201514982324-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 29, 2015 |
| Priority date | Jun 16, 2011 |
| Publication date | Nov 27, 2018 |
| Grant date | Nov 27, 2018 |
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Methods and systems may provide for a structure having a plurality of interconnected panels, wherein each panel has a plurality of detection layers separated from one another by one or more non-detection layers. The plurality of detection layers may form a grid of conductive traces. Additionally, a monitor may be coupled to each grid of conductive traces, wherein the monitor is configured to detect damage to the plurality of interconnected panels in response to an electrical property change with respect to one or more of the conductive traces. In one example, the structure is part of an inflatable space platform such as a spacecraft or habitat.
Opening claim text (preview).
We claim: 1. A method comprising: transmitting a test signal to a plurality of interconnected panels, wherein each panel has a plurality of detection layers that form a grid of conductive traces and wherein each detection layer includes one or more known defect traces, and wherein the panel has a trace continuity signature that is defined by the known defect traces of the detection layers in the panel; and identifying one or more damage zones in the plurality of interconnected panels based on a response of the grid of conductive traces to the test signal and trace continuity signature information associated with the plurality of interconnected panels. 2. The method of claim 1 , further including using the response of the grid of conductive traces and the trace continuity signature information to identify a panel corresponding to each damage zone. 3. The method of claim 2 , further including: generating a damaged trace identifier for each damaged trace in the grid of conductive traces, wherein the damaged trace identifier includes a corresponding panel identifier; and storing each damaged trace identifier to non-volatile memory. 4. The method of claim 1 , wherein identifying the one or more damage zones includes: sorting a plurality of damaged trace identifiers to obtain a set of sorted identifiers; grouping the set of sorted identifiers to obtain a set of grouped identifiers; identifying one or more damaged detection layers based on the set of grouped identifiers; normalizing the set of grouped identifiers; determining a damaged trace identifier-to-trace identifier spacing for the set of grouped identifiers; and determining one or more damage zone sizes based on the damaged trace identifier-to-trace identifier spacing. 5. The method of claim 4 , further including modifying at least one of the one or more damage zone sizes based on the trace continuity signature information. 6. The method of claim 1 , further including resolving a defect analysis state based on the one or more zones. 7. The method of claim 6 , wherein the defect analysis state includes one of a top layer only damage state, a top two layer damage state, a top three layer damage state, and a four layer damage state. 8. The method of claim 6 , further including forming one or more coordinate pairs based on the defect analysis state and the response of the grid of conductive traces. 9. The method of claim 8 , further including populating a damage attributes cluster array with the one or more coordinate pairs. 10. The method of claim 1 , further including using the trace continuity signature information to distinguish between a plurality of damage zones. 11. The method of claim 1 , wherein the trace continuity signature information identifies a plurality of known defect traces in the grid of conductive traces. 12. The method of claim 1 , wherein the test signal includes a binary pattern.
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